Method for interconnecting a conductive pad and an electrical contact via a spring, and corresponding device

1. A device with an integrated-circuit chip comprising:

an insulating body containing at least one conductive pad,

at least one electrical contact opposite said electrically conductive pad,

at least one housing in the body, comprising a bottom and a wall forming an aperture, said housing bottom being located at the conductive pad and the aperture being located at the electrical contact,

at least one helical spring disposed in the housing and connecting the conductive pad to the electrical contact, said spring comprising a central portion between its two ends, and

wherein said housing and said spring are configured so as to hold the spring in the housing by friction of the central part of the spring with respect to the wall of the housing.

2. A device according to claim 1 , wherein the cross-section of an end of the spring is less than that of the aperture of the housing.

3. A device according to claim 1 , wherein the spring comprises two frustoconical portions opposed through their base, which is situated level with a central portion of the spring.

4. A device according to claim 3 , wherein the housing comprises a transverse section that broadens in the direction of the bottom and in the direction of its aperture from a central section.

5. A device according to claim 1 , wherein the spring comprises two portions comprising turns, the cross-section of which decreases from the central part in the direction of its two ends.

6. A device according to claim 1 , further comprising a holding or centering element disposed around the spring and between the spring and the wall of the housing and substantially level with the central portion.

7. A device according to claim 6 , wherein the holding or centering element receives at least two springs.

8. A device according to claim 1 , wherein the holding or centering element comprises an orifice so as to house therein all or part of a component and/or its enrobing.

9. A device according to claim 1 , wherein the spring comprises soldering at least at one of its ends in order to solder the conductive pad and/or the electrical contact.

10. An electronic device according to claim 1 , further comprising a radio-frequency antenna connected to the two conductive pads and an integrated-circuit chip connected to the electrical contacts.

11. An electronic device according to claim 1 , wherein the device comprises a chip card or electronic passport.

12. A method for producing an electrical connection between at least one conductive pad disposed in an insulating body and at least one electrical contact of an integrated circuit disposed opposite said conductive pad,

said method comprising the steps of creating, in the body, a housing comprising a bottom and an aperture, said housing having a wall with a bottom at the conductive pad and the electrical contact at its aperture,

fitting at least one helical spring in at least one housing, said spring comprising a central portion between two ends,

transferring and connection of the conductive pad to the electrical contact, and

configuring the spring and the housing to hold the spring in the housing by friction of the central part of the spring with respect to the wall of the housing.