IP Library Granted Patent US 9,172,473
Granted Patent B2
US 9,172,473 · App. 13/916,406 · Granted Oct 27, 2015

Active linear amplifier inside transmitter module

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Quick Facts
Patent No.
US 9,172,473
App. No.
13/916,406
Granted
Oct 27, 2015
Kind
B2
Abstract

In one example embodiment, a transmitter module includes a header electrically coupled to a chassis ground. First and second input nodes are configured to receive a differential data signal. A buffer stage has a first node coupled to the first input node and a second node coupled to the second input node. An amplifier stage has a fifth node coupled to a third node of the buffer stage and a sixth node coupled to a signal ground that is not coupled to the chassis ground. An optical transmitter has an eighth node coupled to a seventh node of the amplifier stage and a ninth node configured to be coupled to a voltage source. A bias circuit is configured to couple a fourth node of the buffer stage to a bias current source.

Claims (26)

1. A transmitter module comprising:

a buffer circuit including a differential amplifier configured to receive a differential signal including a first input signal and a second input signal complementary to the first input signal and to output a single-ended signal on an output node;

a bias circuit coupled to the buffer circuit, the bias circuit including a thermal chirp compensation circuit;

an amplifier circuit coupled to the output node and configured to linearly amplify the single-ended signal; and

an optical transmitter coupled to the amplifier circuit and configured to be driven by the amplified single-ended signal.

2. The transmitter module of claim 1 , further comprising a header, upon which the differential amplifier, the amplifier circuit, and the optical transmitter are mounted, the header being electrically coupled to a chassis ground, wherein the amplifier circuit is not coupled to the chassis ground.

3. The transmitter module of claim 2 , wherein the amplifier circuit is coupled to a signal ground that is not coupled to the chassis ground.

4. The transmitter module of claim 1 , wherein the buffer circuit further includes a buffer transistor coupled between the differential amplifier and the amplifier circuit.

5. The transmitter module of claim 1 , wherein, in operation, the first and second input signals are received from a laser driver configured to perform waveform shaping on the first and second input signals and the linearly amplified single-ended signal preserves the waveform shaping performed by the laser driver.

6. A transmitter optical subassembly that includes the transmitter module of claim 1 .

7. A transmitter module comprising:

a differential amplifier including:

a first differential transistor that includes a base, the base configured to receive a first input signal of a differential signal pair;

a second differential transistor that includes a base, the base configured to receive a second input signal of the differential signal pair that is complementary to the first input signal;

a first emitter resistor coupled between an emitter of the first differential transistor and a current source;

a second emitter resistor coupled between an emitter of the second differential transistor and the current source;

a first collector resistor coupled to a collector of the first differential transistor at a first node; and

a second collector resistor coupled to a collector of the second differential transistor at a second node, the first and second collector resistors being coupled to a third node;

a linear amplifier circuit configured to receive a single-ended signal provided by the first node;

a bias circuit including a thermal chirp compensation circuit, the bias circuit being coupled to the third node and the bias circuit being configured to provide an adjusted bias voltage to the third node; and

an optical transmitter coupled to the linear amplifier circuit.

8. The transmitter module of claim 7 , further comprising a header, upon which the differential amplifier, the linear amplifier circuit, and the optical transmitter are mounted, the header being electrically coupled to a chassis ground, wherein the linear amplifier circuit is not coupled to the chassis ground.

9. The transmitter module of claim 7 , further comprising a buffer circuit that includes the differential amplifier, the buffer circuit coupled to the linear amplifier circuit and configured to provide the single-ended signal to the linear amplifier circuit.

10. The transmitter module of claim 9 , wherein the buffer circuit further comprises a buffer transistor, a base of the buffer transistor coupled to the first node and an emitter of the buffer transistor coupled to the linear amplifier circuit.

11. The transmitter module of claim 10 , wherein the emitter of the buffer transistor is further coupled to a buffer resistor and a collector of the buffer transistor is coupled to a voltage source.

12. The transmitter module of claim 10 , wherein the linear amplifier circuit includes a amplifying transistor, a base of the amplifying transistor coupled to the emitter of the buffer transistor and a collector of the amplifying transistor coupled to the optical transmitter.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2013
From: NGUYEN, THE'LINH; DAGHIGHIAN, HENRY M.
To: FINISAR CORPORATION
Reel/Frame 030599/0084 →