Light emitting diode package and method of manufacturing the same
A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips, and a plurality of lead frames in the package body, wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first LED chip, a second lead frame electrically connected to a second electrode of the first LED chip and a second electrode of a second LED chip, a third lead frame electrically connected to a first electrode of the second LED chip, and fourth lead frame electrically connected to a second electrode of a third LED chip. Further, ends of the lead frames are exposed outside of the package body and penetrate the package body, and the first electrodes are P electrodes and the second electrodes are N electrodes.
1. A light emitting diode package comprising:
a package body with a cavity, the package body comprising at least two protrusion portions and a recess portion disposed between the at least two protrusion portions;
a plurality of electrodes on the package body;
a plurality of light emitting diode (LED) chips in the cavity, the plurality of LED chips electrically connected to the plurality of electrodes;
a phosphor disposed on the plurality of LED chips; and
a plurality of wires electrically connected to the plurality of LED chips in common,
wherein a bottom portion of at least one of the plurality of electrodes is exposed through the recess portion, and
wherein the bottom portion exposed through the recess portion is disposed between the at least two protrusion portions.
2. The light emitting diode package according to claim 1 , wherein the bottom portion of the at least one of the plurality of electrodes exposed through the recess portion vertically overlaps with at least one of the plurality of LED chips, and
wherein a lateral width of the bottom portion of the at least one of the plurality of electrodes overlapped with the at least one of the plurality of LED chips is smaller than a lateral width of the at least one of the plurality of LED chips overlapped with the bottom portion of the at least one of the plurality of electrodes.
3. The light emitting diode package according to claim 1 , wherein the bottom portion of the at least one of the plurality of electrodes is substantially flush with a bottom surface of the package body.
4. The light emitting diode package according to claim 1 , wherein a number of the plurality of electrodes on the package body is smaller than a number of the plurality of electrodes of the plurality of LED chips.
5. The light emitting diode package according to claim 1 , wherein the plurality of LED chips comprises at least one horizontal LED chip in a horizontal structure.
6. The light emitting diode package according to claim 1 , wherein a side surface of the cavity is formed so as to lean outward at a 105-120 degree angle.
7. The light emitting diode package according to claim 1 , further comprising a mold member in the cavity,
wherein the phosphor is disposed in the mold member.
8. The light emitting diode package according to claim 7 , wherein the mold member is formed of silicon or epoxy resin and has one of a flat shape, a concave lens shape, or a convex lens shape.
9. The light emitting diode package according to claim 1 , wherein the package body comprises a first portion, a second portion and a third portion, the second portion disposed between the first portion and the third portion, and
wherein the recess portion is disposed in the second portion.
10. A light emitting diode package comprising:
a package body with a cavity, the package body comprising at least two protrusion portions and a recess portion disposed between the at least two protrusion portions;
a plurality of electrodes on the package body;
a plurality of light emitting diode (LED) chips in the cavity, the plurality of LED chips electrically connected to the plurality of electrodes; and
a plurality of wires electrically connected to the plurality of LED chips in common,
wherein a bottom portion of at least one of the plurality of electrodes is exposed through the recess portion,
wherein the bottom portion of the at least one of the plurality of electrodes is substantially flush with a bottom surface of the package body, and
wherein the bottom portion of the at least one of the plurality of electrodes exposed through the recess portion is surrounded by the package body.
11. The light emitting diode package according to claim 10 , further comprising a mold member in the cavity and a phosphor disposed in the mold member,
wherein the at least one of the plurality of electrodes on the package body contacts the mold member or the phosphor.
12. The light emitting diode package according to claim 10 , wherein the package body comprises a first portion, a second portion and a third portion, the second portion disposed between the first portion and the third portion, and
wherein the recess portion is disposed in the second portion.
13. A light emitting diode package comprising:
a package body with a cavity, the package body comprising at least two protrusion portions and a recess portion disposed between the at least two protrusion portions;
a plurality of electrodes on the package body;
a plurality of light emitting diode (LED) chips in the cavity, the plurality of LED chips electrically connected to the plurality of electrodes; and
a plurality of wires electrically connected to the plurality of LED chips,
wherein at least one of the plurality of electrodes is exposed through the recess portion,
wherein a bottom portion of the at least one of the plurality of electrodes is exposed through the recess portion,
wherein a side surface of the cavity is formed so as to lean outward at a 105-120 degree angle, and
wherein the bottom portion exposed through the recess portion is disposed at a center of the package body.
14. The light emitting diode package according to claim 13 , wherein the bottom portion of the at least one of the plurality of electrodes is substantially flush with a bottom surface of the package body.
15. The light emitting diode package according to claim 13 , wherein the plurality of wires is electrically connected to the plurality of LED chips in common.
16. The light emitting diode package according to claim 1 , wherein the at least one of the plurality of electrodes whose bottom portion is exposed through the recess portion penetrates the package body.
17. The light emitting diode package according to claim 1 , wherein a width of the recess portion is larger than a width of the at least one of the plurality of electrodes whose bottom portion is exposed through the recess portion.
18. The light emitting diode package according to claim 1 , wherein the recess portion is disposed on a substantially center portion of the package body, and
the at least one of the plurality of electrodes whose bottom portion is exposed through the recess portion is disposed on a substantially center portion of the recess portion.
19. The light emitting diode package according to claim 1 , wherein the at least one of the plurality of electrodes whose bottom portion is exposed through the recess portion is vertically overlapped with at least one of the plurality of LED chips.
20. The light emitting diode package according to claim 1 , wherein the exposed bottom portion of the at least one of the plurality of electrodes is spaced apart from both side surfaces of the recess.
21. The light emitting diode package according to claim 1 , wherein a lateral width of the package body is greater than a maximum lateral width of the at least one of the plurality of electrodes.
22. The light emitting diode package according to claim 1 , wherein the bottom portion exposed through the recess portion is not exposed to an outside surface of the package body.
23. The light emitting diode package according to claim 1 , wherein the bottom portion exposed through the recess portion is not extended to a lateral surface of the package body.