IP Library Granted Patent US 9,236,408
Granted Patent B2
US 9,236,408 · App. 13/864,465 · Granted Jan 12, 2016

Oxide semiconductor device including photodiode

Inventor: Shunpei Yamazaki (Tokyo, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L27/14609H01L27/14603H01L27/14612H01L27/14692
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,236,408
App. No.
13/864,465
Granted
Jan 12, 2016
Kind
B2
Abstract

A solid-state image sensing element including a transistor with stable electrical characteristics (e.g., significantly low off-state current) is provided. Two different element layers (an element layer including an oxide semiconductor layer and an element layer including a photodiode) are stacked over a semiconductor substrate provided with a driver circuit such as an amplifier circuit, so that the area occupied by a photodiode is secured. A transistor including an oxide semiconductor layer in a channel formation region is used as a transistor electrically connected to the photodiode, which leads to lower power consumption of a semiconductor device.

Claims (30)

1. A semiconductor device comprising:

a driver circuit comprising a first transistor comprising a first channel formation region, the first transistor being provided on a top surface of a semiconductor substrate;

a second transistor comprising an oxide semiconductor layer including indium in a second channel formation region over the first transistor; and

a photodiode over the second transistor, the photodiode being electrically connected to the second transistor,

wherein a gate electrode layer of the second transistor overlaps a gate electrode layer of the first transistor when seen from a direction perpendicular to the top surface of the semiconductor substrate.

2. The semiconductor device according to claim 1 ,

wherein the photodiode overlaps the second transistor.

3. The semiconductor device according to claim 2 ,

wherein the photodiode overlaps the first transistor.

4. The semiconductor device according to claim 1 ,

wherein the first channel formation region comprises crystalline silicon.

5. The semiconductor device according to claim 1 ,

wherein a semiconductor layer of the photodiode comprises crystalline silicon.

6. The semiconductor device according to claim 1 ,

wherein the photodiode comprises a p-type semiconductor region, an i-type semiconductor region, and an n-type semiconductor region.

7. A semiconductor device comprising:

a driver circuit comprising a first transistor comprising a first channel formation region, the first transistor being provided on a top surface of a semiconductor substrate;

a second transistor comprising an oxide semiconductor layer including indium in a second channel formation region over the first transistor;

a third transistor comprising an oxide semiconductor layer including indium in a third channel formation region over the semiconductor substrate; and

a photodiode over the second transistor and the third transistor, the photodiode being electrically connected to one of a source and a drain of the second transistor,

wherein the other of the source and the drain of the second transistor is electrically connected to the third transistor and to a gate electrode layer of the first transistor, and

wherein a gate electrode layer of the second transistor overlaps the gate electrode layer of the first transistor when seen from a direction perpendicular to the top surface of the semiconductor substrate.

8. The semiconductor device according to claim 7 ,

wherein the photodiode overlaps the second transistor or the third transistor.

9. The semiconductor device according to claim 7 ,

wherein the first channel formation region comprises crystalline silicon.

10. The semiconductor device according to claim 7 ,

wherein a semiconductor layer of the photodiode comprises crystalline silicon.

11. The semiconductor device according to claim 7 ,

wherein the photodiode comprises a p-type semiconductor region, an i-type semiconductor region, and an n-type semiconductor region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2013
From: YAMAZAKI, SHUNPEI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 030235/0217 →
Priority Claims (1)
JP 2012-100494 · Apr 25, 2012 · national
Continuity (1)
Related Publication 20130285046A1 · Oct 31, 2013