IP Library Granted Patent US 10,305,196
Granted Patent B2
US 10,305,196 · App. 13/865,105 · Granted May 28, 2019

Dielectric lens structures for EHF radiation

Inventor: Justin Redd (Portland, OR)
Assignee: KEYSSA, INC.
H01Q19/06H01Q19/062H01L2224/05554H01L2224/16225H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/49171H01L2224/73265H01L2924/15311H01L2924/181
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,305,196
App. No.
13/865,105
Granted
May 28, 2019
Kind
B2
Abstract

Communication devices for communicating using EHF electromagnetic radiation that include a dielectric lens configured to refract incident EHF electromagnetic radiation. The communication device may include an integrated circuit (IC) package that in turn includes a transducer configured to transmit and/or receive an EHF electromagnetic signal and convert between electrical signals and electromagnetic signals. The integrated circuit package also includes an integrated circuit including at least one of a transmitter circuit and a received circuit that is operatively coupled to the transducer. The dielectric lens is generally disposed so as to enhance transmission or reception of the EHF electromagnetic signal by the transducer.

Claims (14)

1. An EHF communication system comprising:

a first device comprising a first integrated circuit package having a first transducer configured to transmit an electromagnetic signal in an EHF frequency range;

a first dielectric lens disposed adjacent the first transducer such that at least a portion of the electromagnetic signal is refracted by the first dielectric lens; and

a second device including a second integrated circuit package having a second transducer configured to receive the electromagnetic signal refracted by the first dielectric lens, wherein the first dielectric lens has a first surface and a second surface opposite the first surface, the first surface facing the first integrated circuit package having the first transducer and the second surface facing the second integrated circuit package having the second transducer, and wherein the first dielectric lens is a biconvex lens comprising a combination of a first spherical cap in a first housing of the first device and a second spherical cap is in a second housing of the second device.

2. The EHF communication system of claim 1 , wherein the first spherical cap comprises a first base having a first base radius and the second spherical cap comprises a second base having a second base radius, the first base radius substantially equal to the second base radius;

wherein the first spherical cap has a first spherical surface with the first radius of curvature and the second spherical cap has a second spherical surface with the second radius of curvature.

3. The EHF communication system of claim 2 , wherein the first dielectric lens includes a homogeneous material having an index of refraction between 1.2 and 2.0 measured at 60 GHz.

4. The EHF communication system of claim 2 , wherein the first spherical cap has a first height that is substantially equal to the first radius of curvature, such that the first spherical surface substantially corresponds to a hemisphere.

5. The EHF communication system of claim 2 wherein the second spherical surface has a second height that is less than the second radius of curvature.

6. The EHF communication system of claim 5 , wherein the ratio of the first radius of curvature to the second radius of curvature is in the range of about 9 to about 9.2.

7. The EHF communication system of claim 2 , wherein the second spherical cap has a second height that is substantially equivalent to the second radius of curvature, such that the second spherical surface substantially corresponds to a hemisphere.

8. The EHF communication system of claim 1 , wherein:

the first integrated circuit package comprises a transmitter circuit configured to convert a first baseband signal into an EHF electrical signal, the transducer configured to convert the EHF electrical signal into the electromagnetic signal; and

the second integrated circuit package comprises a receiver circuit configured to convert an EHF electrical signal from the second transducer into a second baseband signal.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2022
From: KEYSSA, INC.
To: KEYSSA (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 061521/0271 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2022
From: KEYSSA (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: MOLEX, LLC
Reel/Frame 061521/0305 →
CHANGE OF NAME Recorded Jun 26, 2014
From: WAVECONNEX, INC.
To: KEYSSA, INC.
Reel/Frame 033245/0977 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2014
From: REDD, JUSTIN
To: WAVECONNEX, INC.
Reel/Frame 032413/0887 →
Continuity (2)
Provisional Application 61625575 · Apr 17, 2012
Related Publication 20130271331A1 · Oct 17, 2013