Method to construct a 3D semiconductor device
View Patent ↗A method to construct a semiconductor device, the method including: forming a first mono-crystallized semiconductor layer; forming a second mono-crystallized semiconductor layer including mono-crystallized semiconductor transistors; where the second mono-crystallized semiconductor layer overlays the first mono-crystallized semiconductor layer, where the first mono-crystallized semiconductor layer includes an alignment mark and the transistors are aligned to the alignment mark, and where the first mono-crystallized semiconductor layer includes logic circuits, and connecting the logic circuits to an external device using input/output (I/O) circuits, where the input/output (I/O) circuits are constructed on the second mono-crystallized semiconductor layer.
1. A method to construct a semiconductor device, the method comprising:
forming a first layer comprising mono-crystallized semiconductor and first logic circuits;
forming a second layer comprising a mono-crystallized semiconductor layer, said second layer overlying said first logic circuits;
forming transistors on said second layer;
wherein said forming transistors comprises a lithography step, said lithography step comprises an alignment to said first layer, and
connecting said first logic circuits to an external device using input/output (I/O) circuits, said input/output (I/O) circuits are constructed on said second mono-crystallized semiconductor layer.
2. The method according to claim 1 ,
wherein said first logic circuits comprise copper or aluminum interconnect, and
wherein a plurality of said transistors are connected to form second logic circuits.
3. The method according to claim 1 ,
wherein said first logic circuits comprises copper or aluminum interconnect, and
wherein at least one of said transistors is a horizontally oriented transistor.
4. The method according to claim 1 , further comprising:
etching at least a portion of said transistors in a customization step of a generic structure.
5. The method according to claim 1 ,
wherein said semiconductor device comprises a circuit that provides a wireless connection to a device that is external to said semiconductor device.
6. The method according to claim 1 ,
wherein said forming transistors comprises optical annealing.
7. The method according to claim 1 ,
wherein said forming transistors comprises gate replacement.
8. A method to construct a semiconductor device, the method comprising:
forming a first layer comprising mono-crystallized semiconductor and first logic circuits;
forming a second layer comprising a mono-crystallized semiconductor layer, said second layer overlying said first logic circuits;
forming transistors on said second layer;
wherein said forming transistors comprises a lithography step, said lithography step comprises an alignment to said first layer, and
connecting said first logic circuits to an external device using input/output (I/O) circuits, said input/output (I/O) circuits are constructed on said second mono-crystallized semiconductor layer,
wherein said input/output (I/O) circuits comprise a SerDes circuit.
9. The method according to claim 8 ,
wherein said first logic circuits comprise copper or aluminum interconnect, and
wherein a plurality of said transistors are connected to form second logic circuits.
10. The method according to claim 8 ,
wherein said semiconductor device comprises a circuit that provides a wireless connection to a device that is external to said semiconductor device.
11. The method according to claim 8 , further comprising:
etching at least a portion of said transistors in a customization step of a generic structure.
12. The method according to claim 8 , wherein said connecting comprises applying at least one Through Silicon Via (TSV).
13. The method according to claim 8 ,
wherein said forming transistors comprises optical annealing.
14. The method according to claim 8 ,
wherein said forming transistors comprises gate replacement.
15. A method to construct a semiconductor device, the method comprising:
forming a first layer comprising mono-crystallized semiconductor and first logic circuits;
forming a second layer comprising a mono-crystallized semiconductor layer, said second layer overlying said first logic circuits;
forming transistors on said second layer;
wherein said forming transistors comprises a lithography step, said lithography step comprises an alignment to said first layer,
wherein said transistors are connected to form second logic circuits, and
wherein said second logic circuits comprise a scan chain.
16. The method according to claim 15 ,
wherein said first logic circuits comprise copper or aluminum interconnect.
17. The method according to claim 15 ,
wherein said first logic circuits comprises copper or aluminum interconnect, and
wherein at least one of said transistors is a horizontally oriented transistor.
18. The method according to claim 15 , further comprising:
etching at least a portion of said transistors in a customization step of a generic structure.
19. The method according to claim 15 ,
wherein said semiconductor device comprises a circuit that provides a wireless connection to an external device.
20. The method according to claim 15 , further comprising:
connecting said first logic circuits to an external device using input/output (I/O) circuits, said input/output (I/O) circuits are constructed on said second mono-crystallized semiconductor layer.
21. The method according to claim 15 ,
wherein said forming transistors comprises gate replacement.