Laminated-type electronic component
View Patent ↗A laminated-type electronic component including: plural magnetic material layers; plural conductive patterns; a laminated layer body formed by laminating the plural magnetic material layers and the plural conductive patterns; a coil formed in the laminated layer body by connecting the conductive patterns between the magnetic material layers; and at least one magnetic gap formed in the laminated layer body, wherein the magnetic gaps are formed of a compound of Ni and Cu.
1. A laminated-type electronic component comprising:
plural magnetic material layers;
plural conductive patterns;
a laminated layer body formed by laminating the plural magnetic material layers and the plural conductive patterns;
a coil formed in the laminated layer body by connecting the conductive patterns between the magnetic material layers; and
at least one magnetic gap formed in the laminated layer body, wherein the magnetic material layers are formed of a ferrite including Ni, and
the at least one magnetic gap is formed of a compound consisting of Ni and Cu not including Zn and Fe.
2. The laminated-type electronic component according to claim 1 , wherein
the magnetic material layers are formed of Ni—Cu—Zn-based ferrite made by adding SnO2 of 0.6 to 1.5 wt % to a ferrite material containing NiO: 19 to 45 mol %, ZnO: 1 to 25 mol %, CuO: 6 to 10 mol %, and Fe203: 47 to 49 mol %.
3. The laminated-type electronic component according to claim 1 , wherein
a ratio of Ni to Cu, which forms the compound for forming the magnetic gaps, is 2:8 to 8:2.
4. The laminated-type electronic component according to claim 1 , wherein plural magnetic gaps are formed in the laminated layer body.