IP Library Patent Application 13888637
Patent Application
App. No. 13/888,637

SEMICONDUCTOR DEVICE HAVING BIT LINE HIERARCHICALLY STRUCTURED

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Quick Facts
Patent No.
US None
App. No.
13/888,637
Abstract

Disclosed herein is a semiconductor device that includes a plurality of memory cells; a local bit line coupled to the memory cells; a global bit line; and a first switch circuit coupled between the global bit line and the local bit line, the first switch circuit electrically connecting the local bit line to the global bit line when at least one of first and second control signals is in an active state, and the first switch circuit electrically disconnecting the local bit line to the global bit line when both of the first and second control signals are in an inactive state.

Claims (48)

1 . A semiconductor device comprising:

a plurality of memory cells;

a local bit line coupled to the memory cells;

a global bit line; and

a first switch circuit coupled between the global bit line and the local bit line, the first switch circuit electrically connecting the local bit line to the global bit line when at least one of first and second control signals is in an active state, and the first switch circuit electrically disconnecting the local bit line to the global bit line when both of the first and second control signals are in an inactive state.

2 . The semiconductor device as claimed in claim 1 , further comprising first and second switch drivers respectively generating the first and second control signals.

3 . The semiconductor device as claimed in claim 2 , wherein the first and second switch drivers are commonly controlled based on a third control signal.

4 . The semiconductor device as claimed in claim 2 , wherein the first switch circuit includes first and second transistors coupled in parallel between the global bit line and the local bit line, and the first and second control signals are respectively supplied to control electrodes of the first and second transistors.

5 . The semiconductor device as claimed in claim 2 , wherein the first switch circuit includes a third transistor coupled between the global bit line and the local bit line, and the first and second control signals are commonly supplied to a control electrode of the third transistor.

6 . The semiconductor device as claimed in claim 4 , wherein the local bit line is arranged between the first and second switch drivers.

7 . The semiconductor device as claimed in claim 4 , wherein both of the first and second switch drivers are arranged on one side of the local bit line.

8 . The semiconductor device as claimed in claim 1 , further comprising:

a precharge line supplied with a predetermined potential; and

a second switch circuit coupled between the precharge line and the local bit line, the second switch circuit electrically connecting the local bit line to the precharge line when at least one of fourth and fifth control signals is in an active state, and the second switch circuit electrically disconnecting the local bit line to the precharge line when both of the fourth and fifth control signals are in an inactive state.

9 . The semiconductor device as claimed in claim 1 , further comprising:

a plurality of word lines; and

first and second control signal lines respectively transferring the first and second control signals, wherein

each of the memory cells includes a memory element and a cell transistor connected in series,

each of the word lines is coupled to a control electrode of an associated one of the cell transistors, and

the word lines and the first and second control signal lines are provided on a predetermined wiring layer.

10 . The semiconductor device as claimed in claim 9 , further comprising first and second dummy lines provided on the predetermined wiring layer,

wherein the first and second control signal lines are arranged between the first and second dummy lines.

11 . The semiconductor device as claimed in claim 10 , wherein the first and second dummy lines are in a floating state.

12 . A semiconductor device comprising:

a plurality of memory cells;

a first line coupled to the memory cells;

a second line;

a first transistor coupled between the first line and the second line;

a first driver of which an output node is coupled to a gate of the first transistor; and

a second driver of which an output node is coupled to the gate of the first transistor;

the first and second drivers being arranged such that the first transistor is arranged between the first driver and the second driver.

13 . The semiconductor device as claimed in claim 12 , further comprising a control signal line coupled to both input nodes of the first and second drivers.

14 . The semiconductor device as claimed in claim 12 , further comprising:

a plurality of additional memory cells;

a third line coupled to the additional memory cells;

a fourth line;

a second transistor coupled between the third line and the fourth line; and

a third driver of which an output node is coupled to a gate of the second transistor, the third driver being arranged such that the second transistor is arranged between the second and third drivers.

15 . The semiconductor device as claimed in claim 14 , further comprising a control signal line coupled to each of input nodes of the first, second and third drivers.

16 . The semiconductor device as claimed in claim 14 , wherein the gate of the second transistor is coupled to the output node of the third driver.

17 . The semiconductor device as claimed in claim 12 , further comprising:

a fifth line supplied with a voltage;

a third transistor coupled between the first line and the fifth line;

a fourth driver of which an output node is coupled to a gate of the third transistor; and

a fifth driver of which an output node is coupled to the gate of the third transistor;

the fourth and fifth drivers being arranged such that the third transistor is arranged between the fourth driver and the fifth driver.

18 . The semiconductor device as claimed in claim 17 , wherein the first driver is arranged adjacently to the fourth driver and the second driver is arranged adjacently to the fifth driver.

19 . The semiconductor device as claimed in claim 17 , wherein the first and third transistors are arranged adjacently to each other.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032899/0196 →
SECURITY AGREEMENT Recorded Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2013
From: MOCHIDA, NORIAKI; UNO, HIROYUKI; IKEBATA, KOJI; NAGATA, KYOICHI
To: ELPIDA MEMORY, INC.
Reel/Frame 030364/0875 →