Methods for selectively coating three-dimensional features on a substrate

1. A method for selectively coating three-dimensional features on a substrate, comprising the steps of:

forming a substrate comprising at least the steps of:

forming a sacrificial layer on a template;

subsequently depositing a semiconductor layer on said sacrificial layer;

and

releasing said semiconductor layer from said template along said sacrificial layer;

coating three-dimensional features on said substrate using a liquid transfer coating step for applying a liquid coating material to a predetermined surface of said three-dimensional features on said substrate, comprising at least the steps of:

maintaining a thin sheet of liquid coating material on a plate, comprising at least the steps of:

providing a plate having restrictive flow holes to restrict the refreshing flow rate of liquid coating material and capable of anchoring a thin sheet of liquid coating material in place;

positioning said plate on a reservoir of liquid coating material under constant pressure; and

controlling the volume of said thin sheet of liquid coating material according to the transfer of liquid coating material from said liquid coating material reservoir to said thin sheet of liquid coating material on said plate through said restrictive flow holes;

contacting the substrate surface to be coated with said thin sheet of liquid coating material on said plate.

2. The method for selectively coating three-dimensional features on a substrate of claim 1 , wherein said restrictive flow holes are micromachined restrictive flow holes.

3. The method for selectively coating three-dimensional features on a substrate of claim 1 , wherein said thin sheet of liquid coating material on said plate has a thickness less than 100 μm.

4. The method for selectively coating three-dimensional features on a substrate of claim 1 , wherein said restrictive flow holes have a top diameter less than 100 μm.

5. The method for selectively coating three-dimensional features on a substrate of claim 1 , further comprising:

removing said substrate from said thin sheet of liquid coating material; and

curing the coating material on the substrate.

6. The method for selectively coating three-dimensional features on a substrate of claim 1 , further comprising removing excess liquid coating material on said plate using a squeegee.

7. The method for selectively coating three-dimensional features on a substrate of claim 1 , wherein said substrate is a silicon substrate.

8. The method for selectively coating three-dimensional features on a substrate of claim 1 , wherein said liquid coating material is a dopant.

9. The method for selectively coating three-dimensional features on a substrate of claim 1 , wherein said liquid coating material is a metallization material.

10. The method for selectively coating three-dimensional features on a substrate of claim 1 , wherein said liquid coating material is an etchant.

11. A method for selectively coating three-dimensional features on a substrate, comprising the steps of:

forming a substrate comprising at least the steps of:

forming a sacrificial layer on a template;

subsequently depositing a semiconductor layer on said sacrificial layer; and

releasing said semiconductor layer from said template along said sacrificial layer;

coating three-dimensional features on said substrate using a liquid transfer coating step for applying a liquid coating material to a predetermined surface of said three-dimensional features on said substrate, comprising at least the steps of:

providing a reservoir of a liquid coating material associated with a nozzle, said nozzle having an opening capable of preventing said liquid coating material from flowing out; and

contacting the substrate surface to be coated with the meniscus of liquid coating material at said nozzle.

12. The method for selectively coating three-dimensional features on a substrate of claim 11 , wherein said step of providing a reservoir of a liquid coating material associated with a nozzle comprises the step of controlling said liquid coating material in said reservoir at a specified temperature.

13. The method for selectively coating three-dimensional features on a substrate of claim 11 , wherein said step of contacting the substrate surface to be coated with the meniscus of liquid coating material at said nozzle comprises the step of locally drying said liquid coating material according to an air or gas flow or according to a heating or UV curing device.

14. The method for selectively coating three-dimensional features on a substrate of claim 11 , wherein said nozzle is a vertically adjustable nozzle.

15. The method for selectively coating three-dimensional features on a substrate of claim 11 , wherein said nozzle is a soft flexible nozzle.

16. The method for selectively coating three-dimensional features on a substrate of claim 11 , further comprising curing the coating material on the substrate.

17. The method for selectively coating three-dimensional features on a substrate of claim 11 , wherein said substrate is a silicon substrate.

18. The method for selectively coating three-dimensional features on a substrate of claim 11 , wherein said liquid coating material is a dopant.

19. The method for selectively coating three-dimensional features on a substrate of claim 11 , wherein said liquid coating material is a metallization material.

20. The method for selectively coating three-dimensional features on a substrate of claim 11 , wherein said liquid coating material is an etchant.