Lighting device
View Patent ↗Providing a lighting device wherein provisions are made to be able to provide a sufficiently high dielectric strength while retaining the required heat-sink property even when a module substrate with a plurality of LED elements mounted thereon is reduced in size. A lighting device includes a module substrate on an upper surface of which are mounted a plurality of LED elements, a heat-sink member, having a raised portion, for dissipating heat generated by the plurality of LED elements, and an insulating sheet formed with an opening and interposed between a portion of the lower surface of the module substrate and the heat-sink member, and wherein the raised portion is formed so as to be located via the opening in close proximity to the lower surface of a region where the plurality of LED elements are mounted on the module substrate.
1. A lighting device comprising:
a module substrate having an upper surface of which are mounted a plurality of LED elements;
a heat-sink member, having a raised portion, for dissipating heat generated by said plurality of LED elements; and
an insulating sheet formed with an opening and interposed between a portion of a lower surface of said module substrate and said heat-sink member,
wherein said raised portion is formed so as to be located via said opening in close proximity to a lower surface of a region where said plurality of LED elements are mounted on said module substrate, and
wherein said raised portion is in contact with the lower surface of said region where said plurality of LED elements are mounted on said module substrate.
2. The lighting device according to claim 1 , wherein said insulating sheet is thicker than said raised portion.
3. The lighting device according to claim 1 , wherein said plurality of LED elements are packaged by being covered with a resin.
4. The lighting device according to claim 3 , wherein a portion of a lighting circuit for said plurality of LED elements is mounted on said module substrate.
5. The lighting device according to claim 4 , wherein said lighting circuit includes a diode bridge circuit, a bypass circuit, and an LED array formed by connecting said plurality of LED elements in series,
said diode bridge circuit is provided with a terminal for connecting to a utility AC power supply,
said bypass circuit is provided with a first current input terminal, a second current input terminal, and a current output terminal, and
said LED array is constructed from a plurality of sub-LED arrays, and wherein
said first current input terminal of said bypass circuit is connected to a connection node between said sub-LED arrays, and a current input to said first current input terminal is controlled on and off according to a current input to said second current input terminal.
6. The lighting device according to claim 5 , wherein said bypass circuit includes a depletion-mode FET, and wherein a drain of said FET is connected to said first current input terminal, and a source of said FET is connected to said second current input terminal.
7. The lighting device according to claim 1 , wherein said module substrate is formed from a ceramic as a base material.
8. The lighting device according to claim 7 , wherein said ceramic is white in color.
9. A lighting device comprising:
a module substrate having an upper surface of which are mounted a plurality of LED elements;
a heat-sink member, having a raised portion, for dissipating heat generated by said plurality of LED elements; and
an insulating sheet formed with an opening and interposed between a portion of a lower surface of said module substrate and said heat-sink member,
wherein said raised portion is formed so as to be located via said opening in close proximity to a lower surface of a region where said plurality of LED elements are mounted on said module substrate, and
wherein said insulating sheet is formed in the shape of a box.
10. The lighting device according to claim 9 , wherein a thermally conductive resin layer is interposed between the lower surface of said module substrate and said raised portion.
11. A lighting device comprising:
a module substrate having an upper surface of which are mounted a plurality of LED elements;
a heat-sink member, having a raised portion, for dissipating heat generated by said plurality of LED elements; and
an insulating sheet formed with an opening and interposed between a portion of a lower surface of said module substrate and said heat-sink member,
wherein said raised portion is formed so as to be located via said opening in close proximity to a lower surface of a region where said plurality of LED elements are mounted on said module substrate,
wherein said module substrate is provided with a dam member enclosing said plurality of LED elements, and said LED elements are covered with a fluorescent resin, and
wherein a portion of a lighting circuit is mounted on said module substrate in a region outside said dam member, and said portion of said lighting circuit is covered with said fluorescent resin.
12. The lighting device according to claim 11 , wherein a portion of said dam member is used as a portion of a dam member enclosing said portion of said lighting circuit.
13. The lighting device according to claim 11 , wherein said lighting circuit includes a diode bridge circuit, a bypass circuit, and an LED array formed by connecting said plurality of LED elements in series,
said diode bridge circuit is provided with a terminal for connecting to a utility AC power supply,
said bypass circuit is provided with a first current input terminal, a second current input terminal, and a current output terminal, and
said LED array is constructed from a plurality of sub-LED arrays, and wherein
said first current input terminal of said bypass circuit is connected to a connection node between said sub-LED arrays, and a current input to said first current input terminal is controlled on and off according to a current input to said second current input terminal.
14. The lighting device according to claim 13 , wherein said bypass circuit includes a depletion-mode FET, and wherein a drain of said FET is connected to said first current input terminal, and a source of said FET is connected to said second current input terminal.
15. The lighting device according to claim 12 , wherein said lighting circuit includes a diode bridge circuit, a bypass circuit, and an LED array formed by connecting said plurality of LED elements in series,
said diode bridge circuit is provided with a terminal for connecting to a utility AC power supply,
said bypass circuit is provided with a first current input terminal, a second current input terminal, and a current output terminal, and
said LED array is constructed from a plurality of sub-LED arrays, and wherein
said first current input terminal of said bypass circuit is connected to a connection node between said sub-LED arrays, and a current input to said first current input terminal is controlled on and off according to a current input to said second current input terminal.
16. The lighting device according to claim 15 , wherein said bypass circuit includes a depletion-mode FET, and wherein a drain of said FET is connected to said first current input terminal, and a source of said FET is connected to said second current input terminal.
17. The lighting device according to claim 11 , wherein a thermally conductive resin layer is interposed between the lower surface of said module substrate and said raised portion.
18. A lighting device comprising:
a module substrate having an upper surface of which are mounted a plurality of LED elements;
a heat-sink member, having a raised portion, for dissipating heat generated by said plurality of LED elements; and
an insulating sheet formed with an opening and interposed between a portion of a lower surface of said module substrate and said heat-sink member,
wherein said raised portion is formed so as to be located via said opening in close proximity to a lower surface of a region where said plurality of LED elements are mounted on said module substrate,
a holder, provided with a spring contact, for fixedly holding said module substrate in position,
wherein said spring contact presses a power supply terminal on said module substrate and provides an electrical connection between said power supply terminal and external circuitry.
19. The lighting device according to claim 18 , wherein a thermally conductive resin layer is interposed between the lower surface of said module substrate and said raised portion.