Heating unit and heating system using the same
View Patent ↗A heating system is disclosed, which includes a main body having a duct formed therein, an air flowing guiding member, and a heating unit. The duct has an air inlet and an air outlet. The air flowing guiding member is disposed in the duct. The heating unit includes a substrate and a plurality of electronic components disposed on the substrate in a matrix form and embossed from a surface of the substrate, wherein each of the electronic components is capable of individually producing heat to directly heat up the air flowing in the duct. Also a heating system using the heating unit is disclosed.
1. A heating unit, comprising:
a substrate; and
a plurality of electronic components, disposed on the substrate in a matrix form and embossed from a surface of the substrate, wherein each of the plurality of electronic components is capable of individually producing heat to directly heat up air around the electronic components;
wherein the substrate comprises a printed circuit board which has a first edge and a second edge, and the plurality of electronic components is arranged on the printed circuit board along a direction from the first edge to the second edge; and
wherein the plurality of electronic components has different heating powers, and along the direction from the first edge to the second edge the heating powers are adaptively adjusted according to heating requirements.
2. The heating unit as claimed in claim 1 , wherein the plurality of electronic components is disposed on the substrate in an erected manner.
3. The heating unit as claimed in claim 1 , wherein the plurality of electronic components is disposed on the substrate in a lying manner.
4. The heating unit as claimed in claim 1 , wherein the plurality of electronic components is resistor elements.
5. A heating system, comprising:
a main body, having a duct with an air inlet and an air outlet;
an airflow guiding member, disposed in the duct and configured to activate air flow in the duct to flow; and
a heating unit, comprising:
a substrate; and
a plurality of electronic components, disposed on the substrate in a matrix form and embossed from a surface of the substrate, wherein each of the plurality of electronic components is capable of individually producing heat to directly heat up air flowing in the duct;
wherein the substrate comprises a printed circuit board which has a first edge and a second edge, wherein the second edge is close to the air outlet relative to the first edge, and the plurality of electronic components is arranged on the printed circuit board along a direction from the first edge to the second edge.
6. The heating system as claimed in claim 5 , wherein the duct comprises a sidewall located between the airflow guiding member and the air outlet, and an opening is disposed on the sidewall, wherein the plurality of electronic components is disposed into the duct via the opening.
7. The heating system as claimed in claim 5 , wherein the plurality of electronic components has different heating powers, and along the direction from the first edge to the second edge the heating power of each of the plurality of electronic components increases.
8. The heating system as claimed in claim 5 , wherein the plurality of electronic components has different heating powers, and along the direction from the first edge to the second edge the heating powers are adaptively adjusted according to heating requirements.
9. A heating unit, comprising:
a substrate; and
a plurality of electronic components, disposed on the substrate in a matrix form and embossed from a surface of the substrate, wherein each of the plurality of electronic components is capable of individually producing heat to directly heat up air around the electronic components;
wherein the substrate comprises a printed circuit board which has a first edge and a second edge, and the plurality of electronic components is arranged on the printed circuit board along a direction from the first edge to the second edge; and
wherein the plurality of electronic components has different heating powers, and along the direction from the first edge to the second edge the heating power of each of the plurality of electronic components increases.
10. The heating unit as claimed in claim 9 , wherein the plurality of electronic components is disposed on the substrate in an erected manner.
11. The heating unit as claimed in claim 9 , wherein the plurality of electronic components is disposed on the substrate in a lying manner.
12. The heating unit as claimed in claim 9 , wherein the plurality of electronic components is resistor elements.