IP Library Granted Patent US 9,385,424
Granted Patent B2
US 9,385,424 · App. 13/920,237 · Granted Jul 5, 2016

Three-dimensional integrated structure comprising an antenna

Inventors: Pierre Bar (Grenoble, FR); Laurent Dussopt (Grenoble, FR); Jean-François Carpentier (Grenoble, FR)
Assignees: STMicroelectronics SA; Commissariat A L'Energie Atomique et aux Energies Alternatives
H01Q1/50H01L23/49822H01L23/552H01L23/66H01Q1/243H01Q9/0457H01Q23/00H01L23/49816H01L24/11H01L24/13H01L24/16H01L24/29H01L24/32H01L24/73H01L2223/6627H01L2223/6677H01L2224/0401H01L2224/05082H01L2224/05166H01L2224/05187H01L2224/05647H01L2224/11462H01L2224/13147H01L2224/16225H01L2224/16227H01L2224/2919H01L2224/32225H01L2224/73204H01L2924/10253H01L2924/14H01L2924/157H01L2924/15192H01L2924/15321H01L2924/15788
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Quick Facts
Patent No.
US 9,385,424
App. No.
13/920,237
Granted
Jul 5, 2016
Kind
B2
Abstract

The three-dimensional integrated structure including a support element, an interface device connected to the support element by first electrically conductive connection, an integrated circuit arranged between the support element and the interface device and connected to the interface device by second electrically conductive connection, a filler region between the second electrically conductive connection and between the interface device and the integrated circuit, and an antenna, having a radiating element in electromagnetic coupling with an excitation element through the interconnection of a slot, the antenna being distributed over the interface device and the integrated circuit.

Claims (9)

1. Three-dimensional integrated structure, comprising:

a support element,

an interface device connected to the support element by first electrically conductive connection means,

an integrated circuit arranged between the support element and the interface device and connected to the interface device by second electrically conductive connection means, the integrated circuit comprising a semiconductor substrate having a first face supporting an interconnection part having a plurality of metallization levels enclosed in an insulating region,

a filler region standing between the second electrically conductive connection means and between the interface device and the integrated circuit, and

means forming an antenna, having a first antenna substrate and a second antenna substrate which are separated by an earth plane equipped with an aperture, a radiating element separated from the earth plane by the first antenna substrate, an excitation element separated from the earth plane by the second antenna substrate, the excitation element being produced within an upper one of the metallization levels of the interconnection part, and a reflector produced within a lower one of the metallization levels of the interconnection part facing the excitation element, the aperture being configured in such a way as to permit electromagnetic coupling between the excitation element and the radiating element,

the interface device incorporating the radiating element, the first antenna substrate and the earth plane,

the integrated circuit incorporating the excitation element, and

the second antenna substrate being formed by at least a part of the filler region.

Assignments (3)
CHANGE OF NAME Recorded Feb 23, 2024
From: STMICROELECTRONICS SA
To: STMICROELECTRONICS FRANCE
Reel/Frame 066663/0136 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2017
From: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
To: STMICROELECTRONICS SA
Reel/Frame 043878/0466 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2013
From: BAR, PIERRE; CARPENTIER, JEAN-FRANCOIS; DUSSOPT, LAURENT
To: STMICROELECTRONICS S.A.; COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Reel/Frame 030943/0386 →
Priority Claims (1)
FR 1255719 · Jun 19, 2012 · national
Continuity (1)
Related Publication 20130335297A1 · Dec 19, 2013