IP Library Granted Patent US 8,766,874
Granted Patent B2
US 8,766,874 · App. 13/899,166 · Granted Jul 1, 2014

In-plane RFID antenna

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Quick Facts
Patent No.
US 8,766,874
App. No.
13/899,166
Granted
Jul 1, 2014
Kind
B2
Abstract

Disclosed is an apparatus and methodology for providing an RFID device for integration into a tire. A printed circuit board (PCB) is provided with notches in opposed ends of the PCB that are provided with guide portions as a part of the notches that function as threads to guide an end portion of a matching single pitch helical antenna into appropriately placed vias on the PCB. Threading of the helical antenna is assisted by use of an assembly jig having antenna guiding channels and PCB retaining positioning elements.

Claims (17)

1. An RFID device for integration into a tire, comprising:

a printed circuit board (PCB) having top and bottom surfaces delineated by opposed end portions and opposed side portions;

a plurality of conductive traces on the top surface of said PCB;

a notch formed in one end of said PCB;

a plated through via piercing the PCB from the top surface to the bottom surface;

a conductive trace element electrically coupled to said via at the top surface of said PCB, the trace element electrically coupled to the plurality of conductive traces;

a conductive solder pad electrically coupled to the via at the bottom surface of said PCB and extending for a predetermined distance in the direction of the side portions of the PCB; and

an antenna element having an end portion positioned within said notch, wherein a portion of said end portion passes through the via from the top surface to the bottom surface and is electrically connected to the conductive trace element coupled to said via at the bottom surface of the PCB.

2. The device of claim 1 , wherein the antenna element is in the same plane as the top surface of the PCB.

3. The device of claim 1 , further comprising an integrated circuit device mounted to the top surface of the PCB and electrically coupled to selected ones of the plurality of conductive traces.

4. The device of claim 1 , wherein the antenna element comprises a helically wound conductor.

5. The device of claim 4 , wherein the helically wound conductor is wound with a single pitch between turns.

6. The device of claim 5 , wherein the notch is provided with portions matching the pitch of the helically wound conductor.

7. The device of claim 6 , wherein the via is positioned within the PCB at a location corresponding to an extension of the pitch of the helically wound conductor from the matching notch portions.

8. The device of claim 1 , further comprising a non-conductive elastomeric material surrounding said PCB and at least a portion of said antenna element, and filling said notch.

9. The device of claim 8 , further comprising a bonding agent for securing said non-conductive elastomeric material to the antenna element and PCB.

10. The device of claim 1 , further comprising a second notch positioned at the opposing end of said PCB, a second plated through via piercing the PCB and a second antenna positioned within said second notch and in the plane defined by the top surface of the PCB.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2023
From: MICHELIN RECHERCHE ET TECHNIQUE S.A.
To: COMPAGNIE GÉNÉRALE DES ETABLISSEMENTS MICHELIN
Reel/Frame 065018/0154 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2014
From: SINNETT, JAY CLIFFORD; JAMES, HAROLD
To: COMPAGNIE GENERALE DES ETABLISSEMENTS MICHELIN; MICHELIN RECHERCHE ET TECHNIQUE S.A.
Reel/Frame 032168/0607 →