IP Library Granted Patent US 9,370,885
Granted Patent B2
US 9,370,885 · App. 13/921,853 · Granted Jun 21, 2016

In-mold decorating method and in-mold system

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Quick Facts
Patent No.
US 9,370,885
App. No.
13/921,853
Granted
Jun 21, 2016
Kind
B2
Abstract

A case molded article is molded by injecting resin into a molding space formed in an in-mold decoration die; meanwhile, foil is joined to the surface of the case molded article. After that, the foil is peeled off from the surface of the case molded article while leaving a pattern layer at least on the upper ends of the corners of the rising wall on the case molded article. Subsequently, the foil is peeled off from the surface of the case molded article while leaving the pattern layer at other points where the foil is joined to the surface of the case molded article.

Claims (13)

1. An in-mold decorating method comprising:

a first step of joining foil to a surface of a case molded article while molding the case molded article by injecting resin into a molding space formed in an in-mold decoration die;

a second step of peeling the foil from the surface of the case molded article while leaving a pattern layer at least on upper ends of corners of a rising wall on the case molded article,

wherein in the second step, a first push pin presses the foil to a divided surface of a first slide core while the first slide core assembled to the in-mold decoration die retracts, the first slide core forming a surface of the corner into a predetermined shape; and

a third step of peeling the foil from the surface of the case molded article while leaving the pattern layer at points other than points where the foil is peeled off in the second step.

2. The in-mold decorating method according to claim 1 , wherein in the third step,

the foil is first peeled off from the surface of the case molded article while leaving the pattern layer at least on the upper end of the rising wall other than the corners, and

the foil is peeled off from the surface of the case molded article while leaving the pattern layer at other points where the foil is joined to the surface of the case molded article.

3. The in-mold decorating method according to claim 2 , wherein in the third step, a second push pin presses the foil to a divided surface of a second slide core while the second slide core assembled to the in-mold decoration die retracts, the second slide core forming a surface of the rising wall other than the corners into a predetermined shape.

4. The in-mold molding method according to claim 2 , wherein in the third step, a second slide core assembled to the in-mold decoration die retracts, the second slide core forming a surface of the rising wall other than the corners into a predetermined shape, and then a tilting pin is diagonally protruded from a divided surface of the in-mold decoration die facing a divided surface of the second slide core so as to press the foil.

5. The in-mold molding method according to claim 2 , wherein in the third step, after a second slide core assembled to the in-mold decoration die retracts, the second slide core forming a surface of the rising wall other than the corners into a predetermined shape, or when the in-mold decoration die starts opening, a stick is protruded from a die-plate divided surface of the in-mold decoration die so as to press the foil.

6. The in-mold decorating method according to claim 1 , wherein the rising wall of the case molded article has a rounded upper end surface.

7. The in-mold decorating method according to claim 1 , wherein the rising wall of the case molded article has an upper end surface which is undercut in a mold opening direction of the in-mold decoration die.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERRONEOUSLY FILED APPLICATION NUMBERS 13/384239, 13/498734, 14/116681 AND 14/301144 PREVIOUSLY RECORDED ON REEL 034194 FRAME 0143. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Dec 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 056788/0362 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: PANASONIC CORPORATION
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 034194/0143 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2014
From: NISHITANI, KENJI; KURISU, MASAHUMI; MIYAZAKI, MASAMITSU; EZAKI, AKIRA; PEI, GUANGRI
To: PANASONIC CORPORATION
Reel/Frame 032085/0712 →