IP Library Granted Patent US 9,233,390
Granted Patent B2
US 9,233,390 · App. 13/920,261 · Granted Jan 12, 2016

Processing cup and substrate processing apparatus

Inventor: Minoru Sugiyama (Kyoto, JP)
Assignee: SCREEN Semiconductor Solutions Co., Ltd.
B05C11/1039B05C5/00H01L21/6715B05C11/08G03F7/162G03F7/3021H01L21/67126H01L21/67178Y10T137/5762
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Quick Facts
Patent No.
US 9,233,390
App. No.
13/920,261
Granted
Jan 12, 2016
Kind
B2
Abstract

A substrate is surrounded by an inner cup and an outer cup. A distance between an upper surface of an inner cup lower portion and a lower surface of an inner cup upper portion of the inner cup is gradually reduced outward from an outer periphery of the substrate. A clearance is formed between the upper surface of the inner cup lower portion and the lower surface of the inner cup upper portion at outer peripheries of the inner cup lower portion and the inner cup upper portion. A collection space is formed between the upper surface of the inner cup lower portion and the lower surface of the inner cup upper portion. A scatter capturing space that allows a processing liquid that has passed through the clearance to scatter and captures the scattering processing liquid is formed by an outer cup. An upper portion and an outer periphery of the scatter capturing space are covered by a lower surface and an inner side surface of the outer cup, respectively. The processing liquid that has passed through the clearance is led to the inner side surface by the lower surface of the outer cup.

Claims (43)

1. A processing cup provided to surround a substrate when processing using a processing liquid is performed on the substrate held in a substantially horizontal attitude, comprising:

a first cup arranged to surround the substrate; and

a second cup arranged to surround the first cup, wherein

the first cup includes a first member having a first upper surface arranged to surround the substrate and a second member having a first lower surface arranged above the first upper surface of the first member to surround the substrate,

the first and second members are configured such that a distance between the first upper surface and the first lower surface is gradually reduced outward from an outer periphery of the substrate and a clearance is formed between the first upper surface and the first lower surface at outer peripheries of the first and second members,

a first collection space that collects the processing liquid is formed between the first upper surface and the first lower surface, and

the second cup has a second lower surface, an inner side surface, and a second upper surface and is configured to form a scatter capturing space that allows the scattering of the processing liquid that has passed through the clearance and captures the scattering processing liquid, an upper portion of the scatter capturing space is partitioned by the second lower surface, an outer periphery of the scatter capturing space is partitioned by the inner side surface, a lower portion of the scatter capturing space is partitioned by the second upper surface, an outermost peripheral end of the second lower surface is positioned further below and further outward than an outermost peripheral end of the first lower surface, and the second lower surface is formed to lead the processing liquid that has passed through the clearance to the inner side surface.

2. The processing cup according to claim 1 , wherein

a second collection space that collects the processing liquid is formed below the first member.

3. The processing cup according to claim 1 , wherein

the second cup is configured to further form an acquisition space that acquires the processing liquid on a peripheral edge of the scatter capturing space.

4. The processing cup according to claim 1 , wherein

the first upper surface of the first member, the first lower surface of the second member and the clearance are shaped to be rotationally-symmetric about a common axis.

5. The processing cup according to claim 4 , wherein

the scatter capturing space is shaped to be non-circular about the common axis.

6. The processing cup according to claim 5 , wherein

the scatter capturing space is shaped to be rectangular in a cross section vertical to the common axis.

7. The processing cup according to claim 1 , wherein

the first upper surface of the first member is formed to be inclined outward upward at a first angle with respect to an upper surface of the substrate.

8. The processing cup according to claim 7 , wherein

the first angle is not less than 5 degrees and not more than 20 degrees.

9. The processing cup according to claim 1 , wherein

the first lower surface of the second member is formed to extend outward in parallel with an upper surface of the substrate or to be inclined downward at a second angle with respect to the upper surface of the substrate.

10. The processing cup according to claim 9 , wherein

the second angle is more than 0 degree and not more than 20 degrees.

11. The processing cup according to claim 1 , wherein

the second lower surface is formed to extend outward in parallel with an upper surface of the substrate or to be inclined downward at a third angle with respect to the upper surface of the substrate.

12. The processing cup according to claim 11 , wherein

the third angle more than 0 degree and not more than 20 degrees.

13. The processing cup according to claim 1 , wherein

the first lower surface of the second member is shaped to be annular, and

a maximal length from the clearance to the inner side surface of the second cup is larger than a maximal length from an inner edge of the first lower surface of the second member to the clearance in a radial direction of the substrate.

14. The processing cup according to claim 1 , wherein

a distance between the second lower surface and the second upper surface of the second cup is gradually reduced outward from outer peripheries of the first lower surface and the first upper surface.

15. The processing cup according to claim 1 , further comprising:

a drain port that leads the processing liquid in the scatter capturing space to a drain system.

16. A substrate processing apparatus that performs processing on a substrate, comprising:

a spin holder that rotates the substrate while holding the same in a substantially horizontal attitude;

a first processing liquid supply system that supplies a processing liquid to a first surface of the substrate held by the spin holder; and

the processing cup according to claim 1 provided to surround the substrate held by the spin holder.

17. The substrate processing apparatus according to claim 16 , further comprising:

a second processing liquid supply system that supplies a processing liquid to a second surface that is opposite to the first surface of the substrate held by the spin holder; and

a processing gas supply system that supplies a processing gas to the second surface of the substrate held by the spin holder.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2014
From: SOKUDO CO., LTD.
To: SCREEN SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 033845/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2013
From: SUGIYAMA, MINORU
To: SOKUDO CO., LTD.
Reel/Frame 030632/0175 →
Priority Claims (1)
JP 2012-193167 · Sep 3, 2012 · national
Continuity (1)
Related Publication 20140060424A1 · Mar 6, 2014