Electromagnetic induction panel structure and method of manufacturing the same, and electromagnetic handwriting input device

1. An electromagnetic induction panel structure, comprising:

a multilayer substrate including an insulating base layer, a first conductive circuit layer disposed on a first surface of the insulating base layer, a second conductive circuit layer disposed on a second surface of the insulating base layer, wherein the first surface is opposite the second surface, a first outermost lateral conductive layer disposed directly on the first conductive circuit layer, and a second outermost lateral conductive layer disposed directly on the second conductive circuit layer;

a first cover unit disposed on the first outermost lateral conductive layer of the multilayer substrate; and

a second cover unit disposed on the second outermost lateral conductive layer of the multilayer substrate, wherein the second cover unit includes a wave-absorbing material layer.

2. The electromagnetic induction panel structure of claim 1 , wherein the first cover unit includes a first insulating layer directly formed on the first outermost lateral conductive layer of the multilayer substrate, the first insulating layer directly contacting the first outermost lateral conductive layer of the multilayer substrate.

3. The electromagnetic induction panel structure of claim 1 , wherein the first cover unit includes a first insulating layer adhesively disposed on the first outermost lateral conductive layer of the multilayer substrate through a first adhesive layer, the first adhesive layer being disposed between the first insulating layer and the first outermost lateral conductive layer of the multilayer substrate.

4. The electromagnetic induction panel structure of claim 1 , wherein the second cover unit includes a second insulating layer directly formed on the second outermost lateral conductive layer of the multilayer substrate, the second insulating layer directly contacting the second outermost lateral conductive layer of the multilayer substrate, and wherein the wave-absorbing material layer is directly formed on the second insulating layer, the wave-absorbing material layer directly contacting the second insulating layer.

5. The electromagnetic induction panel structure of claim 1 , wherein the second cover unit includes a second insulating layer adhesively disposed on the second outermost lateral conductive layer of the multilayer substrate through a second adhesive layer, the second adhesive layer being disposed between the second insulating layer and the second outmost lateral conductive layer of the multilayer substrate, and wherein the wave-absorbing material layer is directly formed on the second insulating layer for directly contacting the second insulating layer.

6. The electromagnetic induction panel structure of claim 1 , wherein the wave-absorbing material layer is adhesively disposed on the second outmost lateral conductive layer of the multilayer substrate through a second adhesive layer having an insulation property, thus the second insulating layer is disposed between the wave-absorbing material layer and the second outmost lateral conductive layer.

7. The electromagnetic induction panel structure of claim 1 , wherein the multilayer substrate is a flexible circuit board, and both the first outmost lateral conductive layer and the second outmost lateral conductive layer are two electroplating layers, wherein the first cover unit includes a first insulating layer, and the second cover unit includes a second insulating layer and an insulating protection layer directly formed on the wave-absorbing material layer for protecting the wave-absorbing material layer.

8. The electromagnetic induction panel structure of claim 7 , wherein the first insulating layer, the second insulating layer and the insulating base layer are made of one of polymethylmethacrylate (PMMA), poly vinyl chloride (PVC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), cyclic olefin copolymer (COC), poly carbonate (PC), polyethylene (PE), poly propylene (PP), polyimide (PI) and poly styrene (PS), wherein both the first conductive circuit layer and the second conductive circuit layer are two copper foil layers, two indium tin oxide conductive layers, two carbon nanotube conductive layers, two polymer conductive layers, two grapheme conductive layers, two silver paste layers or two nano silver conductive layers.

9. The electromagnetic induction panel structure of claim 1 , further comprising:

an external casing having a writing surface formed thereon for an electromagnetic pen to write on the writing surface, wherein an emitting electromagnetic wave directly generated by the electromagnetic pen or a reflected electromagnetic wave indirectly generated from the electromagnetic pen is detected by the electromagnetic induction panel structure to obtain an electromagnetic wave signal; and

a control circuit board electrically connected to the electromagnetic induction panel structure for receiving the electromagnetic wave signal of the electromagnetic induction panel structure, wherein both the electromagnetic induction panel structure and the control circuit board are disposed inside the external casing.

10. The electromagnetic induction panel structure of claim 9 , wherein the first cover unit includes a first insulating layer directly formed on the first outermost lateral conductive layer of the multilayer substrate for directly contacting the first outermost lateral conductive layer of the multilayer substrate.

11. The electromagnetic induction panel structure of claim 9 , wherein the first cover unit includes a first insulating layer adhesively disposed on the first outermost lateral conductive layer of the multilayer substrate through a first adhesive layer, thus the first adhesive layer is disposed between the first insulating layer and the first outermost lateral conductive layer of the multilayer substrate.

12. The electromagnetic induction panel structure of claim 9 , wherein the second cover unit includes a second insulating layer directly formed on the second outermost lateral conductive layer of the multilayer substrate for directly contacting the second outermost lateral conductive layer of the multilayer substrate, and the wave-absorbing material layer is directly formed on the second insulating layer for directly contacting the second insulating layer.

13. The electromagnetic induction panel structure of claim 9 , wherein the second cover unit includes a second insulating layer adhesively disposed on the second outermost lateral conductive layer of the multilayer substrate through a second adhesive layer, thus the second adhesive layer is disposed between the second insulating layer and the second outmost lateral conductive layer of the multilayer substrate, wherein the wave-absorbing material layer is directly formed on the second insulating layer for directly contacting the second insulating layer.

14. The electromagnetic induction panel structure of claim 9 , wherein the wave-absorbing material layer is adhesively disposed on the second outmost lateral conductive layer of the multilayer substrate through a second adhesive layer having an insulation property, thus the second insulating layer is disposed between the wave-absorbing material layer and the second outmost lateral conductive layer.

15. A method of manufacturing an electromagnetic induction panel structure, comprising:

disposing a first cover unit on a first outermost lateral conductive layer of a multilayer substrate, wherein the multilayer substrate includes an insulating base layer, a first conductive circuit layer disposed on a first surface of the insulating base layer, a second conductive circuit layer disposed on a second surface of the insulating base layer, wherein the first surface is opposite the second surface, the first outermost lateral conductive layer disposed directly on the first conductive circuit layer, and a second outermost lateral conductive layer disposed directly on the second conductive circuit layer; and

disposing a second cover unit on the second outermost lateral conductive layer of the multilayer substrate, wherein the second cover unit includes a wave-absorbing material layer.

16. The method of claim 15 , wherein the disposing the first cover unit on the first outermost lateral conductive layer of the multilayer substrate comprises: directly forming a first insulating layer of the first cover unit on the first outermost lateral conductive layer of the multilayer substrate for directly contacting the first outermost lateral conductive layer of the multilayer substrate.

17. The method of claim 15 , wherein the disposing the first cover unit on the first outermost lateral conductive layer of the multilayer substrate comprises: adhesively disposing a first insulating layer of the first cover unit on the first outermost lateral conductive layer of the multilayer substrate through a first adhesive layer, wherein the first adhesive layer is disposed between the first insulating layer and the first outermost lateral conductive layer of the multilayer substrate.

18. The method of claim 15 , wherein the disposing the second cover unit on the second outermost lateral conductive layer of the multilayer substrate comprises:

directly forming a second insulating layer of the second cover unit on the second outermost lateral conductive layer of the multilayer substrate, the second insulating layer of the second cover unit directly contacting the second outermost lateral conductive layer of the multilayer substrate; and

directly forming the wave-absorbing material layer on the second insulating layer, the wave-absorbing material layer directly contacting the second insulating layer.

19. The method of claim 15 , wherein the disposing the second cover unit on the second outermost lateral conductive layer of the multilayer substrate comprises: adhesively disposing a prefabricated three-layer structure on the second outermost lateral conductive layer of the multilayer substrate, wherein the prefabricated three-layer structure is composed of a second adhesive layer, a second insulating layer and the wave-absorbing material layer that are stacked on top of one another, and the second adhesive layer is disposed between the second insulating layer and the second outmost lateral conductive layer of the multilayer substrate.

20. The method of claim 15 , wherein the disposing the second cover unit on the second outermost lateral conductive layer of the multilayer substrate comprises: adhesively disposing the wave-absorbing material layer on the second outmost lateral conductive layer of the multilayer substrate through a second adhesive layer having an insulation property, wherein the second insulating layer is disposed between the wave-absorbing material layer and the second outmost lateral conductive layer.