Racetrack design in radio frequency shielding applications
Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area.
1. A packaged module comprising:
a substrate configured to receive at least one component;
a radio frequency (RF) component coupled to a major surface of the substrate; and
an RF isolation structure including a racetrack disposed below the major surface of the substrate such that the major surface of the substrate is between the racetrack and the RF component, the racetrack configured at a ground potential and disposed around the RF component in the substrate, and the racetrack having at least one break and at least one narrowed section, the RF isolation structure further including a conductive layer disposed above the RF component and one or more conductive features disposed between the racetrack and the conductive layer, the one or more conductive features configured to provide at least a portion of an electrical connection from the racetrack to the conductive layer.
2. The packaged module of claim 1 wherein the racetrack includes a plurality of narrowed sections.
3. The packaged module of claim 1 wherein the racetrack has a plurality of breaks.
4. The packaged module of claim 1 wherein the racetrack is disposed along a periphery of the packaged module.
5. The packaged module of claim 1 wherein the one or more conductive features include wirebonds.
6. The packaged module of claim 1 wherein the RF component includes at least one of a voltage-controlled oscillator, a filter, or a switch.
7. The packaged module of claim 1 wherein the RF component includes a high band portion and a low band portion.
8. A packaged module comprising:
a substrate configured to receive at least one component;
a radio frequency (RF) component coupled to a major surface of the substrate; and
an RF isolation structure including first and second racetracks disposed below the major surface of the substrate, the first racetrack configured at a ground potential and disposed around the RF component in the substrate, the first racetrack having at least one of a break or a narrowed section, the second racetrack electrically connected to the first racetrack by a plurality of vias, the second racetrack having at least one additional break or narrowed section, the RF isolation structure further including a conductive layer disposed above the RF component and one or more conductive features disposed between the first racetrack and the conductive layer, and the one or more conductive features configured to provide at least a portion of an electrical connection from the first racetrack to the conductive layer.
9. The packaged module of claim 8 wherein the racetrack has the break and the break is disposed in a low radiating area of the packaged module.
10. The packaged module of claim 9 wherein the low radiating area of the packaged module is associated with a minimum radiation around the perimeter of the packaged module.
11. The packaged module of claim 9 wherein the low radiating area has a low activity factor relative to other areas of the packaged module.
12. The packaged module of claim 9 wherein the RF component is configured to emit less electromagnetic radiation to the low radiating area of the packaged module than to other areas of the packaged module.
13. The packaged module of claim 8 wherein the RF component includes a power amplifier.
14. A packaged module comprising:
a substrate configured to receive at least one component;
a radio frequency (RF) component coupled to a major surface of the substrate; and
an RF isolation structure including a racetrack disposed below the major surface of the substrate, the racetrack configured at a ground potential and disposed around the RF component in the substrate, and the racetrack including a narrowed section disposed in a low radiating area of the packaged module, the RF isolation structure further including a conductive layer disposed above the RF component and one or more conductive features disposed between the racetrack and the conductive layer, the one or more conductive features configured to provide at least a portion of an electrical connection from the racetrack to the conductive layer.
15. The packaged module of claim 14 wherein the low radiating area of the packaged module is associated with a minimum radiation around the perimeter of the packaged module.
16. The packaged module of claim 14 wherein the low radiating area has a low activity factor relative to other areas of the packaged module.
17. The packaged module of claim module of claim 14 wherein the RF component includes a power amplifier.
18. The packaged module of claim 14 wherein the RF component includes a high band portion and a low band portion.
19. The packaged module of claim 14 wherein the racetrack has a break.
20. The packaged module of claim 14 wherein the racetrack includes one or more additional narrowed sections.