Hybrid interconnect
A connector for connection to terminals of an integrated circuit. The connector consists of a dielectric substrate having a first side and a second side. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls with a second set of the terminals of the integrated circuit.
1. Apparatus, comprising:
an integrated circuit comprising a first set of terminals and a second set of terminals:
wire bonds connected to the first set of terminals; and
a connector connected to the integrated circuit, the connector comprising:
a dielectric substrate having a first side and a second side;
wire bond terminals, attached to the first side of the substrate, that receive the wire bonds; and
solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, and coupled via solder balls with the second set of terminals of the integrated circuit, wherein the solder bump terminals are arranged in a solder bump terminal configuration, and the second set of terminals of the integrated circuit are arranged in an integrated circuit terminal configuration which is congruent to the solder bump terminal configuration.
2. The apparatus according to claim 1 , wherein the solder bump terminal configuration is rectilinear.
3. The apparatus according to claim 1 , wherein the solder bump terminal configuration is non-rectilinear.
4. The apparatus according to claim 1 , wherein the solder bump terminals are equally spaced.
5. The apparatus according to claim 1 , wherein the solder bump terminals are unevenly spaced.
6. The apparatus according to claim 1 , wherein the wire bond terminals and the solder bump terminals are equal in number.
7. The apparatus according to claim 6 , wherein the wire bond terminals and the solder bump terminals are aligned, such that each wire bond terminal is opposite a respective solder bump terminal.
8. The apparatus according to claim 6 , wherein the wire bond terminals and the solder bump terminals are misaligned.
9. An endoscope, comprising:
an integrated circuit comprising a first set of terminals and a second set of terminals;
wire bonds connected to the first set of terminals;
an imaging device formed on the integrated circuit; and
a connector connected the integrated circuit, the connector comprising:
a dielectric substrate having a first side and a second side;
wire bond terminals, attached to the first side of the substrate, that receive the wire bonds; and
solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals coupled via solder balls with the second set of terminals of the integrated circuit, wherein the solder bump terminals are arranged in a solder bump terminal configuration, and the second set of terminals of the integrated circuit are arranged in an integrated circuit terminal configuration which is congruent to the solder bump terminal configuration.