Solid electrolytic capacitor and method of manufacture

1. A method of forming a solid electrolytic capacitor comprising:

forming an anode of a valve metal or conductive oxide of a valve metal wherein an anode lead extension of a valve metal or conductive oxide of a valve metal extends from said anode;

forming a dielectric on said anode;

forming a cathode layer on said dielectric;

attaching an anodic conductive material to said anode lead extension;

encasing said anode, said dielectric, and said cathode layer in a non-conducting

material thereby forming an encapsulant;

exposing a portion of said anodic conductive material at a surface of said encapsulant;

adhering a preformed solid metal terminal in electrical contact with said anodic conductive material at said surface of said encapsulant.

2. The method of forming a solid electrolytic capacitor of claim 1 wherein said adhering is selected from soldering, conductive adhesive bonding, brazing, nano foil bonding, ultrasonic welding, laser welding, resistance welding and low temperature sintering.

3. The method of forming a solid electrolytic capacitor of claim 1 wherein said preformed solid metal terminal is L shaped.

4. The method of forming a solid electrolytic capacitor of claim 3 where said L shaped preformed solid metal terminal is applied to a bottom face of said encapsulant.

5. The method of forming a solid electrolytic capacitor of claim 4 wherein a portion of said L shaped preformed solid metal terminal located on said bottom face is adhered to said encapsulant with an adhesive.

6. The method of forming a solid electrolytic capacitor of claim 4 wherein said L shaped preformed solid metal terminal has a width which is at least 0.4 mm less than the maximum width of said encapsulant.

7. The method for forming a capacitor of claim 4 wherein said first face and said second face are on opposing sides of said encasement and said anode terminal and cathode terminal are symmetric.

8. A method for forming a capacitor comprising:

providing a plurality of capacitive elements wherein each capacitive element comprises a valve metal foil and an anode lead extension, wherein each foil has an inactive region and an active region wherein said active region comprises a dielectric and a conductive layer on said dielectric;

interleaving said capacitive elements with solid metal current collectors;

adhering each solid metal current collector of said solid metal current collectors to at least one said conductive layer using a conductive adhesive thereby forming an active capacitive stack;

forming an encasement of a non-conducting material with said active capacitive stack in said encasement;

exposing each said anode lead extension on a first face and exposing each said solid metal current collector on a second face of said encasement;

displacing a portion of each said exposed anode lead extension with zinc;

adhering a conductive metal to said zinc via a method selected from electroplating or electroless plating;

attaching a preformed metal cathode terminal to said exposed solid metal current collectors; and

attaching a preformed metal anode terminal to said conductive metal.

9. A method for forming a capacitor comprising:

providing a plurality of capacitive elements wherein each capacitive element of said capacitive elements comprises a valve metal foil and an anode lead extension and wherein each foil has an inactive region and an active region comprising a dielectric and a conductive layer on said dielectric;

attaching an anodic conductive material to each said valve metal foil at said inactive region;

interleaving said capacitive elements with solid metal current collectors;

adhering each solid metal current collector of said solid metal current collectors to at least one said conductive layer using a conductive adhesive therebyforming an active capacitive stack;

forming an encasement of non-conducting material with said active capacitive stack in said encasement;

exposing said anode conductive material on a first face and exposing said solid metal current collectors on a second face;

attaching a preformed solid metal cathode terminal to said exposed solid metal current collectors;

attaching a preformed solid metal anode terminal to each said anodic conductive material.

10. A method for forming a capacitor comprising:

providing a plurality of capacitive elements wherein each capacitive element comprises a valve metal foil and an anode lead extension, wherein each foil has an inactive region and an active region comprising a dielectric and a conductive layer on said dielectric;

interleaving said capacitive elements with solid metal current collectors;

adhering each solid metal current collector of said solid metal current collectors to at least one said conductive layer using a conductive adhesive thereby forming an active capacitive stack;

forming an encasement of a non-conducting material with said active capacitive stack in said encasement;

exposing each said anode lead extension of said plurality of capacitive elements on a first face thereby forming exposed anode lead extensions and exposing said solid metal current collectors on a second face; adhering a conductive metal to exposed anode lead extensions;

attaching a preformed metal cathode terminal to said exposed solid metal current collectors; and

attaching a preformed metal anode terminal to said conductive metal.

11. A solid electrolytic capacitor comprising:

at least one capacitive element comprising a valve metal anode body with an anode lead extension extending therefrom;

a dielectric layer on a surface of said anode body;

a cathode layer on said dielectric layer;

at least one solid metal current collector adhered to said cathode layer with conductive adhesive;

at least one anodic conductive material bonded to said anode lead extension; an encapsulant encasing said capacitive element and said solid metal current collector except for a portion of the said anode lead extension, said anodic conductive material, and said solid metal current collector exposed outside said encapsulant;

a preformed solid metal anodic terminal electrically connected to, and on a same surface as, said anodic conductive material; and

a preformed solid metal cathodic terminal electrically connected to, and on a same surface as, said exposed solid metal current collector.

12. A solid electrolytic capacitor comprising:

at least one capacitive element comprising a valve metal anode body with an anode lead extending there from;

a dielectric layer on a surface of said anode body;

a cathode layer on said dielectric layer;

at least one solid metal current collector adhered to said cathode layer with conductive adhesive;

an encapsulant encasing said capacitive element and said solid metal current collector except for a portion of said anode lead extension and said solid metal current collector that are exposed outside said encapsulant;

a preformed solid metal anodic terminal welded to, and on a same surface as,

said anode lead extension; and

a preformed solid metal cathodic terminal electrically connected to, and on a same surface as, said exposed solid metal current collector.

13. A solid electrolytic capacitor comprising:

at least one capacitive element wherein each capacitive element comprises a valve metal anode body with an anode lead extending there from;

a dielectric layer on a surface of said anode body;

a cathode layer on said dielectric layer;

at least one solid metal current collector adhered to said cathode layer with conductive adhesive;

an encapsulant encasing said capacitive element and said solid metal current collector except for a portion of said anode lead extension and said solid metal current collector that are exposed outside said encapsulant;

wherein an intermediate conductive bonding layer is applied on said exposed surface of said anode lead extension;

a preformed solid metal anodic terminal electrically connected to, and on a common surface with, said intermediate conductive bonding layer; and

a separate preformed solid metal cathodic terminal electrically connected to, and on a common surface with, said exposed solid metal current collector.

14. A solid electrolytic capacitor comprising:

at least one capacitive element comprising a valve metal anode body with an anode lead extending therefrom; a dielectric layer on a surface of said anode body;

a cathode layer on said dielectric layer;

an encapsulant encasing said capacitive element except for a portion of said anode lead extension that is exposed outside said encapsulant;

an intermediate conductive bonding layer applied on said exposed surface of said anode lead extension; and

a preformed solid metal anodic terminal electrically connected to, and on a same surface as, said intermediate conductive bonding layer.

15. A solid electrolytic capacitor comprising:

at least one capacitive element comprising a valve metal anode body with an anode lead extending therefrom;

a dielectric layer on a surface of said anode body;

a cathode layer on said dielectric layer;

at least one anodic conductive material bonded to said anode lead extension;

an encapsulant encasing said capacitive element except for a portion of said anode conductive material that is exposed outside said encapsulant;

a preformed solid metal anodic terminal electrically connected to, and on a same exterior surface as, said anodic conductive material.

16. A solid electrolytic capacitor comprising:

at least one capacitive element comprising a valve metal anode body with an anode lead extending there from;

a dielectric layer on a surface of said anode body;

a cathode layer on said dielectric layer;

an encapsulant encasing said capacitive element except for a portion of said anode lead extension that is exposed outside said encapsulant;

a preformed solid metal anodic terminal welded to, and on a same exterior surface as, said anodic conductive material.

17. A method of forming a solid electrolytic capacitor comprising:

forming an anode of a valve metal or conductive oxide of a valve metal wherein an anode lead extension of a valve metal or conductive oxide of a valve metal extends from said anode;

forming a dielectric on said anode;

forming a cathode layer on said dielectric;

encasing said anode, said dielectric, and said cathode layer in a non-conducting material thereby forming an encapsulant;

exposing a portion of said anode lead extension at a surface of said encapsulant;

adhering a preformed solid metal terminal in electrical contact with said anodic conductive material at said surface of said encapsulant.

18. A method for forming a capacitor comprising:

providing a plurality of capacitive elements wherein each capacitive element of said capacitive elements comprises a valve metal foil and an anode lead extension and wherein each foil has an inactive region and an active region comprising a dielectric and a conductive layer on said dielectric;

interleaving said capacitive elements with solid metal current collectors;

adhering each solid metal current collector of said solid metal current collectors to at least one said conductive layer using a conductive adhesive thereby forming an active capacitive stack;

forming an encasement of non-conducting material with said active capacitive stack in said encasement; exposing said anode lead extension on a first face and exposing said solid metal current collectors on a second face;

attaching a preformed solid metal cathode terminal to said exposed solid metal current collectors;

attaching a preformed solid metal anode terminal to each said anode lead extension.