Solder joint for an electrical conductor and a window pane including same
View Patent ↗A solder joint is disposed on an electrical conductor which comprises silver. The solder joint comprises bismuth and tin. The solder joint has a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone. The bismuth-rich solder bulk is disposed adjacent to the silver-solder reaction zone. The solder joint comprises a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least the bismuth-rich solder bulk of the solder joint. A window pane comprising the solder joint is also disclosed.
1. A solder joint disposed on an electrical conductor which comprises silver, said solder joint comprising:
bismuth and tin,
wherein said solder joint is formed from a first solder composition comprising bismuth and from a second solder composition comprising tin;
a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone,
wherein said bismuth-rich solder bulk is disposed adjacent to said silver-solder reaction zone; and
a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least said bismuth-rich solder bulk.
2. The solder joint of claim 1 wherein said solder joint and said electrical conductor form a solder-conductor interface therebetween.
3. The solder joint of claim 2 having a thickness of said solder joint extending from said solder-conductor interface to a surface opposite said solder-conductor interface wherein each of said bismuth-rich grains has a dimension of no greater than ¼ of said thickness of said solder joint.
4. The solder joint of claim 3 wherein said bismuth-rich solder bulk extends at least ⅕ of said thickness of said solder joint.
5. The solder joint of claim 2 wherein said solder-conductor interface of said solder joint comprises bismuth and said silver-solder reaction zone with said bismuth disposed throughout said silver-solder reaction zone.
6. The solder joint of claim 1 wherein said microstructure of said solder joint further comprises a tin-rich phase disposed adjacent to said bismuth-rich solder bulk and opposite said silver-solder reaction zone.
7. The solder joint of claim 1 wherein said first solder composition comprises bismuth in an amount of from 10 to 80 parts by weight based on 100 parts by weight of said first solder composition.
8. The solder joint of claim 1 wherein said first solder composition further comprises tin.
9. The solder joint of claim 8 wherein said first solder composition comprises tin in an amount of from 20 to 90 parts by weight based on 100 parts by weight of said first solder composition.
10. The solder joint of claim 1 wherein said second solder composition comprises tin in an amount of from 95 to 100 parts by weight based on 100 parts by weight of said second solder composition.
11. The solder joint of claim 1 formed by the steps of:
bonding said first solder composition to said electrical conductor to form a first solder layer, wherein said first solder composition comprises bismuth in an amount of from 10 to 80 parts by weight based on 100 parts by weight of said first solder composition; and
bonding said second solder composition to said first solder layer, thereby forming said solder joint, wherein said second solder composition comprises tin in an amount of from 95 to 100 parts by weight based on 100 parts by weight of said second solder composition.
12. The solder joint of claim 1 substantially free of lead.
13. The solder joint of claim 1 substantially free of indium.
14. A window pane comprising:
a substrate formed from glass;
an electrical conductor comprising silver and disposed across a region of said substrate;
a solder joint disposed on said electrical conductor and comprising;
bismuth and tin,
wherein said solder joint is formed from a first solder composition comprising bismuth and from a second solder composition comprising tin,
a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone,
wherein said bismuth-rich solder bulk is disposed adjacent to said silver-solder reaction zone, and
a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least said bismuth-rich solder bulk; and
an electrical connector disposed on said solder joint with said electrical connector operatively connected to and in electrical communication with said electrical conductor through said solder joint.
15. The window pane of claim 14 wherein said solder joint and said electrical conductor form a solder-conductor interface therebetween.
16. The window pane of claim 15 wherein said solder joint and said electrical connector form a solder-connector interface therebetween with a thickness of said solder joint extending from said solder-conductor interface to said solder-connector interface wherein each of said bismuth-rich grains has a dimension of no greater than ¼ of said thickness of said solder joint.
17. The window pane of claim 16 wherein said bismuth-rich solder bulk of said solder joint extends at least ⅕ of said thickness of said solder joint.
18. The window pane of claim 15 wherein said solder-conductor interface of said solder joint comprises bismuth and said silver-solder reaction zone with said bismuth disposed throughout said silver-solder reaction zone.
19. The window pane of claim 14 wherein said microstructure of said solder joint further comprises a tin-rich phase disposed adjacent to said bismuth-rich solder bulk and opposite said silver-solder reaction zone.
20. The window pane of claim 14 wherein said first solder composition of said solder joint comprises bismuth in an amount of from 10 to 80 parts by weight based on 100 parts by weight of said first solder composition.
21. The window pane of claim 14 wherein said first solder composition of said solder joint further comprises tin.
22. The window pane of claim 21 wherein said first solder composition of said solder joint comprises tin in an amount of from 20 to 90 parts by weight based on 100 parts by weight of said first solder composition.
23. The window pane of claim 14 wherein said second solder composition of said solder joint comprises tin in an amount of from 95 to 100 parts by weight based on 100 parts by weight of said second solder composition.
24. The window pane of claim 14 wherein said solder joint is formed by the steps of:
bonding said first solder composition to said electrical conductor to form a first solder layer, wherein said first solder composition comprises bismuth in an amount of from 10 to 80 parts by weight based on 100 parts by weight of said first solder composition;
bonding said second solder composition to said electrical connector to form a second solder layer, wherein said second solder composition comprises tin in an amount of from 95 to 100 parts by weight based on 100 parts by weight of said second solder composition; and
bonding said first solder layer and said second solder layer together to form said solder joint.
25. The window pane of claim 14 wherein said solder joint is substantially free of lead.
26. The window pane of claim 14 wherein said solder joint is substantially free of indium.
27. An electrical device comprising:
a first electrical conductor comprising silver;
a solder joint disposed on said first electrical conductor and comprising;
bismuth and tin,
wherein said solder joint is formed from a first solder composition comprising bismuth and from a second solder composition comprising tin,
a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone,
wherein said bismuth-rich solder bulk is disposed adjacent to said silver-solder reaction zone, and
a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least said bismuth-rich solder bulk; and
a second electrical conductor disposed on said solder joint with said second electrical conductor operatively connected to and in electrical communication with said first electrical conductor through said solder joint.
28. The electrical device of claim 27 wherein said solder joint is formed by the steps of:
bonding said first solder composition to said first electrical conductor to form a first solder layer, wherein said first solder composition comprises bismuth in an amount of from 10 to 80 parts by weight based on 100 parts by weight of said first solder composition;
bonding said second solder composition to said first solder layer to form a second solder layer, wherein said second solder composition comprises tin in an amount of from 95 to 100 parts by weight based on 100 parts by weight of said second solder composition; and
bonding said second electrical conductor to said second solder layer to form said solder joint.
29. The electrical device of claim 27 wherein said solder joint is formed by the steps of:
bonding said first solder composition to said first electrical conductor to form a first solder layer, wherein said first solder composition comprises bismuth in an amount of from 10 to 80 parts by weight based on 100 parts by weight of said first solder composition;
bonding said second solder composition to said second electrical conductor to form a second solder layer, wherein said second solder composition comprises tin in an amount of from 95 to 100 parts by weight based on 100 parts by weight of said second solder composition; and
bonding said first solder layer and said second solder layer together to form said solder joint.
30. The electrical conductor of claim 27 wherein:
said first solder composition comprises bismuth in an amount of from 10 to 80 parts by weight based on 100 parts by weight and tin in an amount of from 20 to 90 parts by weight, each based on 100 parts by weight of said first solder composition; and
said second solder composition comprises tin in an amount of from 95 to 100 parts by weight based on 100 parts by weight of said second solder composition.