IP Library Granted Patent US 9,490,768
Granted Patent B2
US 9,490,768 · App. 13/926,169 · Granted Nov 8, 2016

High frequency band pass filter with coupled surface mount transition

Inventors: Steven Randall (Manlius, NY); David Allen Bates (Fayetteville, NY)
Assignee: Knowles Cazenovia Inc.
H03H7/0161H01P1/20363H01P5/028
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Quick Facts
Patent No.
US 9,490,768
App. No.
13/926,169
Granted
Nov 8, 2016
Kind
B2
Abstract

A high frequency band pass filter with a coupled surface mount transition is provided, including a filter substrate, circuit connection elements defining input and an output elements provided on a surface of the filter substrate, electronic filter components provided on the first surface of the filter substrate, and impedance matching structures provided on the first surface of the filter substrate between the electronic filter components and the respective input and output elements. Signal connection structures are provided on an opposed surface of the filter substrate, in locations that positionally correspond to respective positions of the input and output elements. The respective signal connection elements are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the opposed surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the input and the output elements.

Claims (22)

1. A high frequency band pass filter with a coupled surface mount transition, comprising:

a dielectric filter substrate having a first surface and an opposed second surface;

circuit connection elements defining an input element and an output element provided on the first surface of the filter substrate and spaced a distance d from respective terminal edges of the first surface of the filter substrate;

electronic filter components provided on the first surface of the filter substrate and extending along a longitudinal extension axis of the filter substrate from a first point proximate a first end of the filter substrate to a second point proximate a second end of the filter substrate;

impedance matching structures provided on the first surface of the filter substrate and interposed between the input element and the electronic filter components and between the output element and the electronic filter components;

at least one protrusion integrally connected to each impedance matching structure and extending to a position between the first and second points; and

signal connection elements provided on the second surface of the filter substrate in locations that positionally correspond to respective positions of the input element and output element on the first surface of the filter substrate, the signal connection elements respectively separated from a ground plane on the second surface of the filter substrate by an electrically insulating isolation area, and being spaced a distance d 2 from respective terminal edges of the second surface of the filter substrate;

whereby the respective signal connection elements on the second surface of the filter substrate are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the first surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the circuit connection elements.

2. The high frequency band pass filter with a coupled surface mount transition according to claim 1 , wherein the filter substrate comprises a ceramic material having a dielectric constant in a range of 9-25.

3. The high frequency band pass filter with a coupled surface mount transition according to claim 1 , wherein the input and output elements have a width dimension in a range of 0.254 mm to 0.356 mm and a length dimension in a range of 0.254 mm to 0.356 mm.

4. The high frequency band pass filter with a coupled surface mount transition according to claim 1 , wherein the signal connection elements have a width dimension in a range of 0.356 mm to 0.457 mm and a length dimension in a range of 0. 304 mm to 0.406 mm.

5. The high frequency band pass filter with a coupled surface mount transition according to claim 1 , wherein the distance d is in a range of 0.00 mm to 0.127 mm.

6. The high frequency band pass filter with a coupled surface mount transition according to claim 1 , wherein the distance d 2 is in a range of 0.00 mm to 0.076 mm.

7. The high frequency band pass filter with a coupled surface mount transition according to claim 1 , wherein the protrusion extends in parallel to the longitudinal extension axis of the substrate.

8. A high frequency band pass filter with a coupled surface mount transition, comprising:

a filter substrate;

circuit connection elements defining an input element and an output element provided on a first surface of the filter substrate;

electronic filter components provided on the first surface of the filter substrate and extending along a longitudinal extension axis of the filter substrate from a first point proximate a first end of the filter substrate to a second point proximate a second end of the filter substrate;

impedance matching structures provided on the first surface of the filter substrate between the electronic filter components and the respective input and output elements;

at least one protrusion integrally connected to each impedance matching structure and extending to a position between the first and second points; and

signal connection elements provided on an opposed second surface of the filter substrate, in locations that positionally correspond to respective positions of the input and output elements on the first surface of the filter substrate;

whereby the respective signal connection elements on the second surface of the filter substrate are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the first surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the circuit connection elements.

Assignments (2)
CHANGE OF NAME Recorded May 11, 2015
From: DIELECTRIC LABORATORIES, INC.
To: KNOWLES CAZENOVIA INC.
Reel/Frame 035645/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2013
From: RANDALL, STEVEN; BATES, DAVID
To: DIELECTRIC LABORATORIES, INC.
Reel/Frame 030975/0474 →
Continuity (2)
Provisional Application 61663669 · Jun 25, 2012
Related Publication 20130342287A1 · Dec 26, 2013