IP Library Granted Patent US 9,371,421
Granted Patent B2
US 9,371,421 · App. 13/948,396 · Granted Jun 21, 2016

Crystalline polyamide ester resin, method for preparing the same, and article including the same

Inventors: So Young Kwon (Uiwang-si, KR); Jin Kyu Kim (Uiwang-si, KR); Seung Youb Bang (Uiwang-si, KR); Sang Kyun Im (Uiwang-si, KR); Jin A Je (Uiwang-si, KR); Ki Yon Lee (Uiwang-si, KR); Suk Min Jun (Uiwang-si, KR); Sung Chul Choi (Uiwang-si, KR)
Assignee: Cheil Industries Inc.
C08G69/44C08L67/02C09J177/12
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Quick Facts
Patent No.
US 9,371,421
App. No.
13/948,396
Granted
Jun 21, 2016
Kind
B2
Abstract

A crystalline polyamide ester resin is prepared by copolymerizing (A) a dicarboxylic acid component, (B) a diamine component, and (C) a cyclic aliphatic diol component, and has a structure in which a dicarboxylic acid moiety derived from the dicarboxylic acid component (A), a diamine moiety derived from the diamine component (B) and a cyclic aliphatic diol moiety derived from the cyclic aliphatic diol component (C) are repeated. A molar ratio ((B):(C)) of the diamine component (B) to the cyclic aliphatic diol component (C) is about 80 to about 99:about 1 to about 20. The crystalline polyamide ester resin has a melting point (Tm) ranging from about 280° C. to about 320° C. and a crystallization temperature (Tc) ranging from about 260° C. to about 290° C. The crystalline polyamide ester resin can have excellent heat resistance, discoloration resistance and moldability.

Claims (18)

1. A crystalline polyamide ester resin prepared by copolymerizing (A) a dicarboxylic acid component, (B) a diamine component, and (C) a cyclic aliphatic diol component, the crystalline polyamide ester resin having a structure in which a dicarboxylic acid moiety derived from the dicarboxylic acid component (A), a diamine moiety derived from the diamine component (B) and a cyclic aliphatic diol moiety derived from the cyclic aliphatic diol component (C) are repeated,

wherein a molar ratio of the diamine component (B) to the cyclic aliphatic diol component (C) ((B):(C)) is about 80 to about 99:about 1 to about 20, and

wherein the crystalline polyamide ester resin has a melting point (Tm) ranging from about 280° C. to about 320° C. and a crystallization temperature (Tc) ranging from about 260° C. to about 290° C.

2. The crystalline polyamide ester resin according to claim 1 , wherein the dicarboxylic acid component (A) includes a C 8 to C 20 aromatic dicarboxylic acid component, a C 8 to C 20 cyclic (aliphatic) dicarboxylic acid component, or a combination thereof.

3. The crystalline polyamide ester resin according to claim 1 , wherein the diamine component (B) includes a C 4 to C 20 aliphatic diamine component or a combination thereof.

4. The crystalline polyamide ester resin according to claim 1 , wherein the cyclic aliphatic diol component (C) includes a C 8 to C 20 cyclic aliphatic diol component or a combination thereof.

5. The crystalline polyamide ester resin according to claim 1 , wherein the crystalline polyamide ester resin has a glass transition temperature (Tg) ranging from about 110° C. to about 140° C.

6. The crystalline polyamide ester resin according to claim 1 , wherein the crystalline polyamide ester resin has an enthalpy of fusion ranging from about 40 J/g to about 80 J/g.

7. The crystalline polyamide ester resin according to claim 1 , wherein the crystalline polyamide ester resin has an enthalpy of crystallization ranging from about 40 J/g to about 60 J/g.

8. The crystalline polyamide ester resin according to claim 1 , wherein the crystalline polyamide ester resin has an inherent viscosity from about 0.6 dL/g to about 1.0 dL/g.

9. The crystalline polyamide ester resin according to claim 1 , wherein the crystalline polyamide ester resin has a color variation ΔE of about 10 or less after being left at 200° C. for 1 hour.

10. The crystalline polyamide ester resin according to claim 1 , wherein a terminal group of the crystalline polyamide ester resin is encapsulated by an end-capping agent including an aliphatic carboxylic acid, an aromatic carboxylic acid, or a combination thereof.

11. The crystalline polyamide ester resin according to claim 10 , wherein the end-capping agent includes acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, isobutyric acid, benzoic acid, toluic acid, α-naphthalene carboxylic acid, β-naphthalene carboxylic acid, methylnaphthalene carboxylic acid, or a combination thereof.

12. A method for preparing a crystalline polyamide ester resin, comprising:

copolymerizing (A) a dicarboxylic acid component, (B) a diamine component, and (C) a cyclic aliphatic diol component,

wherein a molar ratio ((B):(C)) of the diamine component (B) to the cyclic aliphatic diol component (C) is about 80 to about 99:about 1 to about 20, and

wherein the crystalline polyamide ester resin has a melting point (Tm) ranging from about 280° C. to about 320° C. and a crystallization temperature (Tc) ranging from about 260° C. to about 290° C.

13. A molded article produced from the crystalline polyamide ester resin according to claim 1 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 042114/0895 →
MERGER Recorded Jul 14, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039360/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2013
From: KWON, SO YOUNG; KIM, JIN KYU; BANG, SEUNG YOUB; IM, SANG KYUN; JE, JIN A; LEE, KI YON; JUN, SUK MIN; CHOI, SUNG CHUL
To: CHEIL INDUSTRIES INC.
Reel/Frame 030856/0169 →
Priority Claims (1)
KR 10-2012-0157671 · Dec 28, 2012 · national
Continuity (1)
Related Publication 20140187739A1 · Jul 3, 2014