IP Library › Granted Patent US 9,067,777
Granted Patent B2
US 9,067,777 · App. 13/941,892 · Granted Jun 30, 2015

MEMS device, electronic module, electronic apparatus, and mobile unit

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Quick Facts
Patent No.
US 9,067,777
App. No.
13/941,892
Granted
Jun 30, 2015
Kind
B2
Abstract

A MEMS device includes: a base substrate; a first wiring disposed on the base substrate using a first structure; a second wiring disposed on the base substrate using the first structure and a second structure connected to the first structure; and a MEMS element connected with the first wiring and the second wiring and arranged on the base substrate, wherein the first wiring and the second wiring include a crossing portion where the first wiring and the second wiring cross each other, and at the crossing portion, the first structure of the first wiring and the second structure of the second wiring cross each other.

Claims (39)

1. A MEMS device comprising:

a base substrate;

a first wiring disposed on the base substrate using a first structure, wherein a groove portion is disposed on the base substrate, and the first structure is disposed in the groove portion;

a second wiring disposed on the base substrate using the first structure and a second structure connected to the first structure; and

a MEMS element connected with the first wiring and the second wiring and arranged on the base substrate, wherein

the first wiring and the second wiring include a crossing portion where the first wiring and the second wiring cross each other,

at the crossing portion, the first structure of the first wiring and the second structure of the second wiring cross each other, and

the groove portion at the crossing portion is deeper than the groove portion at the other portions.

2. The MEMS device according to claim 1 , wherein

the width of the second structure at the crossing portion is narrower than that of the second structure at the other portions.

3. The MEMS device according to claim 1 , wherein

the first structure includes metal, and

the second structure includes silicon.

4. An electronic module comprising the MEMS device according to claim 1 mounted thereon.

5. An electronic apparatus comprising the MEMS device according to claim 1 mounted thereon.

6. A mobile unit comprising the MEMS device according to claim 1 mounted thereon.

7. A MEMS device comprising:

a base substrate;

a first wiring disposed on the base substrate using a first structure, wherein a groove portion is disposed on the base substrate, and the first structure is disposed in the groove portion;

a second wiring disposed on the base substrate using the first structure and a second structure connected to the first structure; and

a MEMS element connected with the first wiring and the second wiring and arranged on the base substrate, wherein

the first wiring and the second wiring include a crossing portion where the first wiring and the second wiring cross each other,

at the crossing portion, the first structure of the first wiring and the second structure of the second wiring cross each other, and

the second structure is not disposed in the groove portion at the crossing portion.

8. A MEMS device comprising; a base substrate; a first wiring disposed on the base substrate using a first structure; a second wiring disposed on the base substrate using a second structure; and

a MEMS element connected with the first wiring and the second wiring and arranged on the base substrate, wherein

the first wiring and the second wiring include a crossing portion where the first wiring and the second wiring cross each other, and

at the crossing portion, the first structure of the first wiring and the second structure of the second wiring cross each other, wherein

a groove portion is disposed on the base substrate, and the first structure is disposed in the groove portion and the second structure is not disposed in the groove portion at least at the crossing portion.

9. The MEMS device according to claim 8 , wherein

the groove portion at the crossing portion is deeper than the groove portion at the other portions.

10. The MEMS device according to claim 8 , wherein

the width of the second structure at the crossing portion is narrower than that of the second structure at the other portions.

11. The MEMS device according to claim 8 , wherein

the first structure includes metal, and

the second structure includes silicon.

12. An electronic module comprising the MEMS device according to claim 8 mounted thereon.

13. An electronic apparatus comprising the MEMS device according to claim 8 mounted thereon.

14. A mobile unit comprising the MEMS device according to claim 8 mounted thereon.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2022
From: SEIKO EPSON CORP.
To: COLUMBIA PEAK VENTURES, LLC
Reel/Frame 058952/0475 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2013
From: FURUHATA, MAKOTO; TANAKA, SATORU
To: SEIKO EPSON CORPORATION
Reel/Frame 030797/0178 →