PROCESS FOR THE PREPARATION OF AQUEOUS SILICON DIOXIDE DISPERSIONS FOR ADHESIVE FORMULATIONS
Process for preparing aqueous compositions, particularly aqueous dispersions based on silicon dioxide, and for preparing adhesive or coating formulations using the aqueous compositions as a component, and for production of adhesive layers and bonding of substrates coated on one side or both sides by spray application using the compositions.
1 . Process for the preparation of a dispersion, comprising:
(a) adjusting at least one aqueous silica dispersion comprising SiO 2 -particles having a mean particle diameter of 1 to 200 nm to a pH value of 6 or less through the addition of at least one strong or medium-strong acid, and
(b) mixing the pH adjusted dispersion with at least one polychloroprene dispersion comprising polychloroprene particles having a mean particle size of 50 to 200 nm.
2 . Process according to claim 1 , wherein the SiO 2 -particles have a mean particle diameter of 5 to 100 nm.
3 . Process according to claim 1 wherein the aqueous silica dispersion is a silica sol.
4 . Process according to claim 1 wherein the silica dispersion obtained after process step (a) has a pH value of 1 to 5.
5 . Process according to claim 1 wherein the dispersion further comprises:
(c) at least one water-soluble OH-group-containing organic compound.
6 . Process according to claim 5 , wherein the OH-group-containing compound is one or more cyclodextrins.
7 . A method of preparing adhesive or coating formulations comprising adding a dispersion prepared according to claim 1 to at least one other component of said adhesive or coating formulations.
8 . Process according to claim 2 , wherein the SiO 2 particles have a mean particle diameter of 8 to 60 nm.
9 . A method of preparing a spray adhesive formulation comprising adding a dispersion prepared according to claim 1 to at least one other component of said spray adhesive formulation.
10 . Process according to claim 4 , wherein the silica dispersion obtained after process step (a) has a pH value of 1.7 to 4.
11 . A method according to claim 9 , wherein the spray adhesive formulation is a 1C-spray adhesive formulation.
12 . A process according to claim 1 , wherein silica dispersions are contained in the range of 5 wt % to 35 wt %.
13 . A process according to claim 1 , wherein chloroprene dispersions are contained in the dispersions of 90 wt % to 50 wt %.