Mounting structure and mounting method
View Patent ↗Provided is a mounting structure capable of maintaining highly accurate connection reliability even when the temperature of the environment in which the mounting structure is used is high. Mounting structure ( 10 ) includes electronic component ( 11 ), metal ( 12 ), wiring substrate ( 13 ), and a preventing structure. Electronic component ( 11 ) includes first electrode ( 14 ). The melting point of metal ( 12 ) is 130° C. or less. Wiring substrate ( 13 ) includes second electrode ( 15 ) electrically connected to first electrode ( 14 ) via metal ( 12 ). The preventing structure prevents flowing-out of metal ( 12 ) in a melted state from a region where first electrode ( 14 ) and second electrode ( 15 ) are formed. Further, preventing structure ( 14 ) is formed in at least one member selected from electronic component ( 11 ) and wiring substrate ( 12 ).
1. A mounting structure comprising:
an electronic component including a first electrode;
a metal having a melting point of 130° C. or less;
a wiring substrate including a second electrode electrically connected to the first electrode via the metal; and
a preventing structure for preventing flowing-out of the metal in a melted state from a region where the first electrode and the second electrode are formed, wherein the preventing structure is formed in at least one member selected from the electronic component and the wiring substrate;
wherein a waveguide structure having an optical waveguide is formed on a surface of the wiring substrate, wherein the electronic component includes an emission region, wherein the electronic component and the waveguide structure are bonded together by a resin, and wherein light emitted from the emission region is coupled with the waveguide; and
wherein an end surface of the waveguide structure is located directly below the emission region is a slope end surface formed obliquely to the vertical direction of the surface of the wiring substrate.
2. The mounting structure according to claim 1 wherein the melting point of the metal is 40° C. or less.
3. The mounting structure according to claim 1 wherein the preventing structure includes a step formed in at least one member selected from the electronic component and the wiring substrate.
4. The mounting structure according to claim 1 wherein a material of the metal is an alloy containing at least one metal selected form gallium and indium.
5. The mounting structure according to claim 1 :
wherein the first electrode is formed on a first surface of the electronic component facing the wiring substrate; and
wherein the first electrode has a length vertical to the first surface set larger than a length parallel to the first surface.
6. The mounting structure according to claim 1 wherein a shape of the first electrode is hollow.
7. The mounting structure according to claim 1 wherein a concave-convex shape having an aspect ratio of 0.01 or less is formed on a surface of at least one electrode selected from the first electrode and the second electrode.
8. The mounting structure according to claim 1 wherein at least one of the electronic component and the wiring substrate includes a dent into which the metal is injected, and wherein the first electrode or the second electrode is formed on a bottom surface of the dent.
9. The mounting structure according to claim 1 wherein the electronic component and the wiring substrate are bonded by a resin on an outer periphery of the metal.
10. The mounting structure according to claim 1 wherein the first electrode includes a first electrode pad and first solder formed on a surface of the first electrode pad.
11. The mounting structure according to claim 1 wherein a metal layer is formed on the slope end surface.