Electronic device, electronic apparatus, and method of manufacturing electronic device
An electronic device has a vibrating element and a package accommodating the vibrating element. Moreover, the package has through-electrodes formed to penetrate a base substrate in its thickness direction and electrically connected with connection terminals, and electrically conductive adhesives (covering members) formed above the connection terminals so as to contain the through-electrodes.
1. An electronic device comprising:
an electronic component;
a base substrate comprising the electronic component fixed above one of surface sides;
a lid portion bonded to the base substrate so as to cover the electronic component;
a connection terminal formed above a surface of the base substrate above the electronic component side and electrically connected with the electronic component;
a through-electrode formed to penetrate the base substrate in a thickness direction thereof and electrically connected with the connection terminal, wherein the through-electrode is formed in a through-hole of the base substrate; and
a covering member formed above the connection terminal so as to contain the through-electrode in plan view of the base substrate, wherein the covering member completely covers the through-electrode and through-hole of the base substrate in plan view.
2. The electronic device according to claim 1 , wherein
the covering member further covers at least a portion of a side surface of the connection terminal.
3. The electronic device according to claim 2 , wherein
the covering member covers at least a side surface of the connection terminal, where a spaced-apart distance between the side surface and the through-electrode is shortest.
4. The electronic device according to claim 1 , wherein
the electronic component is fixed to the base substrate via the covering member.
5. The electronic device according to claim 4 , wherein
the connection terminal and the electronic component are electrically connected via the covering member having electrical conductivity.
6. The electronic device according to claim 4 , further comprising a wire electrically connecting the connection terminal with the electronic component.
7. An electronic apparatus comprising the electronic device according to claim 1 .
8. An electronic apparatus comprising the electronic device according to claim 2 .
9. A method of manufacturing an electronic device, comprising:
preparing a base substrate formed with a connection terminal and a through-electrode that penetrates in a thickness direction and is electrically connected with the connection terminal, wherein the through-electrode penetrates through a through-hole formed in the base substrate;
arranging a covering member on the connection terminal;
fixing an electronic component above the base substrate via the covering member; and
bonding a lid portion to the base substrate so as to cover the electronic component, wherein
in the fixing of the electronic component on the base substrate, the covering member contains an end of the through-electrode on the connection terminal side in plan view of the base substrate and the covering member completely covers the through-electrode and through-hole of the base substrate in plan view.