Advanced cooling method and device for LED lighting
View Patent ↗A light emitting diode cooling device and method are disclosed for passively removing heat from the LED using liquid convection to cool the LED. The liquid convection cooling device operates to cool the LED by circulating a liquid cooling medium without consuming external power to move the medium.
1. A method for passively cooling at least one light-emitting diode (LED) (i) having an LED die that generates light and heat when electrical power is applied to the LED and (ii) being mounted on an exterior surface of a wall of a heat exchange medium container having an inner cavity volume at least partially filled with a liquid heat exchange medium (a) sealed within the heat exchange medium container and (b) in contact with a heat-receiving portion of the wall within the inner cavity volume opposite the LED, the method comprising:
applying electrical power to the LED to operate the LED, whereby heat generated by the LED during operation is received through the wall by the liquid heat exchange medium and drawn away via convection without pumping or consumption of external power to move the liquid heat exchange medium,
wherein the heat exchange medium container is configured to have a portion of the inner cavity volume disposed above the LED regardless of the physical orientation of the heat exchange medium container.
2. A method for passively cooling at least one light-emitting diode (LED) (i) having an LED die that generates light and heat when electrical power is applied to the LED and (ii) being mounted on an exterior surface of a wall of a heat exchange medium container having an inner cavity volume at least partially filled with a liquid heat exchange medium (a) sealed within the heat exchange medium container and (b) in contact with a heat-receiving portion of the wall within the inner cavity volume opposite the LED, the method comprising:
applying electrical power to the LED to operate the LED, whereby heat generated by the LED during operation is received through the wall by the liquid heat exchange medium and drawn away via convection without pumping or consumption of external power to move the liquid heat exchange medium,
wherein the heat exchange medium container comprises a center section and, protruding therefrom, a plurality of hollow leg sections that promote heat exchange between the heat exchange medium container and ambient air.
3. The method of claim 2 , wherein the heat exchange medium container is configured to have a portion of the inner cavity volume disposed above the LED regardless of the physical orientation of the heat exchange medium container.
4. The method of claim 1 , wherein at least a portion of the heat exchange medium container is configured to receive and reflect light from the LED.
5. The method of claim 1 , wherein the liquid heat exchange medium comprises a mineral oil.
6. The method of claim 1 , wherein the liquid heat exchange medium comprises a silicon-based oil.
7. The method of claim 1 , wherein the liquid heat exchange medium comprises metal particles for increasing a heat capacity of the liquid heat exchange medium.
8. The method of claim 7 , wherein the metal particles are embedded in a buoyant material.
9. The method of claim 8 , wherein the buoyant material comprises plastic.
10. The method of claim 1 , wherein (i) a compressible element and the liquid heat exchange medium substantially completely fill the inner cavity volume, the compressible element being at least partially surrounded by the liquid heat exchange medium, and (ii) during operation of the LED, a volume of at least a portion of the liquid heat exchange medium expands in response to increased temperature and compresses the compressible element disposed within the inner cavity volume, the compressible element remaining disposed within the inner cavity volume thereduring.
11. A light-emitting diode (LED) passive cooling device comprising:
a heat exchange medium container having a wall defining an exterior surface and enclosing an inner cavity volume;
mounted on the exterior surface of the heat exchange medium container opposite a heat-receiving portion of the wall within the inner cavity volume, an LED having an LED die that generates light and heat when electrical power is applied to the LED; and
sealed within and at least partially filling the inner cavity volume, and in contact with the heat-receiving portion of the wall, a liquid heat exchange medium for receiving heat from the LED and drawing away the heat via convection without pumping or consumption of external power to move the liquid heat exchange medium,
wherein the heat exchange medium container is configured to have a portion of the inner cavity volume disposed above the LED regardless of the physical orientation of the heat exchange medium container.
12. A light-emitting diode (LED) passive cooling device comprising:
a heat exchange medium container having a wall defining an exterior surface and enclosing an inner cavity volume;
mounted on the exterior surface of the heat exchange medium container opposite a heat-receiving portion of the wall within the inner cavity volume, an LED having an LED die that generates light and heat when electrical power is applied to the LED; and
sealed within and at least partially filling the inner cavity volume, and in contact with the heat-receiving portion of the wall, a liquid heat exchange medium for receiving heat from the LED and drawing away the heat via convection without pumping or consumption of external power to move the liquid heat exchange medium,
wherein (i) heat exchange medium container comprises a center section and, protruding therefrom, at least four hollow leg sections that promote heat exchange between the heat exchange medium container and ambient air, (ii) the LED is mounted on the center section, and (iii) the hollow leg sections terminate away from the center section and are fluidly connected only at the center section.
13. The LED cooling device of claim 12 , wherein the heat exchange medium container is configured to have a portion of the inner cavity volume disposed above the LED regardless of the physical orientation of the heat exchange medium container.
14. The LED cooling device of claim 11 , wherein at least a portion of the heat exchange medium container is configured to receive and reflect light from the LED.
15. The LED cooling device of claim 11 , wherein the liquid heat exchange medium comprises a mineral oil.
16. The LED cooling device of claim 11 , wherein the liquid heat exchange medium comprises a silicon-based oil.
17. The LED cooling device of claim 11 , wherein the liquid heat exchange medium comprises metal particles for increasing a heat capacity of the liquid heat exchange medium.
18. The LED cooling device of claim 17 , wherein the metal particles are embedded in a buoyant material.
19. The LED cooling device of claim 18 , wherein the buoyant material is plastic.
20. The LED cooling device of claim 11 , further comprising, disposed within the inner cavity volume and at least partially surrounded by the liquid heat exchange medium, a compressible element (i) compressible to accommodate volumetric expansion of the liquid heat exchange medium and (ii) configured to remain within the inner cavity volume during compression thereof.
21. A light-emitting diode (LED) passive cooling device comprising:
a heat exchange medium container having a wall defining an exterior surface and enclosing an inner cavity volume;
mounted on the exterior surface of the heat exchange medium container opposite a heat-receiving portion of the wall within the inner cavity volume, an LED having an LED die that generates light and heat when electrical power is applied to the LED; and
sealed within and at least partially filling the inner cavity volume, and in contact with the heat-receiving portion of the wall, a liquid heat exchange medium for receiving heat from the LED and drawing away the heat via convection without pumping or consumption of external power to move the liquid heat exchange medium,
wherein (i) heat exchange medium container comprises a center section upon which the LED is disposed and (ii) the inner cavity volume defines a portion of a conical volume partially surrounding the LED and extending from the center section.
22. The LED cooling device of claim 11 , wherein the exterior surface of the heat exchange medium container defines an approximately rectilinear shape, the LED being mounted on a portion of the exterior surface depressed within the approximately rectilinear shape.
23. The method of claim 2 , wherein at least a portion of the heat exchange medium container is configured to receive and reflect light from the LED.
24. The method of claim 2 , wherein the liquid heat exchange medium comprises a mineral oil.
25. The method of claim 2 , wherein the liquid heat exchange medium comprises a silicon-based oil.
26. The method of claim 2 , wherein the liquid heat exchange medium comprises metal particles for increasing a heat capacity of the liquid heat exchange medium.
27. The method of claim 26 , wherein the metal particles are embedded in a buoyant material.
28. The method of claim 27 , wherein the buoyant material comprises plastic.
29. The method of claim 2 , wherein (i) a compressible element and the liquid heat exchange medium substantially completely fill the inner cavity volume, the compressible element being at least partially surrounded by the liquid heat exchange medium, and (ii) during operation of the LED, a volume of at least a portion of the liquid heat exchange medium expands in response to increased temperature and compresses the compressible element disposed within the inner cavity volume, the compressible element remaining disposed within the inner cavity volume thereduring.
30. The LED cooling device of claim 12 , wherein at least a portion of the heat exchange medium container is configured to receive and reflect light from the LED.
31. The LED cooling device of claim 12 , wherein the liquid heat exchange medium comprises a mineral oil.
32. The LED cooling device of claim 12 , wherein the liquid heat exchange medium comprises a silicon-based oil.
33. The LED cooling device of claim 12 , wherein the liquid heat exchange medium comprises metal particles for increasing a heat capacity of the liquid heat exchange medium.
34. The LED cooling device of claim 33 , wherein the metal particles are embedded in a buoyant material.
35. The LED cooling device of claim 34 , wherein the buoyant material is plastic.
36. The LED cooling device of claim 12 , further comprising, disposed within the inner cavity volume and at least partially surrounded by the liquid heat exchange medium, a compressible element (i) compressible to accommodate volumetric expansion of the liquid heat exchange medium and (ii) configured to remain within the inner cavity volume during compression thereof.
37. The LED cooling device of claim 21 , wherein the heat exchange medium container is configured to have a portion of the inner cavity volume disposed above the LED regardless of the physical orientation of the heat exchange medium container.
38. The LED cooling device of claim 21 , wherein at least a portion of the heat exchange medium container is configured to receive and reflect light from the LED.
39. The LED cooling device of claim 21 , wherein the liquid heat exchange medium comprises a mineral oil.
40. The LED cooling device of claim 21 , wherein the liquid heat exchange medium comprises a silicon-based oil.
41. The LED cooling device of claim 21 , wherein the liquid heat exchange medium comprises metal particles for increasing a heat capacity of the liquid heat exchange medium.
42. The LED cooling device of claim 41 , wherein the metal particles are embedded in a buoyant material.
43. The LED cooling device of claim 42 , wherein the buoyant material is plastic.
44. The LED cooling device of claim 21 , further comprising, disposed within the inner cavity volume and at least partially surrounded by the liquid heat exchange medium, a compressible element (i) compressible to accommodate volumetric expansion of the liquid heat exchange medium and (ii) configured to remain within the inner cavity volume during compression thereof.