Semiconductor apparatus comprised of two types of transistors
A semiconductor apparatus that includes two types of transistors is disclosed. A first semiconductor chip includes the first semiconductor device of a transistor type of GaAs-HEMT, while, a second semiconductor chip includes a second semiconductor device of a transistor type GaN-HEMT. The second semiconductor device is formed on a SiC substrate, and the first semiconductor chip is mounted in an inactive region of the SiC substrate.
1. A semiconductor apparatus, comprising:
a first semiconductor chip providing a first semiconductor device therein; and
a second semiconductor chip providing a substrate made of silicon carbide (SiC), the SiC substrate including an active region and an inactive region adjacent to each other, the active region including a semiconductor layer that involves a second semiconductor device therein, the SiC substrate having a substrate via hole in the inactive region, the substrate via hole having a via metal;
wherein the first semiconductor chip is mounted in the inactive region of the SiC substrate, and
wherein the first semiconductor device includes an electrode electrically brought to a back surface of the SiC substrate through the via metal in the substrate via hole.
2. The semiconductor apparatus of claim 1 ,
wherein the second semiconductor device includes an electrode, and
wherein the SiC substrate further has another substrate via hole having a via metal that electrically brings the electrode of the second semiconductor device out to the back surface of the SiC substrate.
3. The semiconductor apparatus of claim 1 , wherein the semiconductor layer is removed from the inactive region of the SiC substrate.
4. The semiconductor apparatus of claim 1 , wherein the inactive region of the SiC substrate is implanted with argon (Ar) ions.
5. The semiconductor apparatus of claim 1 , wherein the first semiconductor device is electrically connected with the second semiconductor device with flip-chip bonding.
6. A semiconductor apparatus compromising:
a first semiconductor chip providing a first semiconductor device therein; and
a second semiconductor chip providing a substrate made of silicon carbide (SiC), the SiC substrate including an active region and an inactive region adjacent to each other, the active region including a semiconductor layer that involves a second semiconductor device therein, the inactive region of the SiC substrate mounting the first semiconductor chip thereon,
wherein the first semiconductor device is a type of GaAs high electron mobility transistor (GaAs-HEMT) and the second semiconductor device is a type of GaN high electron mobility transistor (GaAs-HEMT), and
wherein the GaAs-HEMT of the first semiconductor device constitutes a first stage transistor of a power amplifier and the Gan-HEMT of the second semiconductor device constitutes a final stage transistor of the power amplifier.
7. A method to form a semiconductor apparatus, the method comprising steps of:
growing semiconductor layers on a top surface of a semiconductor substrate made of silicon carbide (SiC), the semiconductor layers including nitride semiconductor materials and constituting an active region;
forming an inactive region in the SiC substrate;
forming electrodes in the active region to form a nitride transistor as a GaN high electron mobility transistor (GaN-HEMT), and interconnections in the inactive region of the SiC substrate; and
forming a substrate via hole from a back surface of the SiC substrate to the electrodes in the active region through the SiC substrate and the semiconductor layers, and another substrate via hole from the back surface of the SiC substrate to the interconnections in the inactive region;
providing a via metal in the substrate via hole and the another substrate via hole, and
mounting a first semiconductor chip having a GaAs high electron mobility transistor (GaAs-HEMT)on the interconnection in the inactive region of the SiC substrate.
8. The method of claim 7 ,
wherein the first semiconductor chip is mounted on the interconnection by flip-chip bonding.
9. The method of claim 7 ,
further including a step of, after providing the via metal in the substrate via holes, forming a back metal in the back surface of the SiC substrate so as to be connected to the via metal.
10. The method of claim 7 ,
wherein the step of forming the inactive region is carried out by removing the semiconductor layers to expose the SiC substrate in the inactive region.
11. The method of claim 7 ,
wherein the step of forming the inactive region is carried out by implanting argon (Ar) ions into the semiconductor layers and the SiC substrate in the inactive region.