Optoelectronic package and method for making same
View Patent ↗An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.
1. An optoelectronic package comprising:
a substrate;
a cover element bonded onto the substrate, the cover element defining a cavity for accommodating semiconductor chips and optoelectronic components; wherein:
the cover element comprises a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive; and
the engagement of the cover element and the substrate defines a second adhesive bonding area, the second adhesive bonding area being configured for receiving a second adhesive and confining the second adhesive within a localized area;
wherein the cover element comprises two thinned-down recess regions formed at two opposite sides of the cover element respectively, the engagement of the two thinned-down recess regions and the substrate defining the second adhesive bonding area; the second adhesive bonding area comprises a floor defined by the substrate and side walls defined by the two thinned-down recess regions; and
wherein a through hole is formed within each of the thinned-down recess regions; and
wherein the second adhesive fills in the through hole to further bond the substrate and cover element.
2. An optoelectronic package comprising:
a substrate;
a cover element bonded onto the substrate, the cover element defining a cavity for accommodating semiconductor chips and optoelectronic components, and comprising functional features aligned with the optoelectronic components; wherein:
the cover element comprises a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive; and
the engagement of the cover element and the substrate defines a second adhesive bonding area, the second adhesive bonding area being configured for receiving a second adhesive and confining the second adhesive within a localized area;
wherein the cover element comprises two steps defining two cutout recess regions formed at two opposite sides of the cover element respectively, the engagement of the two steps and the substrate defining the second adhesive bonding area; and the second adhesive bonding area comprises a floor defined by the substrate and side walls defined by the two steps.