POWER AND GROUND VIAS FOR POWER DISTRIBUTION SYSTEMS
A system for providing power and ground vias for power distributions systems includes first and second conductive layers on a microelectronic package. The conductive layers may include one or more conductive components such as, but not limited to, power planes, ground planes, pads, traces, and the like for electrically connecting to electronic components. A via may electrically connect the first and second conductive layers. The via may have a cross-section of at least three partially-overlapping shapes. Each of the shapes partially overlaps at least two of the other shapes. The shapes may be, for example, circular, triangular, rectangular, square, polygonal, rhomboidal shape, or any other shape.
1 .- 13 . (canceled)
14 . A method comprising:
providing a power source including a terminal;
providing one of a power plane and a ground plane; and
forming a via filled with a conductive material that forms a conductive pathway that connects the terminal of the power source to the one of the power plane and the ground plane, wherein the via has a cross-section of at least three partially-overlapping shapes, and wherein each of the shapes partially overlaps at least two of the other shapes.
15 . The method of claim 14 , wherein the shapes are each circular.
16 . The method of claim 15 , wherein the shapes have a diameter between about 8 mils and about 18 mils.
17 . The method of claim 14 , wherein forming the via comprises:
forming at least-three partially-overlapping circular holes to define an aperture between the terminal of the power source and the one of the power plane and the ground plane; and
substantially filling the aperture with conductive material to electrically connect the power source and the one of the power plane and the ground plane.
18 . The method of claim 14 , wherein the shapes are each one of triangular, rectangular, square, polygonal, and rhomboidal shape.
19 . The method of claim 14 , wherein at least two of the shapes are of different types.
20 . The method of claim 14 , wherein at least two of the shapes are of different sizes.
21 . A method comprising:
providing a power source including a power supply voltage terminal and a power supply ground terminal;
providing a power plane;
providing a ground plane;
forming a first via filled with a conductive material that forms a first conductive pathway that electrically connects the power plane to the power supply voltage terminal of the power source, wherein the first via has a cross-section of at least partially-overlapping circular shapes, and wherein each one of the circular shapes partially overlaps at least two of the other circular shapes; and
forming a second via filled with a conductive material that forms a second conductive pathway that electrically connects the ground plane to the power supply ground terminal of the power source, wherein the second via has a cross-section of at least three partially-overlapping circular shapes, and wherein each of the circular shapes partially overlaps at least two of the other circular shapes.
22 . The method of claim 21 , further comprising:
providing first and second conductive components for electrical connection to an electronic component; and
forming a third via electrically connecting the power plane and the first conductive component, wherein the third via has a cross-section of at least partially-overlapping circular shapes, and wherein each one of the circular shapes partially overlaps at least two of the other circular shapes; and
forming a fourth via electrically connecting the ground plane and the second conductive component, wherein the fourth via has a cross-section of at least three partially-overlapping circular shapes, and wherein each of the circular shapes partially overlaps at least two of the other circular shapes.
23 . The method of claim 21 , wherein the circular shapes have a diameter between about 8 mils and about 18 mils.
24 . The method of claim 21 , wherein at least two of the circular shapes are of different sizes.
25 . The method of claim 21 , wherein the shapes are each circular.
26 . The method of claim 21 , wherein the shapes are each one of triangular, rectangular, square, polygonal, and rhomboidal shape.
28 . The method of claim 21 , wherein forming the first via comprises:
forming at least-three partially-overlapping circular holes to define an aperture between the power plane and the power supply voltage terminal of the power source; and
substantially filling the aperture with conductive material to electrically connect the power plane and the power supply voltage terminal of the power source.
29 . The method of claim 21 , wherein forming the second via comprises:
forming at least-three partially-overlapping circular holes to define an aperture between the ground plane and the power supply ground terminal of the power source; and
filling the aperture with conductive material to electrically connect the ground plane and the power supply ground terminal of the power source.