IP Library Granted Patent US 9,380,652
Granted Patent B2
US 9,380,652 · App. 13/866,052 · Granted Jun 28, 2016

Lighting device with LED chip and protective cast

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Quick Facts
Patent No.
US 9,380,652
App. No.
13/866,052
Granted
Jun 28, 2016
Kind
B2
Abstract

The lighting device has at least one LED chip that is potted by means of a potting compound, which potting compound has a light-transmissive, castable and curable matrix material comprising scattering volumes as filler material, wherein the scattering volumes are distributed inhomogeneously over a thickness of the potting compound and these scattering volumes have a lower density than the matrix material in its castable state. A method is used for producing a lighting device, which comprises at least one LED chip, by means of at least the following steps: potting the at least one LED chip by means of a potting compound containing scattering volumes, wherein the scattering volumes have a lower density than a matrix material of the potting compound in this state; curing the potting compound so that an inhomogeneous distribution of the scattering volumes is obtained owing to floating of the scattering volumes in the matrix material.

Claims (12)

1. A lighting device having at least one LED chip that is potted by means of a potting compound, which potting compound has a light-transmissive, castable and curable matrix material comprising scattering volumes as filler material,

wherein the scattering volumes are distributed inhomogeneously over a thickness of the potting compound and these scattering volumes have a lower density than the matrix material in its castable state,

wherein the scattering volumes comprise cavities,

wherein a wall material of at least one of the cavities is a reflective material.

2. The lighting device as claimed in claim 1 , wherein a wall material of at least one of the cavities is a light refracting material.

3. The lighting device as claimed in claim 1 , wherein a wall material of at least one of the cavities comprises or is glass, ceramic or plastic.

4. The lighting device as claimed in claim 1 , wherein the matrix material comprises silicone or epoxy resin.

5. The lighting device as claimed in claim 1 , wherein the matrix material comprises polyurethane, polyurethane acrylate, polyurethane resin and polyacrylate resin.

6. The lighting device as claimed in claim 1 , wherein the potting compound comprises, as a further filler material, luminescent material particles which have a higher density than the matrix material in its castable state.

7. The lighting device as claimed in claim 6 , wherein the luminescent material particles have deposited at least partially on the at least one LED chip.

8. The lighting device as claimed in claim 1 , wherein the at least one LED chip comprises a plurality of LED chips, of which at least two LED chips emit light with a different spectral distribution.

9. The lighting device as claimed in claim 1 , wherein a wall material of at least one of the cavities comprises silicone.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 24, 2013
From: BERGENEK, KRISTER; BIEBERSDORF, ANDREAS; KRAEUTER, GERTRUD; SORG, JOERG; WINDISCH, REINER
To: OSRAM GMBH
Reel/Frame 030862/0369 →