SILICON SUBSTRATE MEMS DEVICE
A MEMS device includes a silicon substrate. The silicon substrate includes a plurality of dielectric material grooves spaced apart from each other. The silicon substrate also includes a through hole with a portion of the through hole being located between the plurality of dielectric material grooves when viewed from a direction perpendicular to a surface of the silicon substrate.
1 . A MEMS device comprising:
a silicon substrate including a surface, the silicon substrate including a plurality of dielectric material grooves spaced apart from each other, the silicon substrate including a through hole, a portion of the through hole being located between the plurality of dielectric material grooves when viewed from a direction perpendicular to the surface of the silicon substrate.
2 . The device of claim 1 , wherein the through hole includes a dimension of interest, the dimension of interest being smaller than the spacing between the plurality of dielectric material grooves when viewed from a direction perpendicular to the surface of the silicon substrate.
3 . The device of claim 2 , wherein the through hole is aligned with respect to the plurality of dielectric material grooves.
4 . The device of claim 1 , wherein the plurality of dielectric material grooves are distinct portions of a continuous groove.
5 . The device of claim 4 , wherein the continuous groove has one of a rectangle with rounded corners, an oval, and a circular shape when viewed from a direction perpendicular to the surface of the silicon substrate.
6 . The device of claim 1 , further comprising:
a dielectric material membrane spanning the through hole in the silicon substrate.
7 . The device of claim 6 , wherein the dielectric material membrane includes a through hole.
8 . The device of claim 6 , wherein the dielectric material membrane is the same dielectric material as the plurality of dielectric material grooves.