Method and system for a light source assembly supporting direct coupling to an integrated circuit
View Patent ↗Methods and systems for a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The CMOS chip may comprise a laser, a microlens, a turning mirror, and an optical bench, and may generate an optical signal utilizing the laser, focus the optical signal utilizing the microlens, and reflect the optical signal at an angle defined by the turning mirror. The reflected optical signal may be transmitted into the photonically enabled CMOS chip, which may comprise a non-reciprocal polarization rotator, comprising a latching faraday rotator. The CMOS chip may comprise a reciprocal polarization rotator, which may comprise a half-wave plate comprising birefringent materials operably coupled to the optical bench. The turning mirror may be integrated in the optical bench and may reflect the optical signal to transmit through a lid operably coupled to the optical bench.
1. A system for processing signals, the system comprising:
a photonically enabled complementary metal-oxide semiconductor (CMOS) chip comprising a laser, microlens, turning mirror, and an optical bench, said photonically enabled CMOS chip being operable to:
generate an optical signal utilizing said laser;
focus said optical signal utilizing said microlens;
reflect said optical signal at an angle defined by said turning mirror; and
transmit said reflected optical signal to one or more grating couplers in said photonically enabled CMOS chip.
2. The system according to claim 1 , wherein said photonically enabled CMOS chip further comprises a non-reciprocal polarization rotator.
3. The system according to claim 2 , wherein said non-reciprocal polarization rotator comprises a latching faraday rotator.
4. The system according to claim 1 , wherein said photonically enabled CMOS chip further comprises a reciprocal polarization rotator.
5. The system according to claim 4 , wherein said reciprocal polarization rotator comprises a half-wave plate.
6. The system according to claim 5 , wherein said half-wave plate comprises a dielectric stack comprising one or more birefringent materials operably coupled to said optical bench.
7. The system according to claim 1 , wherein said turning mirror is integrated in said optical bench.
8. The system according to claim 7 , wherein said turning mirror reflects said optical signal to transmit through a lid operably coupled to said optical bench.
9. The system according to claim 1 , wherein said turning mirror is integrated in a lid operably coupled to said optical bench.
10. The system according to claim 1 , wherein said photonically enabled CMOS chip comprises two electro-thermal interfaces between said optical bench, said laser, and a lid operably coupled to said optical bench.
11. The system according to claim 1 , wherein said microlens comprises a ball lens.
12. The system according to claim 1 , wherein said laser comprises a semiconductor laser diode.
13. The system according to claim 1 , wherein said laser comprises an edge emitting laser diode.
14. The system according to claim 1 , wherein said optical bench functions as a mechanical support structure for one or more optical components of said photonically enabled CMOS chip and said reflected optical signal passes through said optical bench.
15. The system according to claim 1 , wherein said optical bench comprises silicon.
16. The system according to claim 1 , wherein one or more interposers are integrated in said photonically enabled CMOS chip.
17. The system according to claim 16 , wherein said one or more interposers comprise metal pads integrated into said photonically enabled CMOS chip.
18. The system according to claim 16 , wherein said one or more interposers comprise one or more polymer pads deposited on said photonically enabled CMOS chip.
19. A system for processing signals, the system comprising:
a photonically enabled complementary metal-oxide semiconductor (CMOS) chip comprising a laser, a microlens, a turning mirror, and an optical bench, said photonically enabled CMOS chip being operable to:
generate an optical signal utilizing said laser;
focus said generated optical signal utilizing said microlens;
reflect said optical signal at an angle defined by said turning mirror; and
transmit said reflected optical signal into said photonically enabled CMOS chip.
20. The system according to claim 19 , wherein said photonically enabled CMOS chip further comprises a non-reciprocal polarization rotator.
21. The system according to claim 20 , wherein said non-reciprocal polarization rotator comprises a faraday rotator.
22. The system according to claim 20 , wherein said non-reciprocal polarization rotator comprises a latching faraday rotator.
23. The system according to claim 19 , wherein said photonically enabled CMOS chip comprises two electro-thermal interfaces between said optical bench, said laser, and a lid operably coupled to said optical bench.
24. The system according to claim 19 , wherein said turning mirror is integrated in said optical bench.
25. The system according to claim 24 , wherein said turning mirror reflects said optical signal to transmit through a lid operably coupled to said optical bench.
26. The system according to claim 19 , wherein said turning mirror is integrated in a lid operably coupled to said optical bench.
27. The system according to claim 19 , wherein said microlens comprises a ball lens.
28. The system according to claim 19 , wherein said laser comprises a semiconductor laser diode.
29. The system according to claim 19 , wherein said laser comprises an edge emitting laser diode.
30. The system according to claim 19 , wherein said optical bench functions as a mechanical support structure for one or more optical components of said photonically enabled CMOS chip and said reflected optical signal passes through said optical bench.
31. The system according to claim 19 , wherein said optical bench comprises silicon.
32. The system according to claim 19 , wherein one or more interposers are integrated in said photonically enabled CMOS chip.
33. The system according to claim 32 , wherein said one or more interposers comprise metal pads integrated into said photonically enabled CMOS chip.
34. The system according to claim 32 , wherein said one or more interposers comprise one or more polymer pads deposited on said photonically enabled CMOS chip.
35. A system for processing signals, the system comprising:
a photonically enabled complementary metal-oxide semiconductor (CMOS) chip comprising a laser, a microlens, a turning mirror, and an optical bench, said photonically enabled CMOS chip being operable to:
generate an optical signal utilizing said laser;
focus said generated optical signal utilizing said microlens;
reflect said optical signal at an angle defined by said turning mirror; and
transmit said reflected optical signal to one or more optical couplers in said photonically enabled CMOS chip.
36. The system according to claim 35 , wherein said laser comprises a semiconductor laser diode.
37. The system according to claim 35 , wherein said laser comprises an edge-emitting laser diode.
38. The system according to claim 35 , wherein said photonically enabled CMOS chip further comprises a reciprocal polarization rotator.
39. The system according to claim 38 , wherein said reciprocal polarization rotator comprises a half-wave plate.
40. The system according to claim 39 , wherein said half-wave plate comprises a dielectric stack comprising one or more birefringent materials operably coupled to said optical bench.
41. The system according to claim 35 , wherein said photonically enabled CMOS chip comprises two electro-thermal interfaces between said optical bench, said laser, and a lid operably coupled to said optical bench.
42. The system according to claim 35 , wherein said turning mirror is integrated in a lid operably coupled to said optical bench.
43. The system according to claim 35 , wherein said turning mirror is integrated in said optical bench.
44. The method according to claim 43 , wherein said turning mirror reflects said optical signal to transmit through a lid operably coupled to said optical bench.
45. The system according to claim 35 , wherein said microlens comprises a ball lens.
46. The system according to claim 35 , wherein said one or more optical couplers comprise grating couplers.
47. The system according to claim 35 , wherein said optical bench functions as a mechanical support structure for one or more optical components of said photonically enabled CMOS chip and said reflected optical signal passes through said optical bench.
48. The system according to claim 35 , wherein said optical bench comprises silicon.
49. The system according to claim 35 , wherein one or more interposers are integrated in said photonically enabled CMOS chip.
50. The system according to claim 49 , wherein said one or more interposers comprise metal pads integrated into said photonically enabled CMOS chip.
51. The system according to claim 49 , wherein said one or more interposers comprise one or more polymer pads deposited on said photonically enabled CMOS chip.
52. A system for processing signals, the system comprising:
a photonically enabled complementary metal-oxide semiconductor (CMOS) chip comprising a laser, a turning mirror, and an optical bench, said photonically enabled CMOS chip being operable to:
generate an optical signal utilizing said laser;
reflect said optical signal at an angle defined by said turning mirror; and
transmit said reflected optical signal to one or more optical couplers in said photonically enabled CMOS chip.
53. The system according to claim 52 , wherein said laser comprises a semiconductor laser diode.
54. The system according to claim 52 , wherein said laser comprises an edge-emitting laser diode.
55. The system according to claim 52 , wherein said laser comprises a feedback insensitive laser diode.
56. The system according to claim 52 , wherein said photonically enabled CMOS chip comprises two electro-thermal interfaces between said optical bench, said laser, and a lid operably coupled to said optical bench.
57. The system according to claim 52 , wherein said turning mirror is integrated in a lid operably coupled to said optical bench.
58. The system according to claim 52 , wherein said turning mirror is integrated in said optical bench.
59. The system according to claim 58 , wherein said turning mirror reflects said optical signal to transmit through a lid operably coupled to said optical bench.
60. The system according to claim 52 , wherein said photonically enabled CMOS chip further comprises a microlens.
61. The system according to claim 60 , wherein said microlens is operable to focus said generated optical signal.
62. The system according to claim 52 , wherein said optical bench functions as a mechanical support structure for one or more optical components of said photonically enabled CMOS chip and said reflected optical signal passes through said optical bench.
63. The system according to claim 52 , wherein said optical bench comprises silicon.
64. The system according to claim 52 , wherein one or more interposers are integrated in said photonically enabled CMOS chip.
65. The system according to claim 64 , wherein said one or more interposers comprise metal pads integrated into said photonically enabled CMOS chip.
66. The system according to claim 64 , wherein said one or more interposers comprise one or more polymer pads deposited on said photonically enabled CMOS chip.