Transducer with enlarged back volume

1. A packaged microphone comprising: a substrate having a first side and a second side; a MEMS microphone mounted to the first side of the substrate; a first lid coupled with the first side of the substrate to form a first cavity, the MEMS microphone being positioned within the first cavity; a second lid coupled with second side of the substrate to form a second cavity an opening in the second lid; a first opening in the substrate configured to receive audio signals; and a second opening in the substrate, the first and second cavities being fluidly connected via the second opening, wherein the substrate extends outside of the first and second cavities to form a tail having a plurality of electrical contacts that electrically connect with the MEMS microphone.

2. The packaged microphone as defined by claim 1 wherein the substrate has a first substrate aperture between the first and second sides of the substrate, the MEMS microphone being mounted over the first substrate aperture.

3. The packaged microphone as defined by claim 1 wherein the substrate has a second substrate aperture fluidly connecting the first and second cavities.

4. The packaged microphone as defined by claim 1 wherein the second cavity forms at least a portion of a back volume for the MEMS microphone.

5. The packaged microphone as defined by claim 1 wherein the substrate, first lid, and second lid form a package, the package having top and bottom walls and a plurality of side walls, the package forming a port aperture through at least one of the side walls, the port aperture fluidly connected with the MEMS microphone.

6. The packaged microphone as defined by claim 1 wherein the second lid and substrate form a port aperture that fluidly connects with the MEMS microphone.

7. The packaged microphone as defined by claim 1 wherein the substrate comprises a flexible substrate.

8. The packaged microphone as defined by claim 1 further comprising a second MEMS microphone coupled with the second side of the substrate.

9. A packaged integrated device comprising: a package substrate having a first surface and a second surface opposite the first surface, the package substrate having a first hole therethrough; a first lid mounted on the first surface of the package substrate to define a first cavity; and a second lid mounted on the second surface of the package substrate to define a second cavity; an opening in the second lid; a first opening in the substrate configured to receive audio signals; a second opening in the substrate, the first and second cavities being fluidly connected via the second opening; a first integrated device die mounted on the first surface of the package substrate inside the first cavity and over the first hole; and, a first port aperture in fluid communication with the first cavity, wherein the package substrate comprises a tail region including one or more electrical contact pads configured to electrically couple to a system substrate using surface mounting techniques.

10. The packaged integrated device of claim 9 , wherein the first port aperture is formed in the first lid or the second lid.

11. The packaged integrated device of claim 10 , wherein the package substrate comprises a laminate substrate wrapped around a support.

12. The packaged integrated device of claim 10 , wherein the first integrated device die comprises a MEMS microphone die.

13. The packaged integrated device of claim 10 , wherein the package substrate comprises Kapton or includes a bendable region.

14. The packaged integrated device of claim 10 , wherein the tail region of the package substrate is wrapped over at least a portion of the first lid or the second lid.

15. A method for packaging a transducer die, the method comprising: providing a package substrate having a hole therethrough, the package substrate having a first surface and a second surface opposite the first surface; mounting a transducer die on the first surface of the package substrate over the hole; mounting a first lid on the first surface of the package substrate to define a first cavity and to enclose the transducer die on the package substrate; mounting a second lid on the second surface of the package substrate to define a second cavity, the first and second cavities being in fluid communication; an opening in the second lid; a first opening in the substrate configured to receive audio signals; and a second opening in the substrate, the first and second cavities being fluidly connected via the second opening, wherein the package substrate comprises a tail region including one or more electrical contact pads configured to electrically couple to a system substrate using surface mounting techniques.

16. The method of claim 15 , further comprising forming a port aperture in the first or second lid.

17. The method of claim 16 , wherein the port aperture is formed in a side wall of the second lid.

18. The method of claim 15 , wherein the package substrate comprises one or more back volume apertures providing fluid communication between the first cavity and the second cavity.

19. A packaged microphone comprising: a substrate having a first side and a second side; a MEMS microphone mounted to the first side of the substrate; a first lid coupled with the first side of the substrate to form a first cavity with a first volume, the MEMS microphone being positioned within the first cavity; a second lid coupled with second side of the substrate to form a second cavity with a second volume, the first and second cavities being fluidly connected to form a back volume; an opening in the second lid; a first opening in the substrate configured to receive audio signals; and a second opening in the substrate, the first and second cavities being fluidly connected via the second opening, wherein the substrate extends outside of the first and second cavities to form a tail having a plurality of electrical contacts that electrically connect with the MEMS microphone.