Optically transitioning thermal detector structures

1. A method of making a focal plane array assembly, comprising forming a plurality of individual thermal detector elements arranged as an array, each of at least a portion of the plurality of individual detector elements comprising an optically transitioning thermal absorption structure and being configured to sense radiation falling incident thereon by measuring at least one property of the thermal absorption structure that changes value with temperature, the thermal absorption structure being provided with at least one optically transitioning material that is an integral part of the thermal absorption structure itself; and where the method further comprises:

selecting a composition of the optically transitioning material to tailor the optical transition characteristics of the material as a function of temperature so that the thermal absorption structure absorbs less of the incident radiation as its temperature increases; and

viewing a scene with the focal plane array such that a temperature of the optically transitioning material of each of the portion of individual thermal detector elements increases while viewing the scene to cause the optically transitioning material to transition from a semiconducting phase to a metallic phase while viewing the scene.

2. The method of claim 1 , further comprising providing a substrate; and where the thermal absorption structure of each of the portion of individual thermal detector elements is a microbolometer pixel membrane structure that provides a membrane suspended above the substrate that is configured to absorb radiation incident thereon, the microbolometer pixel membrane structure of each of the microbolometer pixel membrane structures being disposed in spaced relationship above the substrate to define a cavity therebetween with the one or more optically transitioning material components being formed as an integral part of the membrane itself.

3. The method of claim 1 , where each of the portion of individual thermal detector elements is configured such that the optically transitioning material undergoes a semiconducting-to-metallic phase transition with increasing temperature; and where the method further comprises selecting a composition of the optically transitioning material to tailor the semiconducting-to-metallic phase transition characteristics of the material as a function of temperature to selectively filter out radiation while viewing a scene by reflecting the radiation from the thermal absorption structure depending on the temperature of the material so as to control radiation absorption of the thermal absorption structure.

4. The method of claim 3 , further comprising viewing a scene with the focal plane array such that a temperature of the optically transitioning material of each of the portion of individual thermal detector elements increases while viewing the scene to cause the optically transitioning material to transition from a semiconducting phase to a metallic phase while viewing the scene to selectively filter out radiation by reflecting the radiation from the thermal absorption structure while viewing the scene with the focal plane array.

5. The method of claim 1 , where the method further comprises selecting a composition of the optically transitioning material to exhibit optical transition characteristics that filter out undesired radiation by reflecting the undesired radiation from the thermal absorption structure at one or more selected radiation wavelengths and/or at one or more selected temperatures of the material so as to control radiation absorption of the thermal absorption structure while the thermal detector element is viewing a scene that includes the undesired radiation.

6. The method of claim 1 , further comprising:

providing a substrate; and

forming each of the portion of individual thermal detector elements as an uncooled infrared detector;

where the thermal absorption structure of each of the portion of individual thermal detector elements is a microbolometer pixel membrane structure configured to absorb radiation incident thereon, the microbolometer pixel membrane structure being disposed in spaced relationship above the substrate to define a cavity therebetween.

7. The method of claim 1 , further comprising:

providing a device wafer and forming the forming the plurality of individual thermal detector elements arranged as an array on the device wafer;

providing a lid wafer, the lid wafer being at least partially transmissive of the incident radiation; and

assembling the lid wafer to the device wafer such that the lid wafer allows the incident radiation to reach the focal plane array assembly through the lid wafer.

8. The method of claim 7 , further comprising sealingly assembling the lid wafer to the device wafer with a vacuum therebetween to form a wafer-level packaged focal plane array assembly.

9. The method of claim 1 , further comprising selecting a composition of the optically transitioning material to tailor the optical transition characteristics of the material as a function of temperature so that the thermal absorption structure reflects more incident radiation as its temperature increases due to absorbed incident radiation while viewing a scene so as to limit a maximum temperature of the thermal detector element.

10. The method of claim 1 , where the optically transitioning material becomes increasingly reflective of incident radiation with increasing temperature such that the thermal absorption structure of each of the portion of individual thermal detector elements absorbs a greater amount of incident radiation at a first temperature than the thermal absorption structure absorbs at a second temperature when the second temperature is higher than the first temperature.

11. The method of claim 10 , where the thermal absorption structure of each of the portion of individual thermal detector elements is a microbolometer pixel membrane structure configured to absorb radiation incident thereon, the microbolometer pixel membrane structure being disposed in spaced relationship above the substrate to define a cavity therebetween; and where the method further comprises:

providing a substrate;

forming each of the portion of individual thermal detector elements with a configuration to receive incident radiation on a first side of the microbolometer pixel membrane structure that faces away from the cavity; and

forming a reflective layer on the surface of the substrate of each of the portion of individual thermal detector elements between the microbolometer pixel membrane structure and the substrate such that the optically transitioning material allows a greater portion of the total received incident radiation to be transmitted through the microbolometer pixel membrane structure to the reflective layer of the substrate at a first temperature than the optically transitioning material allows to be transmitted through the microbolometer pixel membrane structure at a second temperature that is higher than the first temperature.

12. A method, comprising:

viewing a scene with a focal plane array that includes a plurality of individual thermal detector elements, at least a portion of the plurality of individual thermal detector elements each comprising an optically transitioning thermal absorption structure provided with at least one optically transitioning material that is an integral part of the thermal absorption structure itself; and

sensing radiation from the scene that falls incident on the thermal detector elements of the focal plane array by measuring at least one property of the thermal absorption structure of each of the thermal detector elements that changes value with temperature;

where the temperature of the optically transitioning material of the thermal absorption structure of each of the portion of individual thermal detector elements of the focal plane array increases due to absorbed incident radiation while viewing the scene to cause the optically transitioning material of the thermal absorption structure to transition from a semiconducting phase to a metallic phase while viewing the scene such that the thermal absorption structure absorbs less of the incident radiation as its temperature increases while viewing the scene.

13. The method of claim 12 , further comprising viewing the scene with the optically transitioning material of the thermal absorption structure of each of the portion of individual thermal detector elements of the focal plane array in a semiconducting phase and viewing the scene with the optically transitioning material of the thermal absorption structure of each of the portion of individual thermal detector elements of the focal plane array in a metallic phase; and where the temperature of the optically transitioning material of the thermal absorption structure of each of the portion of individual thermal detector elements of the focal plane array increases due to absorbed incident radiation while viewing the scene to cause the optically transitioning material to transition from a semiconducting phase to a metallic phase to selectively filter out the incident radiation while viewing the scene with the focal plane array so that the thermal absorption structure absorbs less of the incident radiation as its temperature increases.

14. The method of claim 12 , further comprising viewing the scene with the optically transitioning material of the thermal absorption structure of each of the portion of individual thermal detector elements of the focal plane array in a semiconducting phase and viewing the scene with the optically transitioning material of the thermal absorption structure of each of the portion of individual thermal detector elements of the focal plane array in a metallic phase; and where the temperature of the optically transitioning material of the thermal absorption structure of each of the portion of individual thermal detector elements of the focal plane array increases due to absorbed incident radiation while viewing the scene to cause the optically transitioning material of the thermal absorption structure to transition such that the thermal absorption structure reflects more incident radiation as its temperature increases due to absorbed incident radiation while viewing the scene so as to limit a maximum temperature of the thermal detector element.