Enhancing operation of laminate waveguide structures using an electrically conductive fence

1. A system operative to enhance propagation of millimeter-waves inside a laminate structure waveguide, comprising:

a laminate waveguide structure embedded inside a printed circuit board and comprising a primary electrically conductive surface operative to guide millimeter-waves through said laminate waveguide structure; and

an electrically conductive fence, embedded inside said printed circuit board and located outside of the laminate waveguide structure, said electrically conductive fence operative to reflect the millimeter-waves, which escape said laminate waveguide structure due to leakage associated with said primary conductive surface, back toward said laminate waveguide structure, thereby enhancing propagation of said millimeter-waves inside said laminate waveguide structure; wherein said electrically conductive fence comprises a secondary electrically conductive plating, applied on insulating walls of a secondary cavity located outside of said laminate waveguide structure.

2. The system of claim 1 , wherein:

said printed circuit board comprising first and second laminas;

said laminate waveguide structure embedded through at least said first and second laminas;

said laminate waveguide structure comprising a hole extending through said first and second laminas, such that said hole forms a wall inside said printed circuit board; and

said primary electrically conductive surface comprising an electrically conductive plating applied on at least parts of said wall.

3. The system of claim 2 , wherein the first lamina is placed on top of the second lamina.

4. The system of claim 1 , wherein:

said printed circuit board comprising first and seconds laminas;

said laminate waveguide structure embedded through at least said first and second laminas; and

said primary electrically conductive surface comprising an electrically conductive plating, applied on insulating walls of a cavity formed perpendicularly through said first and second laminas, and said cavity is configured to guide the millimeter-waves from one side of the cavity to the other side of the cavity.

5. The system of claim 4 , wherein the first lamina is placed on top of the second lamina.

6. The system of claim 1 , wherein said laminate waveguide structure is dimensioned in such a manner as to facilitate guidance of millimeter-waves having frequencies above 30 GHz.

7. A system operative to enhance propagation of millimeter-waves inside a laminate structure waveguide, comprising:

a laminate waveguide structure embedded inside a printed circuit board and comprising a primary electrically conductive surface operative to guide said millimeter-waves through said laminate waveguide structure; and

an electrically conductive fence, embedded inside said printed circuit board and located outside of the laminate waveguide structure, said electrically conductive fence operative to reflect the millimeter-waves, which escape said laminate waveguide structure due to leakage associated with said primary conductive surface, back toward said laminate waveguide structure, thereby enhancing propagation of said millimeter-waves inside said laminate waveguide structure;

wherein said electrically conductive fence is located a distance X from said primary electrically conductive surface, and said distance X is operative to produce a standing millimeter-wave between said primary electrically conductive surface and said electrically conductive fence.

8. The system of claim 7 , wherein said distance X equals to one-half of a wavelength of said millimeter-waves.

9. A system operative to enhance electrical coupling between a probe and a laminate waveguide structure, comprising:

a printed circuit board comprising at least first and second laminas, in which the second lamina is a prepreg bonding lamina operative to bond the first lamina with other laminas of the printed circuit board;

said probe printed on said first lamina belonging to the printed circuit board, said probe operative to generate millimeter-waves;

the laminate waveguide structure embedded through at least the first and second laminas and comprising a primary electrically conductive surface operative to capture and guide millimeter-waves generated by the probe;

an electrically conductive fence, embedded inside said printed circuit board and located outside of the laminate waveguide structure, said electrically conductive fence operative to reflect said millimeter-waves, which escape said laminate waveguide structure due to leakage associated with said primary electrically conductive surface, back toward said laminate waveguide structure, thereby enhancing electrical coupling between said probe and said laminate waveguide structure;

wherein said laminate waveguide structure comprises a hole cut substantially perpendicularly through the first and second laminas, such that said cut (i) is made around the probe and (ii) forms a wall inside the printed circuit board; and

said primary electrically conductive surface comprises an electrically conductive plating, applied on parts of the wall that do not directly surround the probe.

10. The system of claim 9 , wherein the first lamina is placed on top of the second lamina and the hole extends substantially perpendicularly through the first and second laminas.

11. The system of claim 9 , wherein said electrically conductive fence comprises a series of plated through-holes passing through said printed circuit board.

12. The system of claim 11 , further comprising a transmission line printed on the first lamina as an extension of said probe, wherein said transmission line is operative to feed said probe with electrical signals corresponding to said millimeter-waves.

13. The system of claim 12 , wherein said series of plated through-holes is split into a first series and a second series of plated through-holes, such that said transmission line is located between said first series of plated through-holes and said second series of plated through-holes, thereby allowing said transmission line to pass through said electrically conductive fence and to connect with said probe.

14. The system of claim 13 , wherein said leakage associated with said primary electrically conductive surface is a result of said primary electrically conductive plating not applied on parts of the wall that directly surround the probe.