RF CMOS transistor design
View Patent ↗An improved RF CMOS transistor design is described. Local, narrow interconnect lines, which are located substantially above the active area of the transistor, are each connected to either a source terminal or a drain terminal. The source and the drain terminal are arranged orthogonally to the local interconnect lines and each terminal is significantly wider than a local interconnect line. In an example, the local interconnect lines are formed in a first metal layer and the source and drain terminals are formed in one or more subsequent metal layers.
1. An RF CMOS transistor, the transistor comprising:
an active area;
a plurality of gate fingers;
a plurality of local interconnect lines constrained substantially to above the active area of the transistor;
a well-tie sharing said active area of the transistor; and
a source terminal and a drain terminal arranged orthogonally to each of the plurality of local interconnect lines, wherein each terminal is electrically connected to at least one local interconnect line wherein the source terminal and the drain terminal are substantially wider than a local interconnect line and the source terminal and drain terminal are routed above the active region, including above the gate fingers.
2. The RF CMOS transistor according to claim 1 , wherein the source terminal and the drain terminal are formed in different metal layers.
3. The RF CMOS transistor according to claim 1 , further comprising a second drain terminal and wherein the drain terminals are arranged either side of the source terminal.
4. The RF CMOS transistor according to claim 1 , further comprising at least one gate strap, and wherein the at least one gate strap is routed in a metal layer above the source and drain terminals substantially across a center of the transistor in parallel with the plurality of gate fingers.
5. The RF CMOS transistor design according to claim 1 , further comprising:
a dummy gate electrode structure; and
a well-tap adjacent to the dummy gate electrode structure,
and wherein the dummy gate electrode structure is electrically connected to the well-tap.
6. The RF CMOS transistor according to claim 1 , wherein a local interconnect line comprises at least one narrow portion adjacent to a wider portion, and wherein only the at least one narrow portion is connected directly to one of a source terminal and a drain terminal by means of at least one via.
7. An RF CMOS transistor design, the transistor design comprising:
a plurality of gate fingers;
a plurality of local interconnect lines constrained substantially to above an active area of the transistor;
a well-tie sharing said active area of the transistor; and
a source terminal and a drain terminal arranged orthogonally to each of the plurality of local interconnect lines, wherein each terminal is electrically connected to at least one local interconnect line;
and wherein the source terminal and the drain terminal are substantially wider than a local interconnect line and the source terminal and the drain terminal are routed above the active region, including above the gate fingers.
8. The RF CMOS transistor design according to claim 7 , wherein the source terminal and the drain terminal are formed in different metal layers.
9. The RF CMOS transistor design according to claim 7 , further comprising a second drain terminal and wherein the drain terminals are arranged either side of the source terminal to reduce susceptibility to damage by electrostatic discharge.
10. The RF CMOS transistor design according to claim 7 , further comprising a gate strap, and wherein the gate strap is routed substantially across the center of the transistor.
11. The RF CMOS transistor design according to claim 7 , further comprising:
a dummy gate electrode structure; and
a well-tap adjacent to the dummy gate electrode structure,
and wherein the dummy gate electrode structure is electrically connected to the well-tap.