IP Library Granted Patent US 9,502,273
Granted Patent B2
US 9,502,273 · App. 13/895,540 · Granted Nov 22, 2016

Heat treatment apparatus and heat treatment method for measuring particle concentration

Inventor: Hideo Nishihara (Kyoto, JP)
Assignee: SCREEN Holdings Co., Ltd.
H01L21/67115G01N15/00G01N15/06H01L21/67253G01N2015/1486
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Quick Facts
Patent No.
US 9,502,273
App. No.
13/895,540
Granted
Nov 22, 2016
Kind
B2
Abstract

A heat treatment apparatus includes a chamber for receiving a substrate therein, and a measurement part for measuring an air particle concentration in a processing space provided in the chamber. An air particle concentration in the processing space provided in the chamber is measured by the measurement part. The air particle concentration is correlated with the number of particles attached to a substrate received in the chamber. Accordingly, by conducting a particle test after the air particle concentration in the processing space is lowered to an air particle concentration corresponding to the number of particles existing on the substrate which can pass the particle test, the number of times the particle test should be conducted after maintenance of the heat treatment apparatus can be reduced.

Claims (11)

1. A heat treatment apparatus for heating a substrate, comprising:

a process chamber for receiving a substrate therein; and

a measurement part for introducing a gas in a processing space provided in said process chamber and measuring an air particle concentration in the gas;

a first exhaust part for exhausting said measurement part; and

a second exhaust part for exhausting said process chamber via a path different from said measurement part and said first exhaust part;

wherein, the inside diameter of said first exhaust part is smaller than the inside diameter of said second exhaust part.

2. The heat treatment apparatus according to claim 1 , further comprising:

a storage part for storing correlation information that indicates the correlation between an air particle concentration in said processing space and a number of particles attached to a substrate received in said process chamber; and

a calculation part for calculating, based on a result of the measurement by said measurement part and said correlation information, a number of particles that will be attached to a substrate intended to be received in said process chamber.

3. The heat treatment apparatus according to claim 1 , further comprising a flash lamp for heating a substrate received in said process chamber by emitting a light flash to said substrate.

4. The heat treatment apparatus according to claim 1 , further comprising a removal part for removing air particles existing in said processing space provided in said process chamber.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2015
From: DAINIPPON SCREEN MFG. CO., LTD.
To: SCREEN HOLDINGS CO., LTD.
Reel/Frame 035049/0171 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2013
From: NISHIHARA, HIDEO
To: DAINIPPON SCREEN MFG. CO., LTD.
Reel/Frame 030430/0048 →
Priority Claims (2)
JP 2012-117475 · May 23, 2012 · national
JP 2013-063384 · Mar 26, 2013 · national
Continuity (1)
Related Publication 20130315576A1 · Nov 28, 2013