Optical lithography using graphene contrast enhancement layer
View Patent ↗Technologies are generally described for methods, systems, and structures that include patterns formed by optical lithography. In some example methods, a photoresist layer is applied to a substrate, and a grapheme layer can be applied to the photoresist layer. Light can be applied through a mask to the graphene layer, where the mask includes a pattern. The light can form the pattern on the graphene layer such that the pattern forms on the photoresist layer.
1. A system effective to form a structure, the system comprising:
a processor;
a light source arranged in communication with the processor;
a mask, wherein the mask includes a pattern;
a substrate;
a photoresist layer on the substrate; and
a graphene layer on the photoresist layer;
wherein the processor is configured effective to:
apply light through the mask to the graphene layer, wherein the light is effective to form the pattern on the photoresist layer though the graphene layer; and
remove the graphene layer from the photoresist layer with use of a dry etching technique.
2. The system as recited in claim 1 , further comprising an optical system disposed between the mask and the graphene layer, wherein the optical system is configured effective to refract the light and change a magnification of the pattern between the mask and the substrate.
3. The system as recited in claim 1 , further comprising:
a first table, wherein the mask is disposed on the first table;
a second table, wherein the substrate is disposed on the second table; and
wherein the first table is movable with respect to the second table.
4. The system as recited in claim 3 , wherein:
the processor is arranged in communication with the first table and the second table; and
the processor is configured effective to control the first table to move with respect to the second table.
5. The system as recited in claim 1 , wherein the light source is effective to output light with a wavelength of about 157 nm.
6. The system as recited in claim 1 , wherein the light source is effective to output light with a wavelength of about 193.
7. The system as recited in claim 1 , wherein the light source is effective to output light with a wavelength of about 12 m.
8. The system as recited in claim 1 , wherein the photoresist includes a silylating agent.
9. The system as recited in claim 1 , wherein:
the graphene layer has a first width and a first length;
the photoresist layer has a second width and a second length;
the first width is substantially equal to the second width; and
the first length is substantially equal to the second length.
10. The system as recited in claim 1 , wherein the graphene layer has a height of about one atom.
11. The system as recited in claim 1 , wherein the graphene layer is effective to absorb at least some of the light to function as an antireflective layer.
12. The system as recited in claim 1 , wherein the graphene layer includes a bandgap of approximately 0.1 EV.
13. The system as recited in claim 1 , wherein the processor is further effective to control application of an oxygen plasma to the graphene layer, wherein the oxygen plasma is effective to remove the graphene layer.
14. The system as recited in claim 1 , wherein:
the graphene layer has a first width and a first length;
the photoresist layer has a second width and a second length;
the first width is substantially equal to the second width;
the first length is substantially equal to the second length; and
the graphene layer has a height of about one atom.
15. The system as recited in claim 1 , wherein the graphene layer is effective to absorb at least some of the light to function as an antireflective layer and the graphene layer includes a bandgap of approximately 0.1 EV.
16. A structure comprising:
a substrate;
a patterned photoresist layer on the substrate; and
an exposed graphene layer on the patterned photoresist layer, wherein the patterned photoresist layer is formed by application of a light through a mask that includes the pattern and application of the light through the exposed graphene layer prior to removal of the exposed graphene from the photoresist layer with use of a dry etching technique.
17. The structure as recited in claim 16 , wherein the substrate includes a silylating agent.
18. The structure as recited in claim 16 , wherein:
the graphene layer has a first width and a first length;
the photoresist layer has a second width and a second length;
the first width is substantially equal to the second width; and
the first length is substantially equal to the second length.
19. The structure as recited in claim 18 , wherein the graphene layer has a height of about one atom.
20. The structure as recited in claim 16 , wherein the dry etching technique includes application of an oxygen plasma to the exposed graphene layer, wherein the oxygen plasma is effective to remove the graphene layer.
21. A system effective to form a structure, the system comprising:
a processor;
a light source arranged in communication with the processor; and
a mask, wherein the mask includes a pattern;
wherein the processor is configured effective to:
apply light through the mask to a graphene layer, wherein the light is effective to form the pattern on a photoresist layer though the graphene layer; and
remove the graphene layer from the photoresist layer with use of a dry etching technique.