Sensor device regulation and related systems and methods

1. A sensor device comprising:

a sensor element; and

a wiring substrate comprising:

a first joint surface electrically joined with the sensor element,

a substrate body that contains an organic insulating material and in which an electronic component is embedded, and

a regulation part that regulates deformation of the first joint surface caused by thermal expansion or contraction of the sensor element.

2. The sensor device according to claim 1 , wherein

the first joint surface is disposed on the substrate body; and

the regulation part includes a core part embedded in the substrate body.

3. The sensor device according to claim 2 , wherein

the core part is annularly disposed around the electronic component.

4. The sensor device according to claim 3 , wherein

the wiring substrate further includes a second joint surface that faces the first joint surface; and

the substrate body further includes

a first wiring layer disposed on a side of the first joint surface, and

a second wiring layer that is disposed on a side of the second joint surface and faces the first wiring layer with the core part and the electronic component interposed therebetween.

5. The sensor device according to claim 2 , further comprising a shield part that is disposed on the first joint surface and covers the sensor element.

6. The sensor device according to claim 5 , wherein

the regulation part further includes a first joint part that joins the shield part and the core part.

7. The sensor device according to claim 6 , wherein

an absolute value of a difference of linear expansion coefficients of the shield part and the sensor element is smaller than an absolute value of a difference of linear expansion coefficients of the organic insulating material and the sensor element.

8. The sensor device according to claim 2 , wherein

an absolute value of a difference of linear expansion coefficients of the core part and the sensor element is smaller than an absolute value of a difference of linear expansion coefficients of the organic insulating material and the sensor element.

9. The sensor device according to claim 1 , wherein

the regulation part includes a base material of an inorganic insulating material disposed between the sensor element and the substrate body; and

the first joint surface is disposed on the base material.

10. The sensor device according claim 9 , wherein

the regulation part further includes a core part embedded in the substrate body.

11. The sensor device according to claim 10 , wherein

the regulation part further includes a second joint part that joins the base material and the core part.

12. The sensor device according to claim 9 , wherein

the base material is mounted on the substrate body; and

the wiring substrate further includes an adhesive layer that is filled in between the base material and the substrate body.

13. The sensor device according to claim 9 , wherein

the base material is disposed opposite to the first joint surface and further includes a third joint surface that is electrically joined with the electronic component.

14. The sensor device according to claim 9 , further comprising a shield part that is disposed on the wiring substrate and covers the sensor element.

15. The sensor device according to claim 14 , wherein

the shield part is disposed on the first joint surface.

16. The sensor device according to claim 15 , wherein

the substrate body includes a fourth joint surface that faces the base material; and

the shield part is disposed on the fourth joint surface and covers the base material and the sensor element.

17. The sensor device according to claim 9 , wherein

the substrate body has a longitudinal elastic modulus smaller than that of the base material.

18. The sensor device according to claim 1 , wherein

the sensor element faces the electronic component with the first joint surface interposed therebetween.

19. The sensor device according to claim 1 , wherein

the sensor element is a gyrosensor.