IP Library Patent Application 13873115
Patent Application
App. No. 13/873,115

WAVE SOLDERING CARRIER

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Quick Facts
Patent No.
US None
App. No.
13/873,115
Abstract

A wave soldering carrier includes a base plate and a fixing member positioned on the base plate. The base plate defines a receiving recess and a number of through holes communicating with the receiving recess. The receiving recess receives a circuit board. The through holes are arranged and shaped corresponding to a number of electronic components on the circuit board. The fixing member includes a shaft including a fixing shaft fixed to the base plate and a restricting shaft extending from an end of the fixing shaft. A diameter of the restricting shaft is greater than that of the fixing shaft, thereby forming a step. The fixing member further includes a rotatable member rotatably connected to the fixing shaft and sandwiched between the shoulder and the base plate. The rotation member is rotatable to a preset position, where a distal end of the rotatable member firmly contacts the circuit board.

Claims (7)

1 . A wave soldering carrier comprising:

a base plate defining a receiving recess for receiving a circuit board therein and a plurality of through holes defined in a bottom in the receiving recess, a contour of the receiving recess being shaped conforming to the circuit board, the through holes communicating with the receiving recess, and the through holes being arranged and shaped corresponding to a plurality of electronic components on the circuit board, the base plate defining a plurality of fixing holes around the receiving recess;

a fixing member positioned on the base plate, the fixing member comprising:

a shaft comprising a fixing shaft for insertion into one of the fixing holes of the base plate and a restricting shaft extending from an end of the fixing shaft, a diameter of the restricting shaft being greater than that of the fixing shaft, thereby forming a step therebetween;

a rotatable member rotatably connected to the fixing shaft and sandwiched between the step and the base plate;

wherein the rotation member is rotatable between a first position where the rotatable member is moved over the receiving recess and a distal end of the rotatable member is configured to firmly contact a top surface of the circuit board, and a second position where the rotation member is moved away from the receiving recess thus allowing the circuit board to be taken out from the receiving recess.

2 . The wave soldering carrier as described in claim 1 , further comprising two opposite sidewalls extending from opposite edges of the base plate, wherein two ledges are formed on the opposite sidewalls and extend away from each other, the two ledges are parallel to the base plate.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 10, 2019
From: ZHONGSHAN INNOCLOUD INTELLECTUAL PROPERTY SERVICES CO.,LTD.
To: SCIENBIZIP CONSULTING(SHENZHEN)CO.,LTD.
Reel/Frame 050709/0949 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2015
From: SCIENBIZIP CONSULTING(SHENZHEN)CO.,LTD.
To: ZHONGSHAN INNOCLOUD INTELLECTUAL PROPERTY SERVICES CO.,LTD.
Reel/Frame 035570/0694 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2015
From: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
To: SCIENBIZIP CONSULTING(SHENZHEN)CO.,LTD.
Reel/Frame 035292/0991 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 29, 2013
From: ZHAO, TAO; WEI, XIAO-CONG; TSENG, WEI-HSIEN
To: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 030311/0167 →