Planarized TCO-based anode for OLED devices, and/or methods of making the same
View Patent ↗Certain example embodiments relate to organic light emitting diode (OLED)/polymer light emitting diode (PLED) devices, and/or methods of making the same. A first transparent conductive coating (TCC) layer is disposed, directly or indirectly, on a glass substrate. An outermost major surface of the TCC layer is planarized by exposing the outermost major surface thereof to an ion beam. Following said planarizing, the first TCC layer has an arithmetic mean value RMS roughness (Ra) of less than 1.5 nm. A hole transporting layer (HTL) and an electron transporting and emitting layer (ETL) are disposed, directly or indirectly, on the planarized outermost major surface of the first TCC layer. A second TCC layer is disposed, directly or indirectly, on the HTL and the ETL. One or both TCC layers may include ITO. The substrate and/or an optional optical out-coupling layer stack system may be planarized using an ion beam.
1. A method of making an organic light emitting diode (OLED) device, the method comprising:
disposing a layer comprising a transparent conductive coating (TCC), directly or indirectly, on a glass substrate;
planarizing an outermost major surface of the layer comprising the TCC by exposing the outermost major surface of the layer comprising the TCC to an ion beam wherein, following said planarizing, wherein the layer has an arithmetic mean value RMS roughness (Ra) of less than 1.5 nm; and
disposing a hole transporting layer (HTL) and an electron transporting and emitting layer (ETL), directly or indirectly, on the planarized outermost major surface of the layer comprising the TCC.
2. The method of claim 1 , further comprising providing an electrode, directly or indirectly, on the HTL and the ETL.
3. The method of claim 1 , wherein the TCC comprises indium tin oxide.
4. The method of claim 1 , wherein the layer comprising the TCC is an anode and the electrode is a counter electrode.
5. The method of claim 1 , wherein the device is free from any planarization layers between said layer comprising the TCC and the HTL.
6. The method of claim 1 , further comprising planarizing, via an or the ion beam, a major surface of the glass substrate prior to the disposing of the layer comprising the TCC thereon.
7. The method of claim 1 , further comprising disposing an optical out-coupling layer stack (OCLS) system on the glass substrate, the layer comprising the TCC being disposed on the OCLS system.
8. The method of claim 7 , further comprising planarizing an exposed major surface of the glass substrate and/or the OCLS system, via ion beam.
9. The method of claim 1 , wherein the planarizing is performed in an argon-inclusive environment at at least partial vacuum.
10. The method of claim 1 , wherein the ion beam operates at a voltage of 1275-1725 volts and an argon flow rate of 289-391 sccm.
11. The method of claim 1 , wherein, following said planarizing, the layer comprising the TCC has an arithmetic mean value RMS roughness (Ra) of less than 1.2 nm.