IP Library Granted Patent US 8,742,397
Granted Patent B2
US 8,742,397 · App. 13/864,978 · Granted Jun 3, 2014

Semiconductor light emitting device and method for manufacturing the same

Inventors: Tae Yun Kim (Gwangju, KR); Hyo Kun Son (Gwangju, KR)
Assignee: LG Innotek Co., Ltd.
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Quick Facts
Patent No.
US 8,742,397
App. No.
13/864,978
Granted
Jun 3, 2014
Kind
B2
Abstract

A semiconductor light emitting device includes a first nitride semiconductor layer, a dopant doped semiconductor layer on the first nitride semiconductor layer, an active layer on the dopant doped semiconductor layer, a delta doped layer on the active layer, a superlattice structure on the delta doped layer, an undoped layer on the superlattice layer, a second nitride semiconductor layer including a first n-type dopant, a third nitride semiconductor layer including a second n-type dopant, and a fourth nitride semiconductor layer including a third n-type dopant.

Claims (29)

1. A light emitting device comprising:

a first conductive type semiconductor layer;

a first delta doped layer on the first conductive type semiconductor layer;

a super lattice structure on the first delta doped layer;

a second delta doped layer on the super lattice structure;

an active layer on the second delta doped layer;

a second conductive type cladding layer on the active layer; and

a second conductive type semiconductor layer on the second conductive type cladding layer.

2. The light emitting device according to claim 1 , wherein the first conductive type semiconductor comprises a AlGaN layer.

3. The light emitting device according to claim 1 , further comprising a third delta doped layer between the first conductive type semiconductor layer and the first delta doped layer.

4. The light emitting device according to claim 1 , further comprising a dopant doped layer under the first conductive semiconductor layer.

5. The light emitting device according to claim 1 , wherein the first delta doped layer is formed at a thickness of 0.2 nm-0.5 nm.

6. The light emitting device according to claim 1 , wherein the super lattice structure is formed at a thickness of 5 Å-200 Å.

7. The light emitting device according to claim 1 , wherein the first conductive type semiconductor layer is a n-type semiconductor layer.

8. The light emitting device according to claim 4 , wherein the dopant doped layer is an n-type semiconductor layer.

9. A light emitting device comprising:

a dopant doped semiconductor layer;

a first conductive type semiconductor layer on the dopant doped semiconductor layer, wherein the first conductive type semiconductor layer comprises a AlGaN layer;

a first delta doped layer on the first conductive type semiconductor layer;

a supper lattice structure on the first delta doped layer;

an active layer on the supper lattice structure;

a second conductive type cladding layer on the active layer; and

a second conductive type semiconductor layer on the second conductive type cladding layer.

10. The light emitting device according to claim 9 , further comprising a second delta doped layer on the super lattice structure.

11. The light emitting device according to claim 9 , further comprising a third delta doped layer between the first conductive type semiconductor layer and the first delta doped layer.

12. The light emitting device according to claim 9 , wherein the first delta doped layer is formed at a thickness of 0.2 nm-0.5 nm.

13. The light emitting device according to claim 9 , wherein the super lattice structure is formed at a thickness of 5 Å-200 Å.

14. The light emitting device according to claim 9 , wherein the first conductive type semiconductor layer is a n-type semiconductor layer.

15. The light emitting device according to claim 9 , wherein the dopant doped layer is an n-type semiconductor layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2024
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: FAIRLIGHT INNOVATIONS, LLC
Reel/Frame 068839/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
Priority Claims (1)
KR 10-2007-0086711 · Aug 28, 2007 · national
Continuity (5)
Continuation 13453804 · Apr 23, 2012
Continuation 13004758 · Jan 11, 2011
Continuation 12659208 · Mar 1, 2010
Continuation 12198728 · Aug 26, 2008
Related Publication 20130228748A1 · Sep 5, 2013