Contamination removal apparatus and method
View Patent ↗A substrate dry cleaning apparatus, a substrate dry cleaning system, and a method of cleaning a substrate are disclosed. The substrate dry cleaning system includes a substrate support and a reactive species generator. The reactive species generator includes a first conduit defining a first flow channel that extends to an outlet of the first conduit, the outlet of the first conduit facing the substrate support, a first electrode, a second electrode facing the first electrode, the first flow channel disposed between the first electrode and the second electrode, a first inert wall disposed between the first electrode and the first flow channel, and a second inert wall disposed between the second electrode and the first flow channel.
1. A substrate dry cleaning apparatus, comprising:
a first conduit defining a first flow channel therein, the first conduit further defining a first exit aperture in fluid communication with the first flow channel;
a first electrode disposed in a vessel;
a second electrode facing the first electrode, the first flow channel disposed between the first electrode and the second electrode; and
a metal including indium, lead, bismuth, or combination thereof filling all of a gap between the first electrode and the vessel.
2. The substrate dry cleaning apparatus of claim 1 , wherein the metal is a lead-bismuth eutectic.
3. The substrate dry cleaning apparatus of claim 1 , wherein the vessel is comprised of quartz.
4. The substrate dry cleaning apparatus of claim 1 , wherein the first conduit is comprised of a high-temperature ceramic selected from the group consisting of quartz and sapphire.
5. The substrate dry cleaning apparatus of claim 1 , further comprising a second conduit defining a second flow channel therein, the second flow channel defining a second exit aperture in fluid communication with the second flow channel, an inner surface of the second conduit defining a constriction from a first flow area to a second flow area along a direction of flow toward the second exit aperture, the first flow area being greater than the second flow area.
6. The substrate dry cleaning apparatus of claim 5 , wherein the second flow channel is separated from the first flow channel by a wall.
7. The substrate dry cleaning apparatus of claim 6 , wherein the wall includes at least a portion of the second conduit.
8. The substrate dry cleaning apparatus of claim 6 , wherein the wall includes at least a portion of the first conduit.
9. The substrate dry cleaning apparatus of claim 5 , wherein the second conduit is disposed at least partially within the first conduit and arranged coaxially therewith.
10. The substrate dry cleaning apparatus of claim 6 , wherein the wall includes at least a portion of the first conduit.
11. The substrate dry cleaning apparatus of claim 5 , wherein the second conduit is disposed at least partially within the first conduit and arranged coaxially therewith.
12. A substrate dry cleaning apparatus, comprising:
a first conduit defining a first flow channel therein, the first conduit further defining a first exit aperture in fluid communication with the first flow channel;
a first electrode disposed in a vessel;
a second electrode facing the first electrode, the first flow channel disposed between the first electrode and the second electrode; and
a metal including indium, lead, bismuth, or combination thereof disposed between the first electrode and the second electrode, wherein the metal fills all of the gap between the first electrode and the vessel.
13. The substrate dry cleaning apparatus of claim 12 , wherein the metal is a lead-bismuth eutectic.
14. The substrate dry cleaning apparatus of claim 12 , wherein the metal is comprised of nickel.
15. The substrate dry cleaning apparatus of claim 12 , wherein the vessel is comprised of quartz.
16. The substrate dry cleaning apparatus of claim 12 , further comprising a second conduit defining a second flow channel therein, the second flow channel defining a second exit aperture in fluid communication with the second flow channel, an inner surface of second conduit defining a constriction from a first flow area to a second flow area along a direction of flow toward the second exit aperture, the first flow area being greater than the second flow area.
17. The substrate dry cleaning apparatus of claim 16 , wherein the second flow channel is separated from the first flow channel by a wall.
18. The substrate cleaning apparatus of claim 12 , wherein the first electrode is formed by coating the internal vessel with a conductive material.
19. The substrate cleaning apparatus of claim 12 , wherein the metal has a low atmospheric melting temperature.
20. The substrate cleaning apparatus of claim 1 , wherein the vessel is comprised of sapphire.
21. The substrate dry cleaning apparatus of claim 1 , wherein the metal is comprised of nickel.