Supporter for Use During the Overmolding of a Light Engine

1 . A supporter for a printed circuit board to be included in an LED light engine, said supporter comprising:

a top surface, a central portion and a bottom surface;

said top surface including mechanical placement means for positioning the printed circuit board;

said central portion including a channel for the placement of wires which supply electrical energy to the printed circuit board;

said central portion also including force spreading columns constructed and arranged to apply pressure to the bottom of the printed circuit board;

said bottom surface including a contact area for receiving pressure from a mold section during the overmolding of the LED light engine.

2 . The supporter as defined in claim 1 wherein said mechanical placement means includes a plurality of projections extending outwardly from said top surface.

3 . The supporter as defined in claim 2 wherein said plurality of projections includes at least one pin and at least one second projection selected from a group including a pin and a tab.

4 . The supporter as defined in claim 1 wherein said force spreading columns have a greater surface area at the portion which contacts the printed circuit board than at the portion which contacts the mold section.

5 . The supporter as defined in claim 1 further including a screw hole extending between said top surface and said bottom surface.

6 . The supporter as defined in claim 5 wherein said screw hole has an outer wall section with a plurality of ribs formed thereon.

7 . A light engine comprising:

a printed circuit board having at least one LED mounted thereon, said printed circuit board including the electrical componentry necessary to transform electrical energy into a form usable by said at least one LED, said printed circuit board further being electrically connected to insulated wires supplying said electrical energy to said electrical componentry;

a printed circuit board supporter, said printed circuit board supporter including:

a top surface, a central portion and a bottom surface;

said top surface including mechanical placement means for positioning said printed circuit board;

said central portion including a channel for the placement of insulated wires which supply electrical energy to said printed circuit board;

said central portion also including force spreading columns constructed and arranged to apply pressure to the bottom of said printed circuit board;

said bottom surface including a contact area for receiving pressure from a mold section during the overmolding of the light engine;

overmolded material to hold the light engine together and protect said printed circuit board.

8 . The light engine as defined in claim 7 further including an LED cover member or an LED lens member constructed and arranged for placement over said at least one LED.

9 . The light engine as defined in claim 8 wherein said mechanical placement means includes a plurality of projections extending outwardly from said top surface.

10 . The light engine as defined in claim 8 wherein said plurality of projections includes at least one pin and at least one second projection selected from a group including a pin and a tab.

11 . The light engine as defined in claim 8 wherein said force spreading columns in said printed circuit board supporter have a greater surface area at the portion which contacts the printed circuit board than at the portion which contacts the mold section.

12 . The light engine as defined in claim 8 further including a screw hole extending between said top surface and said bottom surface.

13 . The light engine as defined in claim 12 wherein said screw hole has an outer wall with a plurality of ribs formed thereon.

14 . The light engine as defined in claim 8 wherein said overmolded material is a plastic which melts together with the insulation on said insulated wire during the molding process and forms a chemical bond with said printed circuit board supporter, and a seal with either said LED cover member or said LED lens member.

15 . A process for manufacturing a light engine comprising:

placing the cover portion of an LED cover member into sockets located in a mold bottom;

affixing a printed circuit board with at least one LED mounted thereon and insulated wires attached thereto to a printed circuit board supporter;

placing the combination of said printed circuit with at least one LED mounted thereon and said printed circuit board supporter onto said LED cover member so that said at least one LED is located within said LED cover portion of said LED cover member;

placing a mold top onto said mold bottom;

injecting sealant material into spaces between said mold top and said mold bottom not occupied by said printed circuit board, said printed circuit board supporter and said LED cover member;

separating said mold top from said mold bottom;

removing said printed circuit board, said printed circuit board supporter and said lens member now partially enclosed by said sealant material from between said mold top and said mold bottom.

16 . The process as defined in claim 15 wherein said printed circuit board supporter includes:

a top surface, a central portion and a bottom surface;

said top surface including mechanical placement means for positioning said printed circuit board;

said central portion including a channel for the placement of insulated wires which supply electrical energy to said printed circuit board;

said central portion further including force spreading columns constructed and arranged to apply pressure to the bottom of the printed circuit board;

said bottom surface including a contact area for receiving pressure from said mold top during the overmolding of the LED light engine.

17 . The process as defined in claim 16 wherein said sealant material forms a chemical bond with said printed circuit board supporter.

18 . A light engine made according to the process as defined in claim 16 .

19 . A process for manufacturing a light engine comprising:

placing the lens portion of an LED lens member into sockets located in a mold bottom;

affixing a printed circuit board with at least one LED mounted thereon and insulated wires attached thereto to a printed circuit board supporter;

placing the combination of said printed circuit with at least one LED mounted thereon and said printed circuit board supporter onto said LED lens member so that said at least one LED is located within said lens portion of said LED lens member;

placing a mold top onto said mold bottom;

injecting sealant material into spaces between said mold top and said mold bottom not occupied by said printed circuit board, said printed circuit board supporter and said LED lens member;

separating said mold top from said mold bottom;

removing said printed circuit board, said printed circuit board supporter and said lens member now partially enclosed by said sealant material from between said mold top and said mold bottom.

20 . The process as defined in claim 19 wherein said printed circuit board supporter includes:

a top surface, a central portion and a bottom surface;

said top surface including mechanical placement means for positioning said printed circuit board;

said central portion including a channel for the placement of insulated wires which supply electrical energy to said printed circuit board;

said central portion further including force spreading columns constructed and arranged to apply pressure to the bottom of the printed circuit board;

said bottom surface including a contact area for receiving pressure from said mold top during the overmolding of the LED light engine.

21 . A process for overmolding the components of a light engine comprising:

placing a flexible web member on a mold bottom;

affixing a printed circuit board with at least one LED mounted thereon and insulated wires attached thereto to a printed circuit board supporter;

said printed circuit board supporter including:

a top surface, a central portion and a bottom surface;

said top surface including mechanical placement means for positioning said printed circuit board;

said central portion including a channel for the placement of wires which supply electrical energy to said printed circuit board;

said central portion further including force spreading columns constructed and arranged to apply pressure to the bottom of the printed circuit board;

said bottom surface including a contact area for receiving pressure from said mold top during the overmolding of the LED light engine;

placing the combination of said printed circuit with at least one LED mounted thereon and said printed circuit board supporter onto said flexible web member so that said at least one LED is located within a hole in said flexible web member;

injecting sealant material into spaces between said mold top and said mold bottom not occupied by said printed circuit board, said printed circuit board supporter and said flexible web member;

separating said mold top from said mold bottom;

removing said printed circuit board, said printed circuit board supporter and said flexible web member now partially enclosed by said sealant material from between said mold top and said mold bottom.