Halogenated diethyltoluenediamines
View Patent ↗Disclosed are halogenated diethyltoluenediamines of formula wherein either R 1 is an amino group and R 2 is chlorine or bromine, or R 2 is an amino group and R 1 is chlorine or bromine, and isomeric mixtures thereof. The halogenated diethyltoluenediamines of formula I are useful as chain extenders for polyurethanes and hardeners for epoxy resins having a relatively long gel time.
1. A halogenated diethyltoluenediamine of formula
wherein either R 1 is an amino group and R 2 is chlorine or bromine or R 2 is an amino group and R 1 is chlorine or bromine,
and/or an isomeric mixture thereof.
2. The halogenated diethyltoluenediamine of claim 1 , wherein either R 1 is an amino group and R 2 is chlorine or R 2 is an amino group and R 1 is chlorine, and/or an isomeric mixture thereof.
3. The halogenated diethyltoluenediamine of claim 1 , wherein either R 1 is an amino group and R 2 is bromine or R 2 is an amino group and R 1 is bromine, and/or an isomeric mixture thereof.
4. The halogenated diethyltoluenediamine according to claim 1 adapted for use as a chain extender and/or curing agent in production of polyurethane.
5. The halogenated diethyltoluenediamine according to claim 1 adapted for use as a hardener for an epoxy resin.
6. A process for preparing the halogenated diethyltoluenediamine according to claim 2 , comprising reacting a diethyltoluenediamine of formula
wherein either R 1′ is an amino group and R 2′ is hydrogen, or R 2′ is an amino group and R 1′ is hydrogen,
and/or an isomeric mixture thereof,
with chlorine in sulfuric acid.
7. The process of claim 6 , wherein the sulfuric acid is present in an amount of 5 to 50 molar equivalents, based on the amount of diethyltoluenediamine (II).
8. The process of claim 6 , wherein the chlorine is added in an amount of 2 to 10 molar equivalents, based on the amount of diethyltoluenediamine (II).
9. The process of claim 6 , wherein the reacting is conducted at a temperature from 15° C. to 80° C.
10. A process for preparing the halogenated diethyltoluenediamine according to claim 3 , comprising
(i) reacting a diethyltoluenediamine of formula
wherein either R 1′ is an amino group and R 2′ is hydrogen, or R 2′ is an amino group and R 1′ is hydrogen,
and/or an isomeric mixture thereof,
with an acetylating agent to obtain a diacetyl compound of formula
wherein either R 1″ is an acetylamino group and R 2″ is hydrogen or R 2″ is an acetylamino group and R 1″ is hydrogen,
and/or an isomeric mixture thereof,
(ii) brominating said diacetyl compound (III) with hydrobromic acid and hydrogen peroxide to obtain a corresponding brominated diacetyl compound of formula
wherein either R 1′″ an acetylamino group and R 2′″ bromine or R 2′″ an acetylamino group and R 1′″ is bromine,
and/or an isomeric mixture thereof, and
(iii) hydrolyzing said brominated diacetyl compound (IV) to obtain said halogenated diethyltoluenediamine (I).
11. The process of claim 10 , wherein the acetylating agent in (i) is acetyl chloride in the presence of triethylamine.
12. The process of claim 10 , wherein the brominating (ii) is conducted at a temperature of −10 to +20° C.
13. The process of claim 10 , wherein the hydrolyzing (iii) is conducted with hydrochloric acid in methanol.
14. A chain extender and/or curing agent for producing polyurethane comprising the halogenated diethyltoluenediamine according to claim 1 .
15. A polyurethane produced with a chain extender and/or curing according to claim 14 .
16. A hardener for an epoxy resin comprising a halogenated diethyltoluenediamine according to claim 1 .
17. An epoxy resin hardened with a hardener according to claim 16 .
18. The halogenated diethyltoluenediamine according to claim 1 , which is liquid or semi-liquid at room temperature.
19. The halogenated diethyltoluenediamine according to claim 1 , which is an isomeric mixture.
20. A brominated diacetyl compound of formula
wherein either R 1′″ an acetylamino group and R 2′″ is bromine or R 2′″ an acetylamino group and R 1′″ is bromine, and/or an isomeric mixture thereof.
21. The process of claim 6 , wherein the reacting is conducted at a temperature from 20°C. to 60°C.