Light emitting device with reduced EPI stress
View Patent ↗Elements are added to a light emitting device to reduce the stress within the light emitting device caused by thermal cycling. Alternatively, or additionally, materials are selected for forming contacts within a light emitting device based on their coefficient of thermal expansion and their relative cost, copper alloys being less expensive than gold, and providing a lower coefficient of thermal expansion than copper. Elements of the light emitting device may also be structured to distribute the stress during thermal cycling.
1. A light emitting device comprising:
a submount having first contacts separated by at least one first channel,
a light emitting structure having a metal layer with second contacts separated by at least one second channel, and
one or more elements added to the light emitting structure to reduce a thermally induced stress in the light emitting structure in a vicinity of the second channel;
wherein each of the second contacts is coupled to a corresponding first contact by a connection material that includes a first plurality of micro bumps arranged in an area on the second contact adjacent the second channel and a second plurality of micro bumps arranged on the second contact in an area distant from the second channel, wherein a density of the first plurality of micro bumps is significantly greater than a density of the second plurality of micro bumps.
2. The light emitting device of claim 1 , wherein the light emitting structure comprises a flip chip structure.
3. The light emitting device of claim 1 , wherein the metal layer comprises an alloy.
4. The light emitting device of claim 3 , wherein the alloy includes a copper alloy.
5. The light emitting device of claim 4 , wherein the copper alloy includes at least one of: CuNi, CuNiTi, CuW, CuFe, and CuMo.
6. The light emitting device of claim 4 , wherein the copper alloy includes CuNiTi.