Granted Patent B2

US 8,750,654 · App. 13/919,396 · Granted Jun 10, 2014

Abstract

Claims (44)

1. A method of fabricating an optical device, comprising:

providing a substrate having a first optical waveguide thereon, the first optical waveguide having a first cladding layer;

forming a second cladding layer with a wedge-like portion on the first cladding layer by (i) forming a layer of cladding material over the first optical waveguide and (ii) subjecting said layer of cladding material to a wet-etch process to form from said layer of cladding material the wedge-like portion;

forming a core of a second optical waveguide on the wedge-like portion; and

forming an array of cavities in the core of the second optical waveguide to define therein a waveguide grating.

2. The method of claim 1 , further comprising forming on the substrate an optical signal-processing (OSP) circuit, wherein:

the first optical waveguide is optically coupled to the OSP circuit;

the OSP circuit comprises at least one active optical element; and

the first and second optical waveguides, the waveguide grating, and the OSP circuit are parts of a photonic integrated circuit (PIC) formed on the substrate.

3. The method of claim 1 , wherein, for a predetermined operating wavelength, an offset distance between the waveguide grating and an interface of a cladding of the first optical waveguide with a cladding of the second waveguide is selected to cause constructive interference between (i) light of said operating wavelength diffracted by the waveguide grating toward the interface and then reflected back by the interface and (ii) light of said operating wavelength diffracted by the waveguide grating in a direction collinear with a propagation direction of the reflected light.

4. The method of claim 1 , wherein

a core of the first optical waveguide comprises a ternary, quaternary, or quinary group III-V alloy;

the first cladding layer comprises a binary group III-V compound;

the core of the second waveguide comprises silicon; and

the wedge-like portion comprises silicon oxide.

5. The method of claim 1 , further comprising forming a multilayered structure having the substrate, a core of the first optical waveguide, the first cladding layer, the second cladding layer, the core of the second optical waveguide, and a third cladding layer by:

depositing or growing a first core layer on the substrate;

patterning and etching the first core layer in accordance with a footprint layout of the first optical waveguide to form the core of the first optical waveguide;

depositing or growing the first cladding layer over the core of the first optical waveguide and the substrate;

said forming the second cladding layer with the wedge-like portion on the first cladding layer;

depositing or growing a second core layer over the first cladding layer and the second cladding layer with the wedge-like portion;

patterning and etching the second core layer in accordance with a footprint layout of the second optical waveguide to form the core of the second optical waveguide;

said forming the array of cavities in the core of the second optical waveguide; and

depositing or growing the third cladding layer over the core of the second optical waveguide, the second cladding layer with the wedge-like portion, and the first cladding layer.

6. The method of claim 5 , wherein:

the first cladding layer comprises a first material; and

the second cladding layer comprises a second material different from the first material.

7. The method of claim 6 , wherein the substrate comprises a third material different from the first material and from the second material.

8. The method of claim 6 , wherein the third cladding layer comprises a third material different from the first and second materials.

9. The method of claim 8 , wherein the substrate comprises a fourth material different from the first, second, and third materials.

10. The method of claim 5 , wherein said patterning and etching the first core layer comprises forming a laterally tapered portion of the core of the first optical waveguide.

11. The method of claim 5 , wherein:

the first core layer is directly connected to the substrate;

the first cladding layer is directly connected to the first core layer;

the second cladding layer is directly connected to the first cladding layer;

the second core layer is directly connected to the second cladding layer; and

the third cladding layer is directly connected to the second core layer.

12. The method of claim 11 , wherein:

a portion of the second core layer is directly connected to the first cladding layer; and

a portion of the third cladding layer is directly connected to the first cladding layer.

13. The method of claim 1 , wherein an index-of-refraction contrast of the second optical waveguide is greater than an index-of-refraction contrast of the first optical waveguide.

14. The method of claim 1 , wherein the first cladding layer has a thickness that causes the first and second optical waveguides to be optically coupled to each other via an evanescent field.

15. The method of claim 1 , further comprising forming a photonic integrated circuit on the substrate, wherein the photonic integrated circuit comprises the first optical waveguide, the second optical waveguide, and the waveguide grating.

16. The method of claim 15 , wherein the photonic integrated circuit comprises at least one active optical element.

Assignments (10)