Granted Patent B2

US 8,796,112 · App. 13/931,622 · Granted Aug 5, 2014

Abstract

Claims (21)

1. A method of forming a three-dimensional electronic device, comprising:

forming at least one electronic device on a two-dimensional, flexible substrate, the electronic device being formed according to a three-dimensional structure;

cutting the two-dimensional, flexible substrate, the cuts being located to allow the two-dimensional substrate to be shaped, the cuts having at least one stress relief feature and that two cut lines meet to form an apex, cutting the substrate further comprising at least one of:

cutting a circle centered at the apex, the circle forming the stress relief feature,

altering a path of at least one of the cuts to form a cubic portion of a wedge shape, and

extending one of the cut lines past the apex forming an extended cut, the extended cut forming the stress relief feature; and

shaping the two-dimensional, flexible substrate to form the three-dimensional structure, the stress relief features arranged to alleviate stress in the three-dimensional structure.

2. The method of claim 1 , wherein cutting the substrate further comprises cutting a circle and cutting a circle comprises cutting a complete circle and removing material inside the circle.

3. The method of claim 1 in which the three-dimensional structure is a dome, a portion of a sphere, a cone, a portion of an ellipsoid, or combinations and approximations to these shapes.

4. The method of claim 1 , wherein cutting the substrate further comprises cutting a circle and cutting a circle comprises cutting a portion of the circle and retaining the material.

5. The method of claim 4 , wherein retaining the material comprises retaining material that forms connections between devices.

6. The method of claim 4 , wherein retaining the material comprises retaining material that contains devices, the devices forming contacts through the retained material to other areas of the device.

7. The method of claim 1 , wherein cutting the substrate comprises cutting a wedge shape in which the shaped portion follows a cubic shape.

8. The method of claim 1 , wherein cutting the substrate comprises cutting a wedge shape and also comprises cutting a circle at the apex.

9. A method of forming a three-dimensional electronic device, comprising:

forming at least one electronic device on a two-dimensional, flexible substrate, the electronic device being formed according to a three-dimensional structure;

cutting the two-dimensional, flexible substrate, the cuts being arranged to as to increase a radius of curvature to meet a stress relief parameter when the substrate is shaped, and the cuts being arranged to form an apex and one of:

cutting a circle centered about the apex, the diameter of the circle selected to control the radius of curvature,

extending a cut a distance beyond the vertex, the distance selected to meet the stress relief parameter, and

altering a path of at least one of the cuts to form a cubic portion of a wedge shape; and

shaping the two-dimensional, flexible substrate to form the three-dimensional structure.

Assignments (9)