Aggregation of semiconductor devices and the method thereof
An aggregation of semiconductor devices, comprising: a first layer comprising a first surface and a second surface; a second layer comprising a first region and a second region; and a plurality of semiconductor devices disposed between the first layer and the second region wherein a shape of the second region comprises a curve and a mark.
1. An aggregation of semiconductor devices, comprising:
a first layer comprising a first surface and a second surface;
a second layer comprising a first region and a second region; and
a plurality of semiconductor devices disposed between the first layer and the second region wherein a shape of the second region comprises a curve and a mark, wherein the first layer is capable of being expanded to over 2 times of the original area size of the first layer.
2. An aggregation of semiconductor devices according to claim 1 , wherein the plurality of semiconductor devices comprises a LED chip or a photovoltaic chip.
3. An aggregation of semiconductor devices according to claim 1 , wherein the mark comprises a flat side.
4. An aggregation of semiconductor devices according to claim 1 , further comprises a tag on a corner of the first layer.
5. An aggregation of semiconductor devices according to claim 1 , wherein the shape is approximately a circle.
6. An aggregation of semiconductor devices according to claim 1 , wherein the farthest straight-line distance between any two points of the shape is not greater than 15 cm.
7. An aggregation of semiconductor devices according to 1 , further comprises an adhesive glue layer between the first layer and the second layer.
8. An aggregation of semiconductor devices according to 7 , wherein the plurality of semiconductor devices is adhered to the adhesive glue layer.
9. An aggregation of semiconductor devices according to 7 , wherein the first layer is adhered to the second layer by the adhesive glue layer.
10. An aggregation of semiconductor devices according to claim 7 , wherein each of the plurality of semiconductor devices comprises a back surface and an upper surface, and the back surface is adhered to the adhesive glue layer.
11. An aggregation of semiconductor devices according to claim 10 , wherein each of the plurality of semiconductor devices further comprises a conductive pad on the upper surface.
12. An aggregation of semiconductor devices according to claim 3 , wherein the semiconductor devices are aligned to each other.
13. An aggregation of semiconductor devices according to claim 12 , wherein a distance between adjacent two of the semiconductor devices is between 50 μm and 5 mm.
14. An aggregation of semiconductor devices according to claim 12 , wherein the plurality of semiconductor devices is arranged as a column.
15. An aggregation of semiconductor devices according to claim 14 , wherein the column is parallel to the mark.
16. An aggregation of semiconductor devices according to claim 1 , wherein the material of the second layer comprises Supercalendered Kraft paper (SCK), clay coated Kraft paper (CCK), machine finished Kraft paper (MFK), machine glazed paper (MG), PVC, PE, PP, PU, PEV, or the mixture thereof.